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Triphenylvinylsilane

    • Product Name Triphenylvinylsilane
    • Alias TPS
    • Einecs 207-453-8
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    VTB
    Specifications

    HS Code

    703634

    Cas Number 2442-43-5
    Molecular Formula C26H22Si
    Molar Mass 362.54 g/mol
    Appearance White to off-white powder
    Melting Point 163-166 °C
    Density 1.13 g/cm³
    Solubility In Water Insoluble
    Refractive Index 1.667
    Structure Triphenylvinylsilane consists of a silicon atom bonded to a vinyl group and three phenyl groups
    Synonyms Vinyldiphenylsilane, Tetraphenylsilane analog
    Purity Typically ≥98%
    Storage Conditions Store in a cool, dry, well-ventilated place, away from moisture

    As an accredited Triphenylvinylsilane factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Triphenylvinylsilane, 25g, is packaged in a clear, sealed glass bottle with a screw cap, labeled with hazard warnings.
    Shipping Triphenylvinylsilane should be shipped in tightly sealed containers, protected from moisture and direct sunlight. Store and transport under ambient temperature conditions, complying with relevant chemical regulations. Ensure containers are clearly labeled and handled by trained personnel, using appropriate protective equipment to prevent exposure. Avoid contact with strong oxidizing agents during transit.
    Storage Triphenylvinylsilane should be stored in a cool, dry, and well-ventilated area, away from sources of ignition and incompatible materials such as strong oxidizers. Keep the container tightly closed and protect it from moisture and direct sunlight. Store under inert gas if possible to prevent hydrolysis. Ensure proper labeling and restrict access to trained personnel.
    Application of Triphenylvinylsilane

    Applications of Triphenylvinylsilane in Industrial Manufacturing

    Triphenylvinylsilane finds application across advanced industrial areas due to its unique silicon aromatic structure, reactivity, and compatibility with various polymerization and formulation processes. Our factory supports downstream manufacturers with consistent quality and technical recommendations tailored for precise sector use. Below are major industrial application scenarios validated by active market demand.

    1. High-Performance OLED Material Synthesis

    In the production of organic light-emitting diodes (OLEDs), Triphenylvinylsilane serves as a key silicon-based building block for blue-emitting and charge-transport layers. Downstream manufacturers incorporate it into custom molecular frameworks to enhance film stability, tune energy gaps, and improve luminescence decay profiles. Carefully controlled process parameters and batch QC are necessary to avoid performance failure under continuous electrical stress.

    Industry compliance standards

    • IEC 62341 (OLED products – Performance and safety)
    • RoHS Directive (2011/65/EU and amendments)
    • REACH (EC 1907/2006) registration
    • IECQ QC 080000 (Hazardous Substance Process Management System)

    Typical usage ratio

    • 5-18 mol% of total silicon-based monomer content in emission layer formulations
    • Adjustment depends on charge carrier balance and target emission wavelength
    • Formulated with dopants, hosts, and co-monomers specific to device stack

    Downstream process integration

    • Entry during core organic synthesis for emitter or host molecules
    • Purification via HPLC or sublimation prior to thin-film fabrication
    • Solution processing or vacuum deposition into device stacks
    • In-line testing for photoluminescence and device stability

    Final product types

    • OLED display modules for smartphones and TVs
    • Flexible lighting panels
    • Wearable device display components
    • Automotive instrument displays

    2. Advanced Polysiloxane Polymer Modifier

    Triphenylvinylsilane is widely adopted in polysiloxane modification for specialty elastomers and resins, where it introduces phenyl groups for higher refractive index and thermal performance. Compounders employ controlled hydrosilylation or condensation routes to achieve uniform distribution and prevent premature crosslinking, critical for downstream electronic encapsulants and optoelectronic adhesives.

    Industry compliance standards

    • ISO 10993-5 (Cytotoxicity for electronic/medical-grade silicones)
    • UL 94 (Flame retardancy of polymeric materials)
    • IEC 61189 (Printed circuit board material)
    • RoHS and SVHC guidelines

    Typical usage ratio

    • 2-15 wt% relative to base dimethylsiloxane backbone
    • Higher ratios for thermal and optical applications
    • Level selected based on target flexibility and final cure requirements

    Downstream process integration

    • Incorporation during prepolymer synthesis before catalyst addition
    • Reactive blending at 70–120°C under nitrogen or inert atmosphere
    • Molecular weight and crosslink analysis conducted prior to molding
    • Post-cure aging for enhanced stability

    Final product types

    • Optical encapsulants for LEDs and semiconductors
    • High-transparency silicone adhesives
    • Protective conformal coatings for electronics
    • Thermal interface materials

    3. Photoinitiator and UV-Curable Resin Component

    Triphenylvinylsilane contributes to UV-curable resins as a reactive co-monomer or photoinitiator component, especially where higher refractive index, hardness, and silicone compatibility are required. Formulators benefit from its aromatic-silicon bonds, which enhance cure depth, reduce yellowing, and maintain mechanical strength in coatings and 3D printing resins under high-power UV exposure.

    Industry compliance standards

    • ISO 17025 (Analytical testing for UV-cured products)
    • EN 71-3 (Safety for toy applications)
    • California Prop 65 (Safe chemical use in industrial coatings)
    • ASTM D7767 (UV curable plastic testing)

    Typical usage ratio

    • 3-12 wt% of total resin mix, tailored for desired cure profile
    • Lower levels for topcoats, higher in bulk or 3D-printed layers
    • Dosage balanced with conventional (meth)acrylate or silane monomers

    Downstream process integration

    • Addition to pre-formulated resin immediately before photoinitiator
    • Mixing under light exclusion, monitored for homogeneity
    • Application by spray, blade, or vat processes
    • Curing under 365–405 nm UV sources, with in-line hardness checks

    Final product types

    • UV-curable industrial coatings for electronics
    • 3D printing resins for prototyping and tooling
    • Protective hardcoats for optical films
    • Ink formulations for touch panels

    4. Specialty Silane Coupling Agent for Functional Ceramics

    In technical ceramics, Triphenylvinylsilane acts as a surface modifier and coupling agent, improving compatibility between inorganic fillers and organic polymer matrices. Ceramics producers use it to enhance interfacial bonding, raise mechanical integrity, and impart higher hydrophobicity, especially for advanced composite insulators and high-frequency dielectric applications.

    Industry compliance standards

    • ISO 13006 (Ceramic tiles – Product specification for industrial ceramic composites)
    • ASTM D5752 (Surface treatment of filler materials)
    • IEEE C57.12.01 (High-voltage insulator materials)
    • RoHS Directive and SVHC lists

    Typical usage ratio

    • 0.3–1.5 wt% relative to total filler material
    • Exact dosage depends on particle size and surface area of ceramics
    • Optimization through comparative interfacial testing

    Downstream process integration

    • Surface treatment of ceramic powders by wet or dry silanization
    • Post-treatment drying and dispersion before blending with polymers
    • Quality control by FT-IR or SEM for coverage verification
    • Final composite molding, sintering, or extrusion

    Final product types

    • Composite dielectrics for RF and microwave components
    • Ceramic-filled plastics for high-voltage insulators
    • Engineered boards for electronic substrates
    • Chemical-resistant ceramic coatings
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