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Bis(Cyclopentadienyl)Cobalt

    • Product Name Bis(Cyclopentadienyl)Cobalt
    • Alias Cobaltocene
    • Einecs 208-735-9
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry sales7@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
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    Specifications

    HS Code

    427049

    Chemicalname Bis(Cyclopentadienyl)Cobalt
    Commonname Cobaltocene
    Chemicalformula C10H10Co
    Molarmass 193.07 g/mol
    Appearance Magenta or reddish-purple crystalline solid
    Meltingpoint 173 °C
    Boilingpoint Substantial decomposition before boiling
    Density 1.51 g/cm³
    Solubilityinwater Insoluble
    Solubilityinorganicsolvents Soluble in ether, benzene, and toluene
    Casnumber 1271-08-5
    Molecularstructure Sandwich compound

    As an accredited Bis(Cyclopentadienyl)Cobalt factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The 100-gram Bis(Cyclopentadienyl)Cobalt is packaged in a sealed amber glass bottle with a tamper-evident cap and hazard labeling.
    Shipping Bis(Cyclopentadienyl)Cobalt is shipped in tightly sealed containers under inert gas, typically argon, to prevent exposure to air and moisture. Containers are labeled as flammable solids and handled as hazardous materials, complying with international regulations. Protective packaging ensures stability and safety throughout transport. Store and transport away from heat and incompatible substances.
    Storage Bis(Cyclopentadienyl)Cobalt should be stored in a tightly closed container under an inert atmosphere, such as nitrogen or argon, to prevent oxidation. Store it in a cool, dry, and well-ventilated area away from sources of ignition, moisture, and incompatible materials such as strong oxidizers. Protect the material from light and extreme temperatures to ensure stability and minimize decomposition risks.
    Application of Bis(Cyclopentadienyl)Cobalt

    Applications of Bis(Cyclopentadienyl)Cobalt in Industrial Manufacturing

    Bis(Cyclopentadienyl)Cobalt plays a critical role in several advanced industries due to its organometallic structure and reactivity. As a direct manufacturer, we supply to downstream partners who require strict specification, high purity, and consistent performance for advanced process integration. Below, we detail authentic industrial segments drawing from regulatory, operational, and formulation realities.

    1. CVD Precursors for Semiconductor and Advanced Electronics

    This material directly supports many processes within semiconductor device fabrication, particularly for metal-organic chemical vapor deposition (MOCVD) when manufacturers deposit thin cobalt or cobalt silicide films on wafers. Users rely on its high vapor pressure and precise breakdown temperature to deliver controlled cobalt atom layers needed in advanced transistor gates, barrier layers, and interconnects. The demand for precise gas-phase delivery at nm-scale thicknesses dictates stringent material screening, contamination control, and adherence to microelectronic purity protocols.

    Industry compliance standards

    • SEMI C41: CVD Materials Quality
    • JEITA ETR-2000: Guidelines for Materials in Wafer Processing
    • IPC-6012: Qualification and Performance for Printed Boards
    • ISO 14644-1: Cleanroom Classification

    Typical usage ratio

    • 0.1–1.5 mg/cm2 wafer surface area; adjusts based on target film thickness and deposition rate

    Downstream process integration

    • Dosed to MOCVD source bubblers
    • Vaporized and introduced to high-vacuum deposition chambers
    • Tuned with co-reactant gases (e.g., H2, NH3) to control film growth and stoichiometry
    • Excess purged after cycle completion to maintain spec purity and avoid particle formation

    Final product types

    • CMOS transistors with cobalt-based contact layers
    • DRAM and flash memory with cobalt-lined vias
    • Logic IC substrates utilizing cobalt silicide
    • Specialty image sensor wafers

    2. Catalyst Component for Fischer-Tropsch Synthesis

    Major FT synthesis plants specify this cobalt complex as a controlled precursor for producing highly dispersible cobalt nanoparticles on silica, alumina, or titania supports. The chemical allows uniform deposition and decomposition under mild thermal conditions, which maximizes surface active sites for syngas conversion. Correct formulation and precursor quality impact catalyst lifetime, reaction selectivity, and downstream hydrocarbon profile.

