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Hexafluoro-1,3-Butadiene

    • Product Name Hexafluoro-1,3-Butadiene
    • Alias C4F6
    • Einecs 206-938-3
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
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    Specifications

    HS Code

    650295

    Chemicalname Hexafluoro-1,3-butadiene
    Casnumber 685-63-2
    Molecularformula C4F6
    Molarmass 162.04 g/mol
    Appearance Colorless gas
    Odor Sweet
    Boilingpoint -6.4°C
    Meltingpoint -156°C
    Density 1.557 g/cm³ (at 20°C, liquid)
    Vaporpressure 1810 mmHg (at 25°C)
    Solubilityinwater Insoluble
    Flammability Non-flammable
    Synonyms Perfluorobutadiene, 1,3-Butadiene, hexafluoro-
    Unnumber 2420
    Refractiveindex 1.283 (20°C, liquid)

    As an accredited Hexafluoro-1,3-Butadiene factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing A 10-liter high-pressure steel cylinder, painted silver, labeled “Hexafluoro-1,3-Butadiene,” includes hazard warnings and secure valve cap.
    Shipping Hexafluoro-1,3-Butadiene is shipped as a compressed, liquefied gas in high-pressure cylinders. It is classified as a hazardous material (UN 2452) and requires labeling for flammable gases. Transport must comply with regulations for dangerous goods, ensuring secure containment to prevent leakage or exposure during transit. Proper documentation is mandatory.
    Storage Hexafluoro-1,3-butadiene should be stored in tightly sealed cylinders or containers in a cool, dry, well-ventilated area, away from heat, sparks, and open flames. It should be kept separate from incompatible substances such as strong oxidizers. Storage areas must be equipped with proper gas detection and fire suppression systems. Only trained personnel should handle and store this highly flammable gas.
    Application of Hexafluoro-1,3-Butadiene

    Applications of Hexafluoro-1,3-Butadiene in Industrial Manufacturing

    Hexafluoro-1,3-Butadiene serves as a critical fluorinated intermediate for multiple advanced manufacturing sectors, supporting high purity, fine chemical synthesis, and specialty material production. As a dedicated producer, we ensure reliable supply for demanding processes where consistent quality, traceability, and compliance are crucial for downstream performance.

    1. Semiconductor Device Fabrication (Etching Gas)

    Hexafluoro-1,3-Butadiene acts as a specialized etching gas in high-precision manufacturing of semiconductor wafers used for logic and memory integrated circuits. It is introduced during plasma etch steps to selectively remove silicon-based and dielectric materials while enhancing pattern fidelity and etch rate control. The material’s controlled reactivity supports advanced feature definition at sub-10 nm nodes, with minimal particle generation and high endpoint detection accuracy. Production teams monitor the material’s purity and flow rate using sophisticated instrumentation to support very-large-scale integration (VLSI) and ultra-large-scale integration (ULSI) technologies, ensuring compliance with enhanced cleanroom requirements and environmental controls.

    Industry compliance standards

    • SEMI C59 (Specifications for Industrial Grade Etching Gases)
    • IATF 16949 for electronic component process quality
    • ISO 14644 for cleanroom environmental controls
    • RoHS (EU Directive 2011/65/EU) for hazardous substance restrictions

    Typical usage ratio

    • 0.5–5% v/v diluted in inert carrier gas (argon or nitrogen), adjusted according to process chamber volume, targeted etch rate, and substrate material

    Downstream process integration

    • Integrated in RIE (Reactive Ion Etching) or ICP (Inductively Coupled Plasma) etcher gas panels, with real-time flow and pressure control for process chambers

    Final product types

    • CMOS microprocessors
    • Flash memory chips
    • DRAM modules
    • Advanced logic ICs for telecommunications and automotive applications

    2. Fluoropolymer Synthesis (Specialty Monomer Component)

    Hexafluoro-1,3-Butadiene functions as a key comonomer for production of specialty fluoropolymers offering chemical resistance and thermal stability. It enters proprietary copolymerization reactions under controlled conditions, enabling the tailoring of molecular weight and glass transition temperature for fluorinated resins. Manufacturers carefully sequence monomer addition to achieve precise chain propagation and control polymer branching, validated through batch QC and chromatographic analysis. The resulting fluoropolymers serve niche applications in microelectronics, wire coatings, and high-performance gaskets requiring low outgassing and superior barrier properties.

