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N,N-Dimethyl Methanesulfonamide

    • Product Name N,N-Dimethyl Methanesulfonamide
    • Alias DMSO2
    • Einecs 214-637-5
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
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    Specifications

    HS Code

    897659

    Chemicalname N,N-Dimethyl Methanesulfonamide
    Casnumber 13313-03-8
    Molecularformula C3H9NO2S
    Molecularweight 123.17 g/mol
    Appearance Colorless to pale yellow liquid
    Boilingpoint 235-240°C
    Meltingpoint -30°C
    Density 1.09 g/cm³
    Refractiveindex 1.434-1.438
    Solubility Miscible with water
    Flashpoint 114°C
    Purity Typically ≥98%
    Storagetemperature Room temperature
    Odor Slightly amine-like
    Synonyms Methanesulfonic acid N,N-dimethylamide

    As an accredited N,N-Dimethyl Methanesulfonamide factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing N,N-Dimethyl Methanesulfonamide is supplied in a 100g amber glass bottle with a secure screw cap and safety labeling.
    Shipping N,N-Dimethyl Methanesulfonamide should be shipped in tightly sealed containers, protected from moisture and incompatible substances. The package must comply with local, national, and international regulations, including labeling and documentation for chemical transport. Handle with care, store in a cool, dry place, and avoid physical damage during transit.
    Storage N,N-Dimethyl Methanesulfonamide should be stored in a tightly closed container in a cool, dry, well-ventilated area, away from heat, ignition sources, and incompatible materials such as strong oxidizers. It should be protected from direct sunlight and moisture. Proper chemical storage protocols, including labeling and secondary containment, must be followed to prevent leaks, spills, and accidental exposure.
    Application of N,N-Dimethyl Methanesulfonamide

    Applications of N,N-Dimethyl Methanesulfonamide in Industrial Manufacturing

    N,N-Dimethyl Methanesulfonamide (DMMS) finds sustained demand in select industrial sectors due to its distinctive solvency, polarity, and thermal stability features. As the original manufacturer actively supplying high-purity DMMS to global factories, we serve downstream formulations that require consistent solubilization performance and process reliability. The following application scenarios reflect the material’s actual industrial usage, with comprehensive focus on downstream integration, formulation guidelines, and end-product requirements.

    1. Lithium Battery Electrolyte Additive

    In the lithium-ion battery industry, DMMS supports cell safety and extended cycle life by acting as a high-permittivity co-solvent for advanced electrolyte systems. Its inclusion enables stable lithium salt dissolution and reduces solvent decomposition at elevated voltages, directly contributing to enhanced battery durability. Precise adjustment of DMMS dosage responds to cell chemistry and pack configuration, ensuring both compliance and optimal performance in automotive and stationary energy storage.

    Industry compliance standards

    • IEC 62660 (Secondary lithium cells for the propulsion of electric road vehicles)
    • UL 2580 (Battery packs for electric vehicles)
    • Chinese National Standard GB/T 31485 (Safety requirements for lithium-ion batteries and packs)
    • ISO 9001:2015 (Quality Management for manufacturing consistency)

    Typical usage ratio

    • 1–8% by weight in total electrolyte solution; ratio depends on lithium salt (LiPF6, LiTFSI) concentration and use temperature range

    Downstream process integration

    • Added directly into electrolyte premix during solvent blending stage, before addition of conductive salts and functional additives

    Final product types

    • Automotive traction batteries (electric vehicles, hybrid vehicles)
    • Stationary energy storage battery modules
    • Consumer device batteries (laptops, power tools, smartphones)

    2. API Crystallization Solvent in Pharmaceutical Synthesis

    DMMS figure prominently as a selective crystallization solvent during Active Pharmaceutical Ingredient (API) purification, especially for intermediates sensitive to traditional polar aprotic reagents. Its low impurity profile and high chemical stability reduce the risk of unwanted by-product formation, ensuring tight control over crystal habit and polymorphism in accordance with pharmacopeial specifications. Downstream processors select DMMS based on batch size, target API, and solubility in post-filtration washes.

