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2-Propylimidazole

    • Product Name 2-Propylimidazole
    • Alias 2-Propyl-1H-imidazole
    • Einecs 219-003-7
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    VTB
    Specifications

    HS Code

    750642

    Cas Number 2887-79-8
    Molecular Formula C6H10N2
    Molar Mass 110.16 g/mol
    Iupac Name 2-Propyl-1H-imidazole
    Appearance Colorless to pale yellow liquid
    Boiling Point 207-209 °C
    Density 0.98 g/cm³
    Melting Point -5 °C
    Solubility In Water Miscible
    Purity Typically ≥98%
    Refractive Index 1.496
    Flash Point 101 °C
    Synonyms 2-Propylimidazole; 2-Propyl-1H-imidazole

    As an accredited 2-Propylimidazole factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing 250g of 2-Propylimidazole is packaged in a sealed amber glass bottle with a screw cap and safety labeling for laboratory use.
    Shipping 2-Propylimidazole is shipped in tightly sealed containers, protected from moisture and incompatible substances. It should be packaged according to local, national, and international regulations for hazardous chemicals. Transport in a cool, well-ventilated area with proper labeling ensures safety during transit. Handle with gloves and eye protection during loading and unloading.
    Storage 2-Propylimidazole should be stored in a tightly sealed container, in a cool, dry, and well-ventilated area away from incompatible substances such as strong oxidizers. Protect it from moisture and direct sunlight. Use proper personal protective equipment when handling the chemical and ensure that it is clearly labeled. Store at room temperature and follow all relevant safety guidelines and regulations.
    Application of 2-Propylimidazole

    Applications of 2-Propylimidazole in Industrial Manufacturing

    2-Propylimidazole plays an established role as a specialty intermediate and functional additive in specific advanced material sectors. Its use is anchored in stringent industry protocols, process-specific dosing, and closely monitored integration steps within value-added chemical manufacturing environments.

    1. Curing Accelerator in Epoxy Resin Systems for Electrical Encapsulation

    Epoxy system formulators leverage 2-Propylimidazole as a highly selective curing accelerator for electrical and electronic potting compounds, where controlled reactivity and minimal side-product generation are required. The material enters the formulation phase to provide a high degree of process latitude in multi-component resin/hardener systems, enabling rapid throughput while securing dimensional and dielectric stability demanded by critical encapsulation applications.

    Industry compliance standards

    • UL 94 (Flammability of Plastic Materials for Parts in Devices and Appliances)
    • IEC 60695 (Fire Hazard Testing for Electrical Insulation)
    • RoHS Directive 2011/65/EU (Restriction of Hazardous Substances in Electrical/Electronic Equipment)
    • REACH Regulation (EC) No 1907/2006 (Registration, Evaluation, