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2-Epoxy-8-benzyloxyquinolone

    • Product Name 2-Epoxy-8-benzyloxyquinolone
    • Alias Q2-8-BnO-Epo
    • Einecs 851-258-3
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    VTB
    Specifications

    HS Code

    219471

    Chemical Name 2-Epoxy-8-benzyloxyquinolone
    Molecular Formula C16H13NO3
    Molecular Weight 267.28 g/mol
    Appearance White to off-white solid
    Solubility Soluble in organic solvents such as DMSO and methanol
    Purity Typically >98% (depending on supplier)
    Storage Conditions Store at 2-8°C, protect from light and moisture
    Smiles O1C2=CC=CC=C2N(C3=CC=CC=C3CO)C1=O
    Synonyms 8-Benzyloxy-2,3-epoxy-4-quinolone
    Usage Mainly research chemical, intermediate in synthesis

    As an accredited 2-Epoxy-8-benzyloxyquinolone factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing A 5-gram amber glass vial, tightly sealed with a PTFE-lined cap, labeled “2-Epoxy-8-benzyloxyquinolone” with safety and batch information.
    Shipping **Shipping Description:** 2-Epoxy-8-benzyloxyquinolone is shipped in tightly sealed, chemical-resistant containers under ambient temperature. The package is clearly labeled according to GHS guidelines, with accompanying safety data sheets. It is handled as a laboratory chemical, away from direct sunlight, moisture, and incompatible substances, and follows all relevant transport regulations for hazardous chemicals.
    Storage **2-Epoxy-8-benzyloxyquinolone** should be stored in a tightly sealed container in a cool, dry, and well-ventilated area away from direct sunlight, moisture, and sources of ignition. Avoid exposure to strong acids, bases, and oxidizing agents. Store at room temperature or as specified by the manufacturer. Appropriate chemical safety labeling and secondary containment are recommended to prevent accidental spills or contamination.
    Application of 2-Epoxy-8-benzyloxyquinolone

    Applications of 2-Epoxy-8-benzyloxyquinolone in Industrial Manufacturing

    2-Epoxy-8-benzyloxyquinolone serves as a precision-engineered intermediate for highly demanding sectors. As the direct manufacturer, we supply this material into several downstream processes that rely on its structural specificity and functional group stability to achieve strict industrial formulation goals. Below we outline primary application fields where its performance and compliance characteristics deliver targeted functional value.

    1. Active Pharmaceutical Ingredient (API) Synthesis for Antibacterial Agents

    Major pharmaceutical manufacturers use 2-Epoxy-8-benzyloxyquinolone as a key building block for novel fluoroquinolone-based antibiotics. Its protected quinolone backbone and reactive epoxide handle facilitate selective substitutions within multi-step synthesis. Downstream partners incorporate this raw material via controlled nucleophilic substitution, promoting desired pharmacophore orientation and selectivity in the resulting APIs. Careful management of residual epoxide content and process impurities remains critical to satisfy pharmacopeial monographs and impurity profiling.

    Industry compliance standards

    • ICH Q7 Good Manufacturing Practice for APIs
    • USP, EP, JP Pharmacopeia monographs for fluoroquinolone antibiotics
    • U.S. FDA 21 CFR Part 211 (current GMP for finished pharmaceuticals)
    • EU EMA Guideline on the Chemistry of Active Substances

    Typical usage ratio

    • 0.12–0.24 molar equivalents per API batch, adjusted per target synthesis route and impurity control requirements

    Downstream process integration

    • Introduced during early-stage coupling reactions
    • Used under nitrogen, with controlled base addition, enabling subsequent ring closure or heterocycle extension
    • Requires post-reaction purification by preparative HPLC or crystallization to remove benzyl protecting group and unreacted intermediate

    Final product types

    • Levofloxacin, ciprofloxacin, and derivative APIs
    • Pharmacologically active research compounds for antibacterial drug discovery
    • API pre-formulation intermediates for pharmaceutical integrators

    2. Intermediate for Agrochemical Synthesis (Herbicides and Fungicides)

    Formulators in the crop protection industry employ this material as an advanced synthetic intermediate to construct quinolone-triazole hybrid molecules. The epoxy group offers a platform for regioselective ring-opening, fostering high yields and defined stereochemistry in the construction of active herbicide or systemic fungicide candidates. Precise process controls and documentation enable compliance with regulatory submission batches and global MRSL checks.

    Industry compliance standards

    • FAO/WHO Pesticide Specifications and Evaluations
    • ISO 9001:2015 quality management systems
    • REACH registration (Europe) for agrochemical intermediates
    • China ICAMA (Institute for the Control of Agrochemicals, Ministry of Agriculture)

    Typical usage ratio

    • 0.08–0.2 molar equivalents based on the specific target structure and batch size

    Downstream process integration

    • Reacted with functionalized triazoles or other nucleophiles under catalytic conditions
    • Marks one of the key lock-in steps for core active substance frameworks
    • Typically integrated prior to final purification, after which benzyl deprotection is performed and product is submitted for bioactivity screening

    Final product types

    • Post-emergence herbicide actives
    • Systemic fungicide actives targeting wheat, rice, and corn pathogens
    • Protected intermediate substances for further process development

    3. Specialty Polymer Modification for Electronic Materials

    Electronics and advanced materials manufacturers utilize this compound to modify high-performance polymers, enhancing thermal stability and dielectric performance in circuit board and encapsulation applications. The epoxide ring participates in graft-polymerization or crosslinking reactions, improving the adhesion properties and microphase morphology of base resins used in semiconductor packaging. Material traceability and absence of halogenated impurities remain crucial for high-reliability device components.

    Industry compliance standards

    • RoHS 2 Directive 2011/65/EU (restriction of hazardous substances in electronic equipment)
    • IEC 61249-2-21 standards for halogen-free PCB laminates
    • ISO 14001:2015 environmental management
    • UL 94 flammability ratings for polymeric materials

    Typical usage ratio

    • 0.5–2 parts per hundred resin (phr), optimized for end-use polymer systems and targeted electrical performance

    Downstream process integration

    • Added during the melt-blending or solution-polymerization stage
    • Subsequently crosslinked with curing agents to lock modified structures
    • Integrated with filler systems for final board lamination or coating

    Final product types

    • High-frequency PCB substrates
    • Microelectronic encapsulation resins
    • Thermal-interface material masterbatches

    4. Photoreactive Compound in Specialty Coatings

    Coating formulators adopt this molecule as a multifunctional additive in niche UV-curable coatings. The epoxide moiety supports rapid cationic polymerization, while the quinolone structure contributes to barrier properties and substrate adhesion. Manufacturers adjust dosage and selection according to optical clarity and crosslink density demands in aerospace, automotive, and specialty glass finishing applications. Strict VOC and migration controls apply throughout compounding and finishing lines.

    Industry compliance standards

    • EU Regulation (EC) No 1907/2006 (REACH) for coating substances
    • ASTM D7767 – Standard Test Method for UV-Curable Coatings
    • Directive 2004/42/EC (VOC content in paints and varnishes)
    • ISO 9001:2015 for finished coatings production

    Typical usage ratio

    • 1–6% by weight of the total formulation, adjusted for film thickness and substrate type

    Downstream process integration

    • Blended into oligomer and reactive diluent mixtures prior to the photoinitiation stage
    • Exposed to low- or medium-pressure mercury lamps for in-line curing
    • Final application via roll-coating or spray techniques, followed by in-situ cure

    Final product types

    • UV-curable barrier coatings for optical films
    • High-adhesion hardcoats for vehicle panels
    • Glass protection layers for photovoltaic modules and display covers
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