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N-(2,6-Diethylphenyl)Maleimide

    • Product Name N-(2,6-Diethylphenyl)Maleimide
    • Alias M2MI
    • Einecs 629-432-3
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry sales7@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
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    Specifications

    HS Code

    731071

    Chemical Name N-(2,6-Diethylphenyl)Maleimide
    Cas Number 22830-60-0
    Molecular Formula C14H15NO2
    Molecular Weight 229.28 g/mol
    Appearance Off-white to yellow solid
    Melting Point 72-76°C
    Purity Typically ≥98%
    Solubility Soluble in organic solvents such as DMSO and acetone
    Storage Conditions Store at room temperature, away from light and moisture

    As an accredited N-(2,6-Diethylphenyl)Maleimide factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The 25g quantity of N-(2,6-Diethylphenyl)maleimide is supplied in a sealed amber glass bottle with a tamper-evident cap.
    Shipping N-(2,6-Diethylphenyl)maleimide is shipped in tightly sealed, chemically resistant containers to prevent moisture and light exposure. The package is clearly labeled with hazard warnings, and handled according to standard regulations for organic chemicals, ensuring transport in cool, dry conditions. Compliance with local and international shipping guidelines for chemicals is maintained.
    Storage **N-(2,6-Diethylphenyl)maleimide** should be stored in a tightly sealed container, in a cool, dry, and well-ventilated area, away from sources of heat, ignition, and direct sunlight. It should be kept separate from strong oxidizers and acids. Use appropriate personal protective equipment when handling, and ensure containers are clearly labeled to prevent accidental misuse or contamination.
    Application of N-(2,6-Diethylphenyl)Maleimide

    Applications of N-(2,6-Diethylphenyl)Maleimide in Industrial Manufacturing

    N-(2,6-Diethylphenyl)Maleimide is an advanced specialty intermediate valued in polymer, electronic, automotive, and composite sectors for its heat resistance, chemical integrity, and capacity to enhance final product features. As an experienced manufacturer, we recognize precise requirements in each downstream application scenario and adhere to globally recognized compliance and quality standards in every manufacturing lot.

    1. High Performance Polyimide Resin Synthesis

    Leading polyimide precursor manufacturers integrate this material as a functional monomer to increase heat distortion temperature, improve mechanical durability, and reinforce dimensional stability in specialty polyimide resins. The selection of suitable co-monomers and controlled imidization enables custom tuning for aerospace insulation films, flexible printed circuit substrates, and advanced adhesives. Adjustments in formulation are based on end-user technical specifications, ensuring consistent fluidity, molecular weight, and cross-link density matched to stringent process protocols.

    Industry compliance standards

    • ISO 9001:2015 Quality Management System
    • IEC 61249-2-21 for flexible circuit materials
    • UL 94 for flammability rating of polymeric materials
    • ASTM D5213 for standard polyimide resin testing

    Typical usage ratio

    • 3–15 mol% of total dianhydride/diamine monomer content, optimized for blend ratio and desired Tg

    Downstream process integration

    • Direct introduction during first-stage polyamic acid synthesis prior to thermal or chemical imidization step
    • Component dissolved or dispersed into polar aprotic solvents with other monomers
    • Integration into calendaring or casting lines for thin film production
    • Subsequent curing or post-imidization with cross-linker addition as needed

    Final product types

    • Flexible polyimide films for electronics
    • Heat-resistant wires and cables
    • Aerospace structural adhesives and coatings
    • Flexible printed circuit boards (FPCBs)

    2. Engineered Composite Material Modification

    Advanced composite manufacturers employ this chemical for its superior performance in bismaleimide resin matrices, where thermal cycling resistance, improved impact strength, and retention of modulus at elevated temperatures are mandatory. Automotive, aviation, and industrial molding applications require tight control over resin reactivity and cure kinetics, and this material offers low volatility and uniform cross-link density. It is essential for achieving composite prepregs that meet rigorous mechanical and fire-safety testing in structural and semi-structural parts.

