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Copolyamide Hot Melt Adhesive

    • Product Name Copolyamide Hot Melt Adhesive
    • Alias PA Hot Melt
    • Einecs 500-200-6
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    VTB
    Specifications

    HS Code

    245942

    Appearance Pale yellow to amber granules or pellets
    Base Polymer Copolyamide
    Melting Point 90°C to 130°C
    Softening Point 100°C to 160°C
    Viscosity 1,000 to 10,000 mPa·s at 160°C
    Density 0.98 to 1.02 g/cm³
    Open Time 10 seconds to 2 minutes
    Setting Time 1 to 15 seconds
    Tensile Strength 10 to 35 MPa
    Elongation At Break 200% to 500%
    Solvent Resistance Good
    Thermal Stability High
    Shelf Life 12 to 24 months
    Activation Temperature 100°C to 120°C
    Storage Conditions Cool, dry place, away from direct sunlight

    As an accredited Copolyamide Hot Melt Adhesive factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The Copolyamide Hot Melt Adhesive is packaged in 25 kg kraft paper bags, tightly sealed to ensure moisture protection and safe transport.
    Shipping Copolyamide Hot Melt Adhesive is typically shipped in solid pellet or powder form, securely packaged in moisture-resistant bags or drums. Containers are clearly labeled, and shipment adheres to standard chemical handling protocols. The adhesive is considered non-hazardous, but storage in a cool, dry place away from direct sunlight is recommended.
    Storage Copolyamide Hot Melt Adhesive should be stored in a cool, dry, and well-ventilated area, away from direct sunlight and sources of heat or ignition. Keep the adhesive in its original, tightly sealed packaging to prevent contamination and moisture absorption. Ideal storage temperatures are generally between 5°C and 35°C. Avoid freezing, and store away from incompatible materials such as strong oxidizers.
    Application of Copolyamide Hot Melt Adhesive

    Applications of Copolyamide Hot Melt Adhesive in Industrial Manufacturing

    Copolyamide hot melt adhesive serves specialized bonding and laminating functions across various mature industrial manufacturing fields. As a direct manufacturer, we support precise integration into downstream customers' continuous and batch processes, with proven performance in sectors demanding detailed compliance, controlled formulation, and repeatable production quality.

    1. Automotive Interior Trim Bonding

    Copolyamide hot melts are applied extensively in automotive interior assembly lines for lamination and assembly of multilayer structures, such as headliners, door panels, and seat upholstery. The adhesive’s tailored setting time and thermal resistance allow easy processing on high-speed lamination machines and automated assembly robots. Automotive OEMs choose this material for its reliability during temperature cycling and low emission behavior under interior environmental control requirements.

    Industry compliance standards

    • VDA 278 (thermal desorption for VOC and FOG emissions)
    • ISO 3795 (burning behavior of materials)
    • TS 16949 (automotive quality management systems)
    • OEM-specific “Low Fog” and odor standards

    Typical usage ratio

    • 30–60 g/m2 adhesive coat weight for fabric and foam laminations
    • Ratio adjusted based on substrate porosity, application speed, and lamination temperature (usually 100–150°C)

    Downstream process integration

    • In-line curtain coating or dot application onto textiles
    • Roller or press lamination to affix layers under controlled pressure
    • Integration before cutting/trimming operations

    Final product types

    • Vehicle headliners
    • Side door panels
    • Seat cushion covers
    • Interior trim assemblies

    2. Technical Textile Lamination

    Industrial textile manufacturers rely on copolyamide hot melt technology for the continuous lamination of filter media, garment interlinings, and performance foils. The adhesive’s chemical structure minimizes migration, supports breathability, and provides targeted adhesion to synthetic and blended substrates. Integration into high-speed textile lines boosts throughput while supporting stringent product performance testing.