    Industry compliance standards

    • ICH Q7 (GMP for active pharmaceutical ingredients)
    • USP <467> (Residual Solvents in Pharmaceuticals)
    • Ph. Eur. 5.4 (Solvents used in pharmaceutical manufacturing)
    • 21 CFR Part 211 (US FDA - Current Good Manufacturing Practice for Finished Pharmaceuticals)

    Typical usage ratio

    • Up to 20% v/v of total crystallization solvent system; adjusted based on solubility of target API and mother liquor composition

    Downstream process integration

    • Used as primary or co-solvent during final recrystallization and particle-size control steps, enabling precise isolation of API solids prior to final drying and milling

    Final product types

    • Purified small molecule APIs (antivirals, antibiotics, oncology drugs)
    • Custom pharmaceutical intermediates supplied under GMP conditions

    3. High-Performance Polyimide Polymerization Solvent

    Engineers in polyimide production exploit DMMS for its ability to solubilize both dianhydride and diamine monomers during the synthesis of high-temperature-resistant polyimide resins and films. Its elevated boiling point allows controlled thermal imidization without premature solvent loss, supporting the production of polyimide components used in microelectronics and aerospace. DMMS’s low water content offers additional reliability in moisture-sensitive reactions, minimizing defect rates in downstream film casting and lamination.

    Industry compliance standards

    • IPC-4101D (Specification for base materials for printed boards)
    • UL 94 (Tests for flammability of plastic materials)
    • RoHS Directive 2011/65/EU (Restriction of Hazardous Substances)
    • ISO 14001 (Environmental management in polymer manufacturing)

    Typical usage ratio

    • 30–60% by weight of total solvent phase; adjusted for resin viscosity and targeted molecular weight distribution of polyimide

    Downstream process integration

    • Dosed during initial monomer dissolution and maintained throughout polyamic acid synthesis, followed by staged removal during thermal imidization and film formation

    Final product types

    • Flexible polyimide films for FPCBs and insulation
    • High-performance coatings for aerospace and automotive electronics
    • Dielectric layers and polyimide adhesives used in semiconductor packaging

    4. Photoresist Stripping and Wafer Cleaning

    In semiconductor fabrication, DMMS offers strong selectivity as a component of advanced photoresist strippers and post-etch cleaning formulations. Its high polarity assists in the dissolution of crosslinked resins and hard-to-remove residues without aggressive etching of underlying wafer materials. This property reduces defect density and optimizes yield during chip patterning for both logic and memory device manufacturing, especially where non-halogenated stripping agents are required by fab process flows.

    Industry compliance standards

    • SEMATECH EHS 10945A (Guidelines for Process Chemicals in Semiconductor Manufacturing)
    • SEMI S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment)
    • ISO 14644 (Cleanrooms and associated controlled environments)
    • IEC 60749-14 (Reliability testing for semiconductor devices related to cleaning processes)

    Typical usage ratio

    • 10–35% mixed with other organic solvents in formulated photoresist remover; concentration chosen based on resist type and process temperature profile

    Downstream process integration

    • Blended into stripping baths or spray-cleaning systems after wafer exposure and etching steps; followed by rinse cycles with ultrapure water

    Final product types

    • Wafers ready for subsequent lithography steps
    • Integrated circuits (logic, DRAM/flash memory)
    • Silicon wafers for photonics and MEMS manufacturing

    5. Agrochemical Active Ingredient Solubilizer

    Downstream agrochemical formulators favor DMMS to improve the solubilization and stabilization of active ingredients in liquid concentrate and microemulsion systems. Its miscibility with both polar carriers and hydrophobic actives ensures accurate dosing of pesticides and herbicides, diminishing the risk of precipitation under variable storage or field temperatures. The inclusion rate depends on the nature of the AI and overall solvent system compatibility with targeted crop application practices.

    Industry compliance standards

    • FAO/WHO JMPR Guidelines (Pesticide specifications and quality control)
    • EU Regulation 1107/2009 (Placing of plant protection products on the market)
    • EPA 40 CFR Part 158 (Data requirements for registration of pesticides)
    • ISO 9001:2015 (for QA in agrochemical production)

    Typical usage ratio

    • 2–10% by weight, as determined by active ingredient solubility and emulsion stability studies in pilot batches

    Downstream process integration

    • Introduced during the dissolution and premixing of technical-grade actives before emulsion or solution dilution, followed by inline homogenization and anti-settling additive dosing

    Final product types

    • EC (emulsifiable concentrate) crop protection formulations
    • Microemulsion herbicides and insecticides
    • Tank-mix adjuvant premixes for broad-acre and specialty crops
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