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HS Code |
245942 |
| Appearance | Pale yellow to amber granules or pellets |
| Base Polymer | Copolyamide |
| Melting Point | 90°C to 130°C |
| Softening Point | 100°C to 160°C |
| Viscosity | 1,000 to 10,000 mPa·s at 160°C |
| Density | 0.98 to 1.02 g/cm³ |
| Open Time | 10 seconds to 2 minutes |
| Setting Time | 1 to 15 seconds |
| Tensile Strength | 10 to 35 MPa |
| Elongation At Break | 200% to 500% |
| Solvent Resistance | Good |
| Thermal Stability | High |
| Shelf Life | 12 to 24 months |
| Activation Temperature | 100°C to 120°C |
| Storage Conditions | Cool, dry place, away from direct sunlight |
As an accredited Copolyamide Hot Melt Adhesive factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | The Copolyamide Hot Melt Adhesive is packaged in 25 kg kraft paper bags, tightly sealed to ensure moisture protection and safe transport. |
| Shipping | Copolyamide Hot Melt Adhesive is typically shipped in solid pellet or powder form, securely packaged in moisture-resistant bags or drums. Containers are clearly labeled, and shipment adheres to standard chemical handling protocols. The adhesive is considered non-hazardous, but storage in a cool, dry place away from direct sunlight is recommended. |
| Storage | Copolyamide Hot Melt Adhesive should be stored in a cool, dry, and well-ventilated area, away from direct sunlight and sources of heat or ignition. Keep the adhesive in its original, tightly sealed packaging to prevent contamination and moisture absorption. Ideal storage temperatures are generally between 5°C and 35°C. Avoid freezing, and store away from incompatible materials such as strong oxidizers. |
Applications of Copolyamide Hot Melt Adhesive in Industrial ManufacturingCopolyamide hot melt adhesive serves specialized bonding and laminating functions across various mature industrial manufacturing fields. As a direct manufacturer, we support precise integration into downstream customers' continuous and batch processes, with proven performance in sectors demanding detailed compliance, controlled formulation, and repeatable production quality. 1. Automotive Interior Trim BondingCopolyamide hot melts are applied extensively in automotive interior assembly lines for lamination and assembly of multilayer structures, such as headliners, door panels, and seat upholstery. The adhesive’s tailored setting time and thermal resistance allow easy processing on high-speed lamination machines and automated assembly robots. Automotive OEMs choose this material for its reliability during temperature cycling and low emission behavior under interior environmental control requirements. Industry compliance standards
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2. Technical Textile LaminationIndustrial textile manufacturers rely on copolyamide hot melt technology for the continuous lamination of filter media, garment interlinings, and performance foils. The adhesive’s chemical structure minimizes migration, supports breathability, and provides targeted adhesion to synthetic and blended substrates. Integration into high-speed textile lines boosts throughput while supporting stringent product performance testing. Industry compliance standards
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3. Shoe Upper and Insole AssemblyShoe factories use copolyamide hot melt adhesives in insole bonding, reinforcement, and upper-to-sole attachment. The fast-setting property allows rapid assembly and improved dimensional retention, supporting both hand assembly and robotic cell production. Industry QC teams monitor precise bead or film thickness to meet durability requirements over repeated flex cycles and environmental exposure during wear. Industry compliance standards
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4. Electronics Component Encapsulation and AssemblyElectronic parts producers apply copolyamide hot melts for overmolding, wire harness sealing, and PCB component positioning. The adhesive’s electrically insulating property and resistance to moisture ingress enable consistent process parameters for long-term product reliability. Operators deploy precise metering systems to avoid overflow and guarantee secure fixture within the electronic assembly cycle. Industry compliance standards
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5. Packaging and BookbindingIndustrial-scale packagers and bookbinders use copolyamide-based hot melts for high-speed carton sealing, spine gluing, and specialty packaging structures. The adhesive’s controlled open time and low odor emission allow for minimal line stops and strict visual quality checks. Manufacturing engineers set film thickness to ensure box integrity and page hold against mechanical or thermal stress during transport and use. Industry compliance standards
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Competitive Copolyamide Hot Melt Adhesive prices that fit your budget—flexible terms and customized quotes for every order.
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Tel: +8615371019725
Email: admin@sinochem-nanjing.com
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