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3,3',4,4'-Biphenyltetracarboxylic Dianhydride

    • Product Name 3,3',4,4'-Biphenyltetracarboxylic Dianhydride
    • Alias BPDA
    • Einecs 216-116-7
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
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    Specifications

    HS Code

    229166

    Cas Number 2420-87-3
    Molecular Formula C16H6O6
    Molecular Weight 294.22 g/mol
    Appearance White to off-white crystalline powder
    Melting Point ≥ 295°C (decomposes)
    Solubility In Water Insoluble
    Boiling Point Decomposes before boiling
    Density 1.63 g/cm³
    Purity ≥ 99%
    Storage Conditions Store in a cool, dry place, tightly closed
    Synonyms BPDA; 3,3',4,4'-Biphenyltetracarboxylic dianhydride
    Ec Number 219-342-9

    As an accredited 3,3',4,4'-Biphenyltetracarboxylic Dianhydride factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The packaging is a sealed, amber 100-gram glass bottle labeled "3,3',4,4'-Biphenyltetracarboxylic Dianhydride, 99% purity, for laboratory use."
    Shipping 3,3',4,4'-Biphenyltetracarboxylic Dianhydride is shipped in tightly sealed containers to prevent moisture uptake and degradation. It is typically transported at ambient temperature with clear chemical labeling. Handling and shipping comply with relevant safety and regulatory guidelines to ensure stability and safe delivery, avoiding exposure to incompatible substances and humidity.
    Storage 3,3',4,4'-Biphenyltetracarboxylic Dianhydride should be stored in a tightly sealed container in a cool, dry, and well-ventilated area. Protect it from moisture, heat, and direct sunlight. Store away from incompatible substances such as bases and strong oxidizing agents. Proper labeling and handling practices should be followed to prevent contamination and exposure. Use appropriate personal protective equipment when handling.
    Application of 3,3',4,4'-Biphenyltetracarboxylic Dianhydride

    Applications of 3,3',4,4'-Biphenyltetracarboxylic Dianhydride in Industrial Manufacturing

    3,3',4,4'-Biphenyltetracarboxylic dianhydride (BPDA) is a specialty aromatic dianhydride commonly used as a key building block in the polymer and advanced materials sectors. As an original manufacturer, we deliver high-purity BPDA to support demanding production lines in electronics, transportation, membranes, and aerospace industries. Below, we detail principal downstream applications, regulatory requirements, composition practices, process inclusion, and finished products.

    1. High-Performance Polyimide Films for Electronics

    BPDA acts as a primary dianhydride for the synthesis of aromatic polyimides, notably used in electronic-grade films. Manufacturers select BPDA-based formulas for applications requiring thermal stability, low dielectric constant, and excellent dimensional stability at high temperatures. Engineering teams formulate polyimide precursors by polycondensation of BPDA with diamines such as p-phenylenediamine (PDA) or 4,4'-oxydianiline (ODA), followed by chemical or thermal imidization. Final films deliver reliable insulation in flexible printed circuits, release liners, and dielectric substrates.

    Industry compliance standards

    • UL 94 V-0 Flame Retardance
    • RoHS Directive (2011/65/EU and updates)
    • IPC 4101B/41 for polyimide base materials
    • REACH Regulation (EC) No 1907/2006

    Typical usage ratio

    • Typically 45–55 mol% of total dianhydride component in polyamic acid resin, balanced with other aromatic dianhydrides based on flexibility and final film properties
    • Exact loading adjusted according to Tg, flexibility, and processability targets

    Downstream process integration

    • BPDA charged to polyamic acid synthesis reactor under nitrogen purge and controlled temperature
    • Stoichiometric addition relative to selected diamine(s), monitored for viscosity and molecular weight control
    • Casting of polyamic acid on carrier film, followed by staged imidization ovens or chemical dehydration steps

    Final product types

    • Flexible copper clad laminates (FCCL)
    • Pressure-sensitive adhesive tapes for electronics
    • Release liners for semiconductor wafer processing
    • Base films for microelectronic substrates

    2. Polyimide Resins for Aerospace Composites

    In composite fabrication for aerospace structures, BPDA participates in polyimide matrix synthesis with high-temperature resistance for use in primary and secondary airframe parts. Formulators blend BPDA with rigid and flexible diamines to achieve specific glass transition temperatures and optimize strength-to-weight ratios. The resin systems undergo solvent-based or melt polycondensation followed by impregnation and curing in pre-preg formats, providing dimensional integrity and flame retardance in aircraft and satellite panels.