    Industry compliance standards

    • ASTM D2116 for fluoropolymer resin quality
    • ISO 9001 or ISO 13485 for quality management in specialty materials
    • REACH Regulation (EC) No 1907/2006 for chemical registration and safety
    • Food Contact Notifications (FCN) for restricted applications relating to packaging (as required)

    Typical usage ratio

    • 5–25 mole% in copolymerizations, depending on end-use properties, adjusted for desired crystallinity, flexibility, or mechanical strength

    Downstream process integration

    • Fed into autoclave or stirred tank reactors, alongside tetrafluoroethylene or partially fluorinated comonomers, under monitored temperature and pressure envelopes

    Final product types

    • Flexible fluoropolymer tubing for medical or analytical instruments
    • Low-permeation wire and cable insulation
    • Chemically resistant valve and pump components
    • High-frequency printed wiring board laminates

    3. Photoresist Dry Stripping (Cleaning Gas for Lithography)

    This material is deployed as an advanced stripping agent for removing photoresist residues following complex photolithographic patterning of wafers. In dry ashing applications, controlled plasma activated Hexafluoro-1,3-Butadiene ensures rapid and uniform breakdown of organic resist films without damaging underlying circuit structures. Consistent gas delivery and particle-free handling are critical to avoid contamination that would impact device yields. Use in this scenario addresses stringent residue control and supports automated metrology flows in chip foundries and advanced packaging lines.

    Industry compliance standards

    • SEMI S2/S8 (Safety Guidelines for Gas Delivery and Handling)
    • ISO 22301 for business/process continuity in IC fabrication
    • SEMATECH technology roadmap wafer cleaning protocols

    Typical usage ratio

    • 1–10% v/v in high-purity inert carrier, precisely tuned for ashing tool configuration and wafer feature density requirements

    Downstream process integration

    • Direct injection to plasma asher chamber, sequenced post-photolithography but prior to wet cleaning cycles

    Final product types

    • Finished silicon wafers for microprocessors and MEMS
    • Photonic IC substrates with advanced multilayer interconnects
    • Fan-out and wafer-level packaging dies

    4. Organic Synthesis Intermediate for Pharmaceuticals and Agrochemicals

    Our manufacturing teams supply highly pure material as a fluorinated building block for specialized pharmaceutical and agrochemical synthesis routes. It supports the construction of active intermediates containing perfluorinated moieties, which enhance metabolic stability, bioactivity, and formulation shelf life. In multi-step synthesis, chemists introduce hexafluoro-1,3-butadiene via palladium-catalyzed coupling, radical addition, or cycloaddition reactions. Formulators optimize addition points to maximize selectivity and yield of targeted scaffolds, with strict process monitoring for impurity and residual fluorocarbon control.

    Industry compliance standards

    • ICH Q7 Good Manufacturing Practice for active pharmaceutical ingredients
    • ISO 9001 for quality management in chemical manufacture
    • REACH pre-registration and safety data requirements for specialty intermediates
    • U.S. EPA TSCA (for introduction to the U.S. market)

    Typical usage ratio

    • Varies by synthesis pathway, typically 0.1–2.0 equiv. vs. limiting reagent, specified by chemoselectivity and final application

    Downstream process integration

    • Charged at selected stages in batch or continuous reactors for fluorinated intermediate synthesis, followed by isolation and purification via column chromatography or crystallization

    Final product types

    • Fluorinated pharmaceutical intermediates for kinase inhibitors or antivirals
    • Crop protection active ingredients with improved rainfastness
    • Biomolecule labeling reagents for research diagnostics
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    Certification & Compliance
    More Introduction

    Hexafluoro-1,3-Butadiene: Innovating Semiconductor Etching Gases

    Driving Progress with Hexafluoro-1,3-Butadiene

    In the world of specialty gases, advances happen not just because of new chemical ideas, but because of demands from the real working floors of semiconductor fabs. People who process wafers, build advanced chips, and design new etching methods, all want reliable gases that deliver both in quality and performance. Hexafluoro-1,3-butadiene has advanced from a curiosity in research labs to a standard fixture on gas lists at chip fabs around the globe.