    Industry compliance standards

    • Oeko-Tex Standard 100 (textile health safety)
    • ISO 9001 (textile plant quality system)
    • REACH Regulation (EC) No 1907/2006 (chemical safety)
    • EN 14362-1 (textile azo dye content)

    Typical usage ratio

    • 15–40 g/m2 for technical textile lamination
    • Dependent on textile type, basis weight, and mechanical strength requirements

    Downstream process integration

    • Hot melt granulate or web dosing onto moving fabric lines
    • Pressure and heat lamination under continuous roll or platen systems
    • Subsequent calendaring or perforation for breathability modifications

    Final product types

    • Industrial filter fabrics
    • Laminated garment interlinings
    • Bedding composites
    • Medical support textiles

    3. Shoe Upper and Insole Assembly

    Shoe factories use copolyamide hot melt adhesives in insole bonding, reinforcement, and upper-to-sole attachment. The fast-setting property allows rapid assembly and improved dimensional retention, supporting both hand assembly and robotic cell production. Industry QC teams monitor precise bead or film thickness to meet durability requirements over repeated flex cycles and environmental exposure during wear.

    Industry compliance standards

    • ISO 20871 (footwear bond strength)
    • ISO 17709 (shoe material specification)
    • EN 20345 (safety footwear requirements)
    • Restricted Substance List (major brand RSLs, e.g., Nike, Adidas)

    Typical usage ratio

    • 5–25 g per pair for insole/upper bonding
    • Adhesive amount varies with upper material (leather, fabric, synthetic), and thickness specification

    Downstream process integration

    • Direct melt bead, roll, or film application
    • Upping and sole-sticking stations on automated shoe assembly lines
    • Heat activation prior to pressing and shaping

    Final product types

    • Athletic footwear
    • Safety shoes
    • Fashion and casual shoes
    • Orthopedic insoles

    4. Electronics Component Encapsulation and Assembly

    Electronic parts producers apply copolyamide hot melts for overmolding, wire harness sealing, and PCB component positioning. The adhesive’s electrically insulating property and resistance to moisture ingress enable consistent process parameters for long-term product reliability. Operators deploy precise metering systems to avoid overflow and guarantee secure fixture within the electronic assembly cycle.

    Industry compliance standards

    • IPC-A-610 (Acceptability of Electronic Assemblies)
    • UL 94 V-0 (flammability testing for plastics)
    • RoHS Directive 2011/65/EU (lead and hazardous substance limitation)
    • IEC 60695 (fire hazard testing)

    Typical usage ratio

    • 0.2–1.2 g per PCB component or cable fix
    • Quantity determined by cavity volume and required encapsulation thickness

    Downstream process integration

    • Direct injection into molds around cables and connectors
    • Spot or line dispensing on PCB for component stabilization
    • Integration after soldering, before final inspection/assembly

    Final product types

    • Wire harness assemblies
    • PCB modules
    • Small-scale electrical connectors
    • Consumer electronics enclosures

    5. Packaging and Bookbinding

    Industrial-scale packagers and bookbinders use copolyamide-based hot melts for high-speed carton sealing, spine gluing, and specialty packaging structures. The adhesive’s controlled open time and low odor emission allow for minimal line stops and strict visual quality checks. Manufacturing engineers set film thickness to ensure box integrity and page hold against mechanical or thermal stress during transport and use.

    Industry compliance standards

    • FDA 21 CFR 175.105 (adhesives for indirect food contact)
    • EN 643 (packaging papers and boards)
    • ISO 12647 (printing process control in bookbinding)
    • PAT (Photographic Activity Test) for archival materials

    Typical usage ratio

    • 2–10 g per book spine; 6–12 g/m2 for carton sealing seams
    • Range set by material absorbency and required setting strength

    Downstream process integration

    • Automated hot melt extrusion onto spine or carton flaps
    • Rapid set and cooling via conveyor-driven press stations
    • Forming, pressing, and cooling before stacking or final QC

    Final product types

    • Hardcover and paperback books
    • High-value packaging boxes
    • Luxury brand cartons
    • Archival paper products
    Free Quote

    Competitive Copolyamide Hot Melt Adhesive prices that fit your budget—flexible terms and customized quotes for every order.

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    Email: admin@sinochem-nanjing.com

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    Certification & Compliance