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HS Code |
304388 |
| Chemicalname | Diethyl Phenylthiomethylphosphonate |
| Casnumber | 3466-88-0 |
| Molecularformula | C11H17O3PS |
| Molecularweight | 260.29 g/mol |
| Appearance | Colorless to pale yellow liquid |
| Boilingpoint | 160-163°C at 2 mmHg |
| Density | 1.185 g/cm3 at 25°C |
| Solubility | Slightly soluble in water, soluble in organic solvents |
| Refractiveindex | 1.5370-1.5390 |
| Flashpoint | 132°C |
| Storageconditions | Store in a cool, dry place, tightly closed |
| Purity | Typically ≥ 97% |
| Smiles | CCOP(=O)(CCSC1=CC=CC=C1)OCC |
| Inchikey | SPZLZFESJCAACA-UHFFFAOYSA-N |
As an accredited Diethyl Phenylthiomethylphosphonate factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 250g of Diethyl Phenylthiomethylphosphonate is supplied in a sealed amber glass bottle with a tamper-evident cap and hazard labeling. |
| Shipping | Diethyl Phenylthiomethylphosphonate should be shipped in tightly sealed containers, clearly labeled and protected from physical damage. Store and transport under cool, dry conditions away from incompatible substances. Comply with all relevant local, national, and international chemical transport regulations. Handle as a potentially hazardous material and ensure appropriate safety documentation accompanies the shipment. |
| Storage | Diethyl Phenylthiomethylphosphonate should be stored in a tightly sealed container, away from moisture, heat, and direct sunlight. Store in a cool, dry, and well-ventilated area, separate from incompatible substances such as strong oxidizers and acids. Proper labeling and secure shelving are essential. Personal protective equipment should be used when handling, and relevant storage regulations must be followed. |
Applications of Diethyl Phenylthiomethylphosphonate in Industrial ManufacturingAs the original manufacturer of Diethyl Phenylthiomethylphosphonate, we supply this specialty organophosphonate for advanced use in industries where strict compliance, repeatable formulation behavior, and downstream integration are essential. Below, we present verified application scenarios, with detailed technical insights appropriate for industry professionals planning new formulations or process improvements. 1. Flame Retardant Additive for Engineering PlasticsLeading producers in automotive, consumer electronics, and industrial machinery blend this phosphonate ester during compounding of polycarbonate, ABS, and polyester resin systems to achieve halogen-free flame retardancy while retaining fundamental mechanical properties. The raw material provides a phosphorus source compliant with global fire safety requirements, and formulators tune dosage based on polymer matrix and end-use fire testing criteria. Industry compliance standards
Typical usage ratio
Downstream process integration
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2. Reactive Intermediate for Agrochemical SynthesisFine chemical plants utilize our phosphonate as a building block for the development of organophosphorus-based crop protection actives, particularly as a key alkylating and phosphorylating agent in the production of specific fungicides and insecticides. Selection is driven by rigorous adherence to global agricultural chemical mandates, and process engineers dose according to both target molecule synthesis efficiency and downstream regulatory dossiers. Industry compliance standards
Typical usage ratio
Downstream process integration
Final product types
3. Plasticizer for Specialty PVC and Elastomer FormulationsSpecialty cable, conveyor belt, and flexible flooring manufacturers employ diethyl phenylthiomethylphosphonate as a high-performance plasticizer, selecting it for its phosphorus backbone which imparts improved flame resistance and plasticization without compromising flexibility or migration resistance in comparison to traditional phthalates. Dosage is critically validated by internal R&D to match end-use flexibility and fire performance targets. Industry compliance standards
Typical usage ratio
Downstream process integration
Final product types
4. Additive for Epoxy Resin Systems in Electronics EncapsulationEpoxy formulation specialists for electronic device encapsulation and conformal coatings depend on this phosphonate for improved flame resistance and thermal stability. It reliably meets rising international demands for halogen-free, phosphorus-based fire protection, and the dosing regime is refined through iterative prototype testing to align with circuit board safety, thermal cycling, and chemical exposure scenarios. Industry compliance standards
Typical usage ratio
Downstream process integration
Final product types
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