    Our facility has manufactured hexafluoro-1,3-butadiene (C4F6) for nearly two decades. This colorless, odorless, pressurized gas remains one of the most selective etchants for advanced semiconductor nodes, especially as geometries keep shrinking. Because of this, our engineers haven't just watched this market develop—they've lived the reality of meeting tighter purity standards and ensuring consistent supply.

    Model, Specifications, and Production Insights

    Hexafluoro-1,3-butadiene goes by the molecular formula C4F6. Its CAS number is 685-63-2. Production runs always begin with a focus on ultra-high purity. Modern lithography and dry etch tools demand feed gas with impurities measured in parts per billion. Typical grades shipped from our gas plant offer a minimum purity of 99.99%, confirmed by gas chromatography and FTIR. Moisture, particulates, ammonia, and oxygen content stay below the strictest industry thresholds. Cylinders get vacuum-evacuated, then filled in contamination-controlled environments that meet both ISO and SEMI standards.

    Our team uses stainless steel piping exclusively to avoid corrosion and unwanted byproducts. From synthesis through final fill, material traceability covers every step. Each batch includes full analysis, not only for the main component but for likely trace contaminants—buried deep in the certificate of analysis, but still referenced by experienced process engineers at the customer sites. Reliable data builds trust much faster than empty promises.

    How Chipmakers Use Hexafluoro-1,3-Butadiene

    The primary demand for this gas comes from plasma etch, where it shapes dielectric features at sub-10nm scales. High selectivity toward silicon oxides and low attacks on photoresist or silicon nitride separate C4F6 from simpler compounds like CF4. Fab engineers tell us that the molecule's structure leads to formation of unique polymer films during etch, protecting sidewalls better than standard perfluorocarbons do. In practice, this means sharper trenches, fewer defects, and improved device yield. Etch selectivity and process stability count for more than just cost savings—they let our customers chase new device geometries without compromising reliability.

    Use of C4F6 often starts at the most advanced memory and logic node production lines. As foundries shift from 3D NAND to future hybrid bonding technologies, etch gases need both excellent anisotropy and reduced micro-masking. C4F6’s double-bonded structure enables plasma chemistries that give repeatable results at the highest aspect ratios. Process development teams learn quickly when they first tune gas flows and RF powers—the results show up in the inspection microscope. Only gases that deliver repeatable patterns stay on the spec list. C4F6 holds its place for this reason.

    Why Hexafluoro-1,3-Butadiene Stands Apart from Other Fluorocarbons

    Not all fluorocarbon gases behave the same way. Choosing among them depends on a complex tradeoff between etch rates, selectivity, cost, contamination risk, and chamber maintenance workload. For decades, CF4, C2F6, and C3F8 provided easy access to plasma fluorine. These molecules splinter rapidly in a high-energy plasma, creating low-mass radicals that give fast, but not always selective, etch rates.

    Hexafluoro-1,3-butadiene is different. Its elongated structure with two double bonds, compared to the more “spherical” perfluorinated alkanes, gives rise to interesting polymerization during plasma discharge. Rather than simply bombarding the surface with atomic fluorine, C4F6 drives the formation of protective films on the wafer sidewalls. This builds a shield against lateral etching and roughness. For high aspect ratio patterns, this behavior mitigates bowing, twisting, and undesired notch effects—results that many chipmakers need in order to hit the integration requirements of next-generation nodes.

    Our application engineers often meet with customers to troubleshoot unexpected loss of selectivity in sub-20nm etch recipes. Switching from short-chain perfluorocarbons to C4F6 consistently reverses these problems. The switch sometimes requires fine-tuning gas mixes and plasma parameters, but it drives yields up. Etch chambers see less polymer buildup in hard-to-clean spots, and downstream abatement operates more predictably because C4F6 generally decomposes to tetrafluoride byproducts with fewer unexpected trace organics. This is not anecdote—our after-market team tracks abatement output gas for byproduct analysis.

    Product Purity: Not Just a Number, But a Guarantee

    Chemical purity stands above all. It’s common for resellers to market a generic “99.9%” without addressing what the remaining 0.1% contains. For fab engineers worried about wafer yield, that unknown can mean scrapped lots. Our plant uses advanced inline analyzers to monitor hydrocarbons, acid-forming contaminants, moisture, and metals at the filling stage. Analytical chemists run validation samples against NIST standards. Instead of offering a vague promise, we provide measured numbers—each batch signed off by a named technician.

    Feedback from the field cycles back to production. Anomalies in process windows tie directly to trace impurity spikes. Installing higher sensitivity detection systems uncovered contaminants that older tools missed. Over time, customer lines run more stably. People in fabs don’t want excuses; they require raw data, rapid response, and accountability. Building a long-term partnership means solving tomorrow’s purity requirements ahead of schedule, not scrambling to meet yesterday’s problem.

    Safety and Handling Learned on the Factory Floor

    Everyone who works with C4F6 needs to respect its hazards. Handling in large volumes takes proper assessment—not just of toxicity, but of physical behavior under compression and release. Process engineers, cylinder handlers, and transporter drivers receive training not out of box-ticking, but because real accidents happen to people, not statistics. Material safety data and regulatory compliance anchor every shipping document. We keep a twenty-four-hour on-call team who have worked through equipment failures and cylinder ruptures, not by theory but by hard-earned practice.

    Safe supply chains don’t run themselves. Regional warehouses never store excess stock, so aging or compromised cylinders don’t become hazards. Each shipment gets packed with temperature and shock sensors, with remote monitoring backed by a logistics team that’s used to customs challenges and local regulations on hazardous materials. Feedback from handlers turns into safer capping, better cart designs, or changes in QR code tracking. Taken together, this emphasis on safety doesn’t slow us down; it keeps us, and everyone in the field, running.

    Environmental Controls and Sustainable Production

    As a chemical manufacturer, environmental stewardship stands as more than a line in a code of conduct. We operate within strict legal frameworks, but pressure from customers and communities pushes us to improve every year. Hexafluoro-1,3-butadiene belongs to the class of fluorinated gases with known greenhouse potential. European regulations and US state laws monitor releases closely. We invested heavily in abatement and recovery equipment, capturing fugitive emissions and scrubbing waste streams before they reach the atmosphere.

    Our plant also recycles spent gases from customer sites when feasible, feeding them through purification and fractional distillation units. This closes the loop and reduces overall demand for fresh feedstock. Tracking every kilogram, we aim to cut total carbon equivalent emissions year after year. Environmental performance audits come as routine, forcing honest reflection on what can and should be improved. If a better production method or less wasteful transport system can be developed, we adopt it. Pressure to do better for the environment comes from new employees as much as from regulators.

    Logistics: More Than Just Transport

    Every shipment matters. Few industries tolerate delays like the semiconductor sector. Missed deliveries mean halted lines that cost tens of thousands of dollars per hour—not a stretch, but today’s reality. Our logistics team plans not just truck routes, but backup options for road, sea, and air. Working closely with shipping partners, we manage temperature excursions and coordinate with customs for cross-border shipments. Hazardous goods documentation matches national and international standards down to the last detail.

    C4F6 can’t sit idle in a warehouse; its shelf life holds, but process managers schedule deliveries just before the last cylinder empties. We take pride in rarely missing a shipping deadline, because downtime for customers means not only lost revenue but broken trust. Our team keeps lines of communication open, updating schedule changes or unexpected holdups as they happen. No automation or digital dashboard replaces an experienced human checking a shipment’s path, flagging anomalies, and escalating when weather, strikes, or port shutdowns threaten to derail plans. The peace of mind for fab engineers depends on our attention to these details.

    Supporting Customers With Field Experience

    Real manufacturing means more than filling orders. Tech support doesn’t stop at generic Q&A; it backs up R&D, line process, and emergency troubleshooting with years of plant-floor experience. Semiconductor process recipes evolve fast—one month’s “standard” can become next quarter’s legacy. People from our field engineering team don’t spend meetings reciting product specs; they bring stories and practical fixes from real installs, retrofits, and changeovers.