    Industry compliance standards

    • ISO 9001:2015-certified catalyst production environments
    • API RP 751: Catalytic Reforming Design
    • REACH Annex XVII (cobalt compounds handling)
    • EFfCI GMP Guide (if used in pharmaceutical syntheses via FT crude)

    Typical usage ratio

    • 0.1–0.5% Co by total catalyst mass; exact proportion optimized per reactor size, support surface area, and desired selectivity

    Downstream process integration

    • Dissolved or suspended in organic or aqueous slurry for precursor impregnation
    • Applied to catalyst support via incipient wetness or co-precipitation
    • Thermal decomposition under inert or reducing gas flow
    • Activated in situ before FT reactor startup

    Final product types

    • Liquid fuels (synthetic diesel, kerosene, naphtha)
    • Wax and base oil intermediates
    • Chemical feedstocks (alkenes, alcohols, etc.)
    • Fischer-Tropsch synthesized lubricants

    3. Polymerization Catalyst for High-Performance Polymers

    Companies manufacturing specialty polyolefins, such as high-density polyethylene and syndiotactic polystyrene, employ the compound as a co-catalyst or activator. Its organometallic nature promotes polymer chain growth, enabling precise control over molecular weight distribution and stereoregularity. Consistent supply and high batch purity remain essential due to tight downstream QC constraints and impactful performance in polymer melt flows and mechanical properties.

    Industry compliance standards

    • ISO 14001:2015 Environmental Management in polymer plants
    • EU Regulation (EC) No 1907/2006 (REACH registry for polymer additives)
    • FDA 21 CFR 177.1520 (in food-contact applications)
    • ISO 9001:2015 Production traceability

    Typical usage ratio

    • 5–500 ppm relative to total monomer; ratio fine-tuned based on catalyst system and target molecular structure

    Downstream process integration

    • Added to polymerization reactor as homogeneous solution or via supported catalyst bed
    • Initiates or modifies chain building steps after main Ziegler-Natta or metallocene catalyst introduction
    • Remnants neutralized or removed by extraction after reaction completion
    • Trace residue must meet regulatory release/limit levels in finished polymer

    Final product types

    • HDPE for engineering or packaging
    • Syndiotactic polystyrene automotive parts
    • High-molecular-weight specialty elastomers
    • Industrial resins for wire & cable insulation

    4. Precursor for Magnetic Recording Material Synthesis

    Manufacturers in the data storage and electronics sectors use this compound as a source of high-purity cobalt for producing cobalt-phosphide, cobalt-chromium, and other ferromagnetic alloys. These advanced materials form the basis of magnetic thin films in hard disk drive platters and magnetic tape, demanding controlled crystallization and minimal impurity levels. The precursor’s volatility and clean decomposition behavior enable both batch and inline wet-chemical reduction techniques, vital for downstream coating uniformity and device longevity.

    Industry compliance standards

    • IEC 62396-1: Reliability of electronic components
    • RoHS Directive 2011/65/EU (restriction of hazardous substances)
    • ISO/TS 16949 (for automotive-related magnetic media)
    • QC080000 HSPM (Hazardous Substance Process Management)

    Typical usage ratio

    • 0.05–0.3 M concentration in metal salt reduction bath; adjusted for deposition thickness and target stoichiometry

    Downstream process integration

    • Dissolved in precursor solution for electroplating or chemical reduction
    • Combined with stabilizers and crystal modifiers
    • Substrate immersion or spray to deposit magnetic film layers
    • Annealing or magnetic alignment performed post-deposition

    Final product types

    • Hard disk drive magnetic platters
    • Magnetic tape for data and video storage
    • GMR (giant magnetoresistance) sensor elements
    • Advance magnetic data cards
    Free Quote

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