    Industry compliance standards

    • SAE AMS 3844 Polyimide Resin Specifications
    • FAR 25.853 Flammability of Aircraft Interior Materials
    • EN 45545-2 (for railway applications where crossover occurs)
    • NADCAP certification process for composite manufacturing

    Typical usage ratio

    • BPDA content ranges from 35–60 wt% of resin solids, depending on the ratio of end-capping groups and co-anhydrides
    • Loading tailored to achieve resin flow and cross-link density targets

    Downstream process integration

    • Charging BPDA to resin reactor with stoichiometric diamine, under dry and inert gas conditions
    • Solvent removal and controlled chain extension before resin application on fibers
    • Impregnated fibers undergo staged thermal cure or hot-press consolidation

    Final product types

    • Structural composite panels for aircraft and unmanned aerial vehicles (UAVs)
    • Pre-preg tapes for aerospace interior and external surfaces
    • Thermal shielding panels in satellites
    • Radome covers with high-frequency transmission reliability

    3. Gas Separation and Pervaporation Membranes

    BPDA is integral to high-selectivity polyimide membranes engineered for industrial gas separation, solvent dehydration, and vapor recovery. Process engineers formulate asymmetric or composite membranes using BPDA-derived copolymers for superior penetrant selectivity and pressure resistance. Production involves solution casting, phase inversion or hollow fiber spinning, combined with post-imidization and surface modification steps. These advanced membranes operate in refinery, natural gas processing, and solvent recycling facilities.

    Industry compliance standards

    • ASTM D3981 for membrane permeation performance
    • ISO 15848 for gas-tightness of industrial equipment
    • FDA 21 CFR 177.2440 (for food contact membranes, if applicable)
    • China GB/T 28714 (for gas separation membrane materials)

    Typical usage ratio

    • BPDA generally constitutes 30–50 mol% of total dianhydride in membrane polyimide matrix
    • Formulation adjusted for selectivity/permeability balance depending on application (e.g., CO2/CH4 vs. N2/O2)

    Downstream process integration

    • BPDA introduced during polyimide membrane precursor solution preparation
    • Phase inversion or dry jet-wet spinning processes to form dense or asymmetric active layers
    • Membranes subjected to post-treatment to stabilize morphology and improve fouling resistance

    Final product types

    • Hollow fiber or flat-sheet membranes for gas separation (e.g., O2-enrichment, CO2 removal)
    • Pervaporation modules for solvent dehydration (e.g., ethanol-water separation)
    • Organic vapor recovery units
    • Compressed gas drying membrane cartridges

    4. Polyimide Coatings for Wire & Magnet Insulation

    BPDA-based polyimide coatings deliver thermal and dielectric stability for fine wire, magnet wire, and high-voltage winding insulation. Production lines use BPDA as a core anhydride to build polyamic acid varnishes, optimized for high temperature class ratings (up to class H and above). These coatings undergo imidization via heat curing or catalytic dehydration, forming thin, uniform, amorphous or semi-crystalline insulation films. The resulting products provide stable adhesion and endurance in motor, transformer, and generator manufacture.

    Industry compliance standards

    • IEC 60317 standards for enameled round and rectangular winding wires
    • NEMA MW 16 (for polyimide film insulation)
    • UL 1446 Electrical Insulation Systems
    • RoHS and REACH regulations for electrical products

    Typical usage ratio

    • BPDA makes up 42–52 mol% of total anhydride content in polyamic varnish composition
    • Ratio tuned for flow properties, final insulation thickness, and thermal endurance requirements

    Downstream process integration

    • Dissolving BPDA and diamine in appropriate solvents to formulate coil coating varnishes
    • Applying varnish by dip, spray, or extrusion on wires
    • Heat curing at staged temperatures to complete imidization and achieve final dielectric strength

    Final product types

    • Enameled copper and aluminum magnet wire
    • Thin-film insulation for high-speed and high-frequency motor windings
    • Transformers for traction and renewable energy
    • Slot liner and interlayer insulation foils

    5. Dielectric Substrates for Flexible Displays

    BPDA-based polyimides contribute high-purity matrix films for next-generation flexible electronic displays and touch panels. Process development teams rely on BPDA to yield polyimides with elevated thermal stability, low yellowing, and consistent optical transmittance. Solution-casting, spin-coating, or inkjet printing of BPDA-polyamic formulations creates thin, uniform alignment layers and flexible substrates, compatible with direct deposition of transparent conductors and organic semiconductors.