    Onsite support teams visit fabs, observe real etch chambers, and talk with engineers at shift turnovers. Feedback data clears up genuine puzzles: faulted wafer lots, unusual endpoint drifts, or new contamination blips on inline metrology. Instead of pointing fingers at the customer process, we work with fab teams, run joint root-cause analysis, and ship replacement product if manufacturing drift is found on our end. This accountability keeps long-term customers coming back, because they know a real fix, not a scripted answer, will follow any problem raised.

    Looking Ahead: Meeting Tomorrow’s Process Demands

    The market for C4F6 keeps changing. Five years ago, no one expected the pace of innovation in advanced DRAM or the shift to more vertical NAND stacking. Process engineers need etch gasses not just for today’s nodes but for designs three and five years ahead—many still in research. Through close collaboration with tool vendors and universities, we adapt production runs to anticipated shifts in volume, purity, and physical requirements.

    Predicting demand is never simple. We track both global fab expansion and local legislation tightening on greenhouse emissions. Supply chain disruptions—pandemic, war, or trade barriers—taught everyone the need for buffer stock, alternative transport modes, and regional inventory placement. As regions like East Asia and North America invest in new fabs, we pre-position not just cylinders but technical teams and spare parts. The old holdback between chemistry “R&D” and “Operations” fell away years ago. Our research team sits next to plant operations, so feedback moves both ways almost daily.

    Regulatory Shifts and Compliance in Real Time

    Regulations around fluorinated gases tighten year by year. Governments want to reduce greenhouse impacts while maintaining competitiveness in high-tech manufacturing. Our compliance team stays ahead by tracking draft regulations, industry special exemptions, and alternative chemistries. We changed how we produce, package, and label C4F6 several times in the past decade because compliance isn’t a static requirement.

    Staying ahead of audits means more than ticking boxes: it’s built into our plant routines. Auditors who visit can spot-hold a batch from shipping or close off a filling line for upgrades. Rapid adaptation, not mere paperwork, gets product out the door without risking fines or production halts at customer sites. Prudent investment in compliant storage, abatement, and monitoring systems pays for itself in fewer headaches down the road.

    Field Experience: Real Lessons Drive Continuous Improvement

    Each improvement to our C4F6 comes from feedback, not just from management reports, but from line workers and recipe developers. Labor in chemical manufacturing brings together chemistry, engineering, and logistics, anchoring ideas in physical outcomes. During outages or equipment upgrades, teams document what works, what holds up to real use, and which ideas flop. Continuous improvement—often a buzzword—means testable changes, feedback loops, and accountability.

    Our product development doesn’t happen in a vacuum. If a new contaminant turns up in mass spectrometry runs at a customer’s etch chamber, our chemists trace the origin, modify filling steps, and update analytic screening. Line workers send samples, run split-batch tests, and provide results back to the customer. Adjustments rarely happen overnight, but real-world metrics drive decision-making. That builds reliability not just into chemical product, but into relationships.

    The Human Side: Training, Retention, and Knowledge Transfer

    So much of what keeps production and delivery strong comes down to people. In our plant, experienced operators teach new hires not just which valves to open, but which warning signs matter when pressure readings drift or pump seals squeal. Institutional knowledge doesn’t live just in manuals—it passes from person to person, in habits, shortcuts, and tricks that won’t show up in a process document. Long tenure matters, and frequent retraining keeps both skills and safety fresh.

    Retention in specialty gas manufacturing may seem like a challenge, but people tend to stay when they see that their work counts—not only to the company, but to teams at customer sites. When an order ships under pressure or a line needs early-morning service, familiar voices and faces keep things moving. Human relationships, rather than blind automation, connect the dots from raw chemical to wafer-ready gas cylinder.

    Conclusion: Why Experience Matters in Hexafluoro-1,3-Butadiene Manufacturing

    Hexafluoro-1,3-butadiene isn’t just another commodity chemical. It’s used to shape the future of electronic devices, enabling complex designs on the smallest scales. Every kilogram traces a path from reactor to cylinder, from safety inspection to cleanroom, carrying with it both the technical rigor and accumulated experience of everyone who handles it. Challenges—whether in purity, logistics, safety, or evolving regulations—come up daily, and our solutions grow from listening closely to both customers and colleagues. Our story intertwines with the story of every chip etched, every process line improved, and every problem solved.