    Industry compliance standards

    • EN 9100:2018 for aerospace quality management
    • SAE AMS 3891 for resin-matrix-preimpregnated fiber materials
    • ASTM D3039 for tensile properties of polymer matrix composites
    • FAA FAR 25.853 for flame retardancy of aircraft materials

    Typical usage ratio

    • 5–12% by weight in bismaleimide resin blends, adjusted for glass transition requirement and downstream composite curing cycle

    Downstream process integration

    • Addition to base resin during bismaleimide or copolyimide prepolymer preparation
    • Blend homogeneously with reinforcing fibers such as carbon or glass using solvent impregnation or melt-mixing
    • Calendering for prepreg tape or ply manufacture with strict solvent removal and volatility checks
    • Integrated into compression and autoclave molding for final part curing

    Final product types

    • Aircraft interior structural laminates
    • Heat shields and engine covers
    • Racecar and performance automotive panels
    • High-temperature industrial conveyor components

    3. Specialty Electronic Encapsulation Compounds

    Producers of advanced potting and encapsulation materials for microelectronic and LED industries specify this maleimide derivative for its electrical insulation properties, chemical resistance, and high temperature endurance. Material purity, batch traceability, and precise stoichiometric addition to parent polymer systems control both initial processability and long-term stability in final cured encapsulant. Finished formulations pass critical electrical, thermal conductivity, and aging tests before integration into sensitive electronics.

    Industry compliance standards

    • IPC-4101 for base materials in printed circuit board fabrication
    • RoHS Directive (2011/65/EU) for hazardous substance limitation
    • IEC 60695-2-10 for electrical insulation thermal aging
    • UL 746C for polymeric encapsulant safety

    Typical usage ratio

    • Initiation levels of 1–5% by weight in epoxy or polyimide systems, with final balance based on encapsulant thickness and curing profile requirements

    Downstream process integration

    • Blending directly into base polymer resin prior to hardener or catalyst addition
    • Degassed under vacuum to ensure bubble-free compounding
    • Metered dispensing onto sensitive electronic assemblies or boards
    • Final curing through controlled oven or LED lamp schedule to minimize thermomechanical stress

    Final product types

    • LED encapsulation gel and resin blocks
    • Microchip encapsulant systems
    • High-reliability sensor housings
    • Molded electronic relay and switch potting compounds

    4. Modification of High-Performance Adhesive Formulations

    Industrial adhesive producers use N-(2,6-Diethylphenyl)Maleimide as a modifier in thermosetting adhesive systems, particularly for electronics assembly, transportation, and demanding industrial repair. The compound imparts increased bond retention at heat, improves chemical solvent resistance, and regulates cure shrinkage and modulus. Its controlled incorporation during formulation enables tailoring of tack time and lap shear strength to suit automated or manual bonding requirements for precision assemblies.

    Industry compliance standards

    • ISO 4587 for adhesive lap-shear testing
    • REACH (EC 1907/2006) for safe handling and registration
    • IEC 60243 for electrical strength of insulating adhesives
    • UL 746C section on adhesive systems for electrical and electronic equipment

    Typical usage ratio

    • 2–8% by weight in epoxy, polyurethane, or bismaleimide adhesive bases, adjusted for viscosity and reactivity required by application conditions

    Downstream process integration

    • Direct addition to resin base before final hardener/catalyst inclusion
    • High-shear mixing to ensure complete dispersion and reaction control
    • In-line viscosity checks and drawdown testing for application consistency
    • Final adhesives packed in syringes, pouches, or cartridges for downstream use

    Final product types

    • High-heat resistant circuit assembly glues
    • Structural adhesives for transportation composite panels
    • Specialty potting agents for transformer and motor coils
    • Hybrid two-part adhesives for electronics encapsulation
    Free Quote

    Competitive N-(2,6-Diethylphenyl)Maleimide prices that fit your budget—flexible terms and customized quotes for every order.