    Industry compliance standards

    • IEC 61249-2-21 for flexible base materials
    • RoHS (Restriction of Hazardous Substances)
    • REACH (for monomers and processing solvents)
    • ISO 9001 and ISO 14001 for quality and environmental management during component manufacturing

    Typical usage ratio

    • BPDA formulated at 40–60 mol% in polyamic acid matrix, depending on optical clarity and flexibility needs
    • Adjustment based on final thickness (typically 5–25 μm) and downstream mechanical stress profile

    Downstream process integration

    • Introduction of BPDA during precursor resin batching for flexible substrates
    • Film formation via precision slot-die or spin-coating deposition techniques
    • Thermal imidization under controlled ramp cycles to minimize outgassing and ensure film integrity

    Final product types

    • Flexible OLED and LCD panel substrates
    • Transparent dielectric films for touch sensors and cover layers
    • Alignment films for liquid crystal devices
    • Bendable circuitry backplanes for wearable electronics

    6. Insulation Layers for Semiconductor Packaging

    BPDA provides the aromatic rigidity and planar structure required in polyimide dielectric layers for advanced semiconductor packaging, including chip-scale packaging (CSP), wafer-level chip-scale packaging (WLCSP), and 3D integration. Polyimide resins formulated with BPDA offer high film strength, low moisture uptake, and precise patternability for redistribution layers, passivation, and buffer coatings. Processes involve spin-coating or stencil printing, followed by photopatterning and hard-bake stages tailored to compatibility with fine-line conductor patterning.

    Industry compliance standards

    • JEDEC JESD22-A104 (thermal cycling reliability for device packaging)
    • IPC-4101 for base materials performance
    • SEMI G86 for organic material usage in packaging
    • ISO 14644-1 for cleanroom processing

    Typical usage ratio

    • BPDA loaded at 38–55 mol% in polyamic acid resins for thin dielectric films, balanced with flexible or rigid dianhydrides
    • Formulation refined per device thickness, adhesion and permittivity requirements

    Downstream process integration

    • BPDA introduced in resin mix ahead of solvent adjustment and photoinitiator addition
    • Applied via spin or curtain coating, sometimes by spray in high-density package assembly lines
    • Photopatterned and post-baked in inert or N2 atmosphere to develop final electrical insulation and mechanical protection properties

    Final product types

    • Redistribution layer (RDL) dielectrics for wafer-level CSP
    • Passivation and stress-buffer coatings in silicon interposer modules
    • Thin-film insulation for advanced memory and logic device packaging
    • Micro-electromechanical systems (MEMS) encapsulation layers
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    Certification & Compliance
    More Introduction

    3,3',4,4'-Biphenyltetracarboxylic Dianhydride: From Synthesis to Application

    What We Make and How We Stand By It

    At our core as manufacturers, we take a direct path from raw materials to the creation of 3,3',4,4'-Biphenyltetracarboxylic Dianhydride (BPDA). This molecule, formed by joining two benzene rings each bearing two carboxylic acid anhydride groups at the 3,3',4,4' positions, has earned its place in high-performance polymer chemistry by keeping its promises in both structure and function. Over years of production, many customers have asked about the real-world difference between BPDA and other anhydrides or monomers. We see the answer clearly in the materials that leave our facility—and the end products that reach users.

    BPDA enters the stage with its CAS number 2420-87-3, but the story begins with its aromatic core, which supports tight molecular stacking. This design strengthens the polymers that rely on BPDA for their backbone. In the hands of an operator who understands clean synthesis and precise reaction control, the outcome is an exceptionally pure, fine white or off-white powder, with minimal insoluble content, low metal impurities, and stable handling characteristics. These chemical details, often overlooked by traders or brokers, come under constant test on our shop floor and in the reactors of industrial customers.

    Why BPDA Matters for Polyimides

    BPDA tells its own story through the polymers it creates. It is used most often in the formation of polyimides, a class of polymers recognized for their thermal stability, mechanical toughness, and resistance to solvents. When exposed to high temperatures, BPDA-based polyimide films do not sag, discolor, or lose integrity as quickly as those based on other dianhydrides like pyromellitic dianhydride (PMDA). The rigidity of the biphenyl core, paired with the proper imide linkages, produces a polymer backbone that resists creep and elongation under stress. This is the difference end-users notice when they test for dimensional stability in electronic substrates or flexible printed circuit boards.

    Our experience with large-scale BPDA synthesis and purification shows that even small differences in impurity content—especially iron, copper, or other transition metals—can impact final polymer properties. Polymer manufacturers who receive high-purity BPDA see improved yields in imidization, less foaming, and reduced risk of yellowing. These results come from controlled manufacturing, not from luck or accident.

    Key Features from a Manufacturer’s View

    In day-to-day production, we monitor moisture, acidity, and particulates. BPDA absorbs moisture from the atmosphere, which can compromise its performance in subsequent reactions. Our facility stores the product in sealed containers with desiccation, and we track the time from synthesis to packaging to shipping. By maintaining a clear line of control, we help our customers minimize hydrolysis risk and maximize the reactivity of their monomer. When a technical issue arises, we have found that factory-level details—such as reactor configuration, solvent selection, and filtration protocols—matter more than surface-level specs available to a trader or reseller.

    Most customers who work directly with us adapt the BPDA to their polyamic acid process, blending it with diamines of their choice. Some choose rigid diamines for glasses and films; others use flexible ones for foams or coatings. Across every application, there is a direct correlation between BPDA quality and the final polymer's mechanical strength, dielectric performance, and resistance to aggressive solvents. Our reactors run through constant cleaning cycles to avoid cross-contamination; this real-world diligence is why our BPDA continues to meet consistently tight standards, batch after batch.

    Usage Across Industries

    BPDA earns its spot in advanced electrical insulation films, flexible circuit substrates, and high-temperature adhesives. Film producers favor BPDA’s structural benefits, including its ability to impart low dielectric loss, minimal coefficient of thermal expansion, and retention of optical clarity after thermal cycling. Its presence in copper-clad laminates keeps shrinking circuits reliable as operating frequencies increase. Manufacturers of powder coatings appreciate BPDA for the toughness and gloss retention it provides, even under repeated exposure to industrial chemicals. In specialty fiber and membrane production, we see that BPDA-based materials keep their shape and function far longer than conventional alternatives.

    Aerospace, automotive, and telecommunications engineers push their dielectrics every year, raising the bar for heat resistance and signal fidelity. BPDA has answered these calls by supporting materials that withstand repeated soldering, ionizing radiation, and years of service in harsh environments. Our technical team collects feedback directly from these sectors to inform our ongoing process improvements.

    Differences That Truly Matter

    Newcomers sometimes compare BPDA to other commercial anhydrides without knowing where the real-life differences show up. PMDA, for example, is easier to source in many markets and can cost less, but its resulting films and coatings often show greater brittleness and are prone to curling or cracking in thin sections. BPDA, by contrast, allows for the design of thicker, more mechanically robust sheets. Its biphenyl bridge deters chain folding, leading to higher glass transition temperatures and sustained performance at elevated service temperatures.

    We have tracked field reports from customers who made direct comparisons. They often upgrade to BPDA-based films when other polyimides fail at soldering or thermal cycling stages. Once their engineers experience the improvement in warpage resistance and overall part yield, it becomes clear that not all dianhydrides solve the same problems. Technical teams in semiconductor fabrication, for instance, have documented lower dielectric loss and signal attenuation in BPDA-derived interlayer dielectrics used on high-frequency substrates.

    Some manufacturers try to blend BPDA with other dianhydrides to strike a balance between cost and performance. Results vary, but even in blended polyimides, the fraction of BPDA present directly influences thermal and mechanical characteristics. Our own process expertise lets us advise clients on these blends, having seen their outcomes both in pilot plant settings and on commercial production lines.

    Purity Is a Practical Challenge

    From a manufacturing standpoint, BPDA’s performance comes down to more than molecular structure. Purity and process cleanliness have a clear, direct effect on downstream applications. Unreacted acids, trace metals, and residual solvents impair polymerization, leading to rejection of entire film batches or circuit laminates. To prevent these losses, we devote considerable time to purification steps and analytical verification, coupling high-efficiency filtration with chromatographic monitoring of byproducts.

    Customers who source BPDA from unproven suppliers sometimes report off-spec color, excess insolubles, or uneven dissolve rates. We have received these calls and troubleshot contaminated lots in many factories. Over time, the feedback loop with direct users has taught us how critical it is to keep the process tight from raw material acceptance through final handling.