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    Certification & Compliance
    More Introduction

    N-(2,6-Diethylphenyl)Maleimide: Crafted with the Precision of Experience

    Introduction to N-(2,6-Diethylphenyl)Maleimide

    From a manufacturer’s bench, every batch tells a story about patience, attention, and skill. In our line, N-(2,6-Diethylphenyl)Maleimide isn’t just a chemical—it stands as a result of years refining synthesis routes and listening to the demands of polymer engineers, formulators, and application specialists. There’s an art to developing specialty maleimides, an art shaped by overcoming stubborn by-product formation and constant push to deliver high purity and consistent performance.

    N-(2,6-Diethylphenyl)Maleimide, sometimes called DEPMI, is recognized for its distinctive aryl group at the nitrogen, furnished with diethyl substitutions at precise points on the ring. This structural feature allows for a unique balance: increased thermal stability while keeping reactivity in check. Our offering, coded internally as Model DEPMI-802, typically exceeds 99% purity assessed by HPLC, with less than 0.1% residual solvents. Achieving this level of purity is not just a technical milestone from the plant, but a practical necessity demanded by thin film manufacturing and advanced resin development.

    What Sets Our N-(2,6-Diethylphenyl)Maleimide Apart

    Years back, maleimide chemistry followed simple paths. Then applications got more demanding and conventional phenylmaleimides lagged behind. The diethyl groups at the 2 and 6 positions may look subtle on paper, but in synthesis they make a world of difference. Our teams learned, sometimes painfully, to handle the steric challenges during imide ring closure, optimizing temperatures, and correcting for impurities that lesser experience would miss.

    The finished product delivers superior thermal resistance when used in polyimide or bismaleimide curing systems. In real-world terms, that translates into electronic materials capable of running hotter or longer before failure. These nuances matter at the assembly line: lower outgassing protects delicate circuitry and the resin’s flow properties remain predictable from the lab to the industrial scale. Bulk blends produced with DEPMI outperform those with unsubstituted counterparts, particularly under prolonged thermal cycling or in the presence of oxidative stress.

    Over time, we’ve seen formulators wrestle with generic maleimides when scaling up. The diethylphenyl backbone in DEPMI sidesteps some of the headaches: reduced tendency to crystallize in storage, better miscibility with functionalized monomers, and reactivity profiles that suit automated systems. Whenever a project involves high-frequency electronics, LED encapsulation, or aerospace adhesives, DEPMI opens up a longer operating window, with fewer surprises on the factory floor.

    Consistency Matters: How We Approach Manufacture

    Manufacturing DEPMI involves a closed process designed for clean handling of reactive intermediates. Our chemists draw from hands-on experience, monitoring color, viscosity, and trace impurity peaks batch after batch. Little cues—a subtle shift in TLC pattern, a change in reflux time—drive countless pilot runs. These are not data points you get from a standard specification. They come from walking the line, tuning each stage, and revalidating purity before filling a drum. Customers aren’t shy about pointing out problems, and over the years our feedback loop has led to longer filter life, decreased plant downtime, and improvement in the environmental profile of our process.

    Lab staff test each lot for reactivity with a typical diene, ensuring the maleimide double bond remains unspoiled and ready for rapid cross-linking in downstream processes. We check solubility in every solvent system expected on the customer side—chlorinated, aromatic, and polar aprotic—because resin makers can’t be left guessing. No matter the order size, our commitment to process control has allowed resin manufacturers to rely on us for predictable behavior at scale, without the batch-to-batch swings that bedevil some suppliers.

    Where N-(2,6-Diethylphenyl)Maleimide Matters Most

    DEPMI shows up in specialty polyimide and bismaleimide formulations targeted at markets where demands are relentless: microelectronics, fiber optics, aerospace structures, and specialty adhesives. The two bulky ethyl groups on the ring aren’t just decoration—they push the thermal softening point higher, slowing the onset of unwanted changes under heat. Circuit board manufacturers working on high-speed data lanes count on this chemistry to maintain signal integrity over more cycles in burn-in testing. composite layup technicians building lightweight panels for extreme environments choose DEPMI for the toughness it adds without making resins brittle.