    This is also why we openly share production and testing protocols with our technical partners, giving them clear expectations on delivery, shelf life, and performance limits. In laboratory or development settings, minor impurities may seem unimportant, but as scale increases, these flaws multiply, raising costs and delaying launches. Our technical support team collaborates with R&D customers to troubleshoot early-stage failures before they reach production scale.

    Focus on Environmental and Handling Concerns

    Working hands-on with BPDA, we address environmental impact and operator safety. The product's tendency to generate dust, coupled with its irritant properties, means that careful packaging and handling protocols are not just recommendations but necessary steps to protect workers and facilities. Modern plants invest in local exhaust, closed transfer systems, and personal protective equipment—feedback we receive directly from safety officers who audit our facility and those who receive our shipments.

    Disposal of waste and off-cuts from BPDA-based polymers presents a real-world challenge, especially as end users face stricter regulations on incineration and landfill. We work with downstream partners on recycling and repurposing options, seeking to keep as much material as possible in productive use. The drive to reduce environmental footprint isn’t abstract for us; we track solvent recovery, energy consumption, and scrap rates as part of our daily routines.

    Thinking Ahead: Future Directions in BPDA Manufacturing

    BPDA’s established track record does not stop us from seeking improvement. Over the last decade, we have invested in continuous-flow synthesis technologies, which offer tighter reaction control, safer scale-up, and lower waste generation compared to older batch processes. These new systems, operated by experienced chemists and engineers, let us fine-tune reaction times, temperatures, and purification steps in ways not possible in large, open reactors.

    Our research partners explore ways to functionalize BPDA’s aromatic rings or create hybrid monomers that combine its favorable properties with new performance attributes. For instance, some teams focus on introducing specific side-chains or bridges to further raise glass transition temperatures or impart unique electrical characteristics. We support these efforts by supplying specialty grades with tailored particle sizes or customized impurity profiles—the result of open dialogue and years of practical experience.

    From a logistical perspective, we adjust order volumes and shipping methods to suit small-batch R&D labs and full-scale factories alike. We see downstream users innovating not just in what they make but in how they handle, transform, and repurpose byproducts. Many of our technical discussions now revolve around circular manufacturing and sustainable sourcing.

    What Long-Term Partnerships Mean to Us

    Decades of manufacturing BPDA have cemented relationships that go beyond transactional supply. Technicians and engineers on both sides of the aisle share real-world feedback—often in the form of sample returns, plant visits, and collaborative investigations. We learn which impurities, particle distributions, or thermal behaviors really matter as new applications emerge. This exchange of knowledge enables smarter, faster adjustments in both manufacturing and application.

    In cases where application requirements stretch beyond the capabilities of existing products, we have worked side-by-side with customers on new process chemistries, feeding what we learn back into upgrades in cleaning, synthesis, or logistics. For every kilo shipped, there is a legacy of exchanged technical bulletins, test reports, and troubleshooting sessions that populate our archives and guide our next steps.

    Regulatory compliance is a fact of life, not an afterthought. We track evolving legal requirements across jurisdictions, adapting documentation and product registrations as needed. This solid footing helps end users maintain their own standards, particularly in fields such as aerospace or medical devices, where auditability and traceability go hand in hand with material choice.

    Reflections from the Production Floor

    Here, a product like 3,3',4,4'-Biphenyltetracarboxylic Dianhydride is more than a commodity or a technical bullet point. Each lot reflects months of planning, daily hands-on work, and fresh learning handed on to the next generation of operators. We see the results in finished polyimide films that line the circuits of a new chip, bear the loads in spacecraft insulation, or coat the fibers in next-generation membranes.

    In every shipment, we carry a shared understanding of what BPDA delivers: higher tolerance for heat, longer life in service, fewer failures, and creative freedom for polymer designers. These insights come directly from our own production facility and from thousands of conversations with those who push the limits of applied chemistry. For our team, each success and setback in production is a learning opportunity that drives improvement and shapes the future uses of this essential chemical.

    Connecting Experience and Performance

    The difference between a successful BPDA application and an underperforming one can be traced back to critical choices along the production chain. Sourcing, synthesis routes, real-world troubleshooting, and a shared pursuit of quality link our manufacturing plant with some of the most demanding users of high-performance materials. We view BPDA as a tool: refined, handled, and improved with every batch, which brings new challenges and opens fresh possibilities in specialty plastics technology. The story of BPDA continues to unfold, shaped by hands-on experience and the steady pursuit of chemical excellence.