    For us in production, this means maintaining stocks ready for major seasonal builds in consumer electronics, while still supporting custom development in niche technical adhesives. The broad utility comes from controlled molecular characteristics: a sharp melting point, robust resistance to hydrolysis, and compatibility across diverse polymer matrices. This is not theoretical. Over the last decade, producers who switched from less hindered maleimides to DEPMI typically see fewer failures during thermal cycling, less yellowing of encapsulants exposed to UV, and better results in accelerated aging protocols.

    The market increasingly rewards not just technical performance but processing confidence. With DEPMI, line engineers know what to expect. Resin compounding lines run more smoothly; post-cure properties track closely from R&D up through full-scale manufacturing. Every metric that matters—gel time, glass transition temperature, shelf life—responds to the molecular tweaks built into this product.

    Differences from Other Maleimides: More Than Cosmetic Features

    There’s a tendency to lump maleimides together as if all show the same thermal and chemical resistance. From direct work in the plant, we see distinctions that often escape notice until a process hits scale. Unsubstituted phenylmaleimides bring good heat resistance, but not enough to meet the toughest new specs in automotive or data center applications. Other substituted maleimides—ortho, meta, or para alkyl groups—don’t always offer the same balance of melt viscosity and shelf stability. We’ve seen how certain substituents can cause pesky side reactions or leave residual color after cure.

    DEPMI steps away from these pitfalls. Its specific substitution pattern reduces ring reactivity at unwanted sites, increasing storage life without gumming up processing conditions. Process engineers using DEPMI see less fouling of reactor walls, clearer product, and easier clean-out cycles. This is grounded in the chemistry—bulky ethyl groups at 2 and 6 protect adjacent ring positions but leave the maleimide double bond prime for rapid, efficient cross-linking.

    In comparison to N-phenylmaleimide, DEPMI stands out for its higher resistance to oxidative degradation. For applications exposed to oxygen, like conformal coatings and automotive electronics, DEPMI-resin blends keep their electrical and mechanical properties longer. Some formulations that fail “yellowing” tests with standard maleimides clear the hurdle easily when switching to DEPMI. In pultrusion and molding operations where temperatures routinely push above 200°C, DEPMI-blended systems display less decomposition residue and more robust mechanical retention.

    A clear advantage comes in solubility and mixing behavior. DEPMI dissolves more readily in the epoxies and vinyl systems our customers run, even at high loadings or in blends meant for automated dispensing. This attributes to less downtime for mixing, fewer filter changes, and a general reduction in rejected batches throughout the plant. From ongoing customer feedback, failures due to hot-spot gelation and phase separation drop off when switching to DEPMI versus other maleimides.

    Safety in production is no small matter, either. Suppliers and end-users alike favor DEPMI’s lower volatility and moderate odor. Handling losses and fugitive emissions stay below regulatory thresholds, reducing both cost and compliance headaches. In years of use and monitoring, we’ve logged fewer operator complaints of acute odor or skin irritation compared to legacy maleimides, translating to smoother audits and safer working conditions.

    Why N-(2,6-Diethylphenyl)Maleimide Remains in Demand

    The role of DEPMI continues to grow as electronics, optoelectronics, and high-value polymers require increasingly narrow performance windows. Product lifecycles shrink, standards for reliability climb, and failures cost more. Experience in the manufacturing hall carries lessons: formulations that once “worked most of the time” now demand guaranteed margins of error. DEPMI’s unique chemistry keeps those margins secure—whether resisting thermal creep, surviving aggressive reflow cycles, or holding gloss and optical clarity in devices exposed to backlighting or sunlight.

    We field requests from R&D labs scaling up new aerospace adhesive lines, hearing their need for higher glass transition temperatures without plasticizer leaching or loss of adhesion. Instead of rewriting entire processing protocols, switching the maleimide component to DEPMI often achieves the needed results without retooling. Over time, word moves through industries when a chemical quietly solves persistent problems—DEPMI’s positive reputation traces directly to these maker-to-maker conversations.

    Many engineers recall solvent compatibility headaches, foaming, bubble formation, or unexpected cure inhibition with lower-cost maleimides. After years of tuning production variables, our process delivers DEPMI with a consistently low impurity count. The end result: crisp, high-quality parts with minimal post-processing required. Rather than constantly firefighting issues at the plant, users can focus upstream on innovation and design.

    Challenges and Continuous Improvement

    Standing still in maleimide chemistry invites competitors to creep ahead or process drift to steal from quality. We invest in continuous process review, tightening control over input streams, scrutinizing chromatography output, and updating purification steps. One lesson learned through seasons of plant operation: even small shifts in temperature or solvent quality can produce batch anomalies. We employ real-time analytics to flag any outliers before they reach final blending or packaging.

    Over the years, handling the scale-up from pilot to multi-tonne loads raised plenty of hurdles. Maintaining purity as vessel sizes increased called for redesigns in agitation, heat transfer, and wash-down procedures. Each change to the process built new assurances into product reproducibility. We put the same care into waste stream management—extraction, neutralization, and disposal routes have evolved under the watch of our in-house environmental team. Industry’s tightening limits on hazardous emissions push constant tweaks to recipes and reactor design, aiming always for higher yield and lower footprint.

    Customer feedback never stops. Regular collaborations with resin formulators and electronics manufacturers guide improvements in packaging, handling, and data reporting. These lessons circle back into operational tweaks. Flexibility in production scheduling and batch documentation helps address urgent or specialty orders, such as pharma-grade or ultra-low metal content requests. Keeping close to users means surprises are rare—potential upsets in the field quickly translate to process checks, helping us prevent repeat issues both for ourselves and for end-users.

    DEPMI and the Future: Meeting the Changing Demands of Industry

    Markets move fast. New materials chase the envelope of what’s possible—higher data speeds, shorter processing windows, devices that live tougher lives. DEPMI’s molecular structure, performance under thermal cycling, and resilience against aging mean it’s not frozen in time. Each year we pilot possible improvements: greener synthesis, faster filtration, further reduction of trace contaminants. The pressure from environmental standards and customer audits stays relentless, but it keeps us sharp. Peers may focus on price and volume; for us, stable performance through changing conditions sets the bar higher.

    What we see ahead is clear: customers want guarantees—not just promises of “performance under ideal conditions”, but documentation and data from the production line up. They want to trace a lot number back to synthesis, to be able to audit impurity profiles and see real-world processing results. That mindset shapes every change we make, from refining input quality assurance to choosing drum lining materials that prevent product contamination.

    Bringing N-(2,6-Diethylphenyl)Maleimide to these emerging requirements means constant partnership. We stay in dialogue with both end-users and research teams, fielding test samples, running application trials, and providing detailed analytical support. Having our chemists and application engineers speak directly with a customer’s line staff ensures nothing is lost in translation—a rare benefit in a world of intermediaries and bulk suppliers.

    The Manufacturer’s Voice: Bottom Line Realities

    Our connection to DEPMI goes deeper than catalog entries. Every process tweak, customer complaint, and test data point has shaped what we deliver. We know the chemistry well, but more importantly, we’ve seen how it behaves in the messiness of full-scale use. Challenges—be they in purity, consistency, or regulatory compliance—never stand still, and neither do we.

    For those seeking a maleimide with proven reliability and documented advantage over simpler analogues, N-(2,6-Diethylphenyl)Maleimide delivers value that shows up on more than just test sheets. It’s a product shaped by the demands of real applications and real challenges, made by a team that measures success by customer uptime and problem-free throughput.

    Inside each drum of our DEPMI sits not only a specialty chemical, but lessons gathered from years of practical manufacturing, detailed process control, and partnership with customers pushing the limits of their own industries. That’s the standard by which we measure ourselves, and the measure by which we invite your scrutiny and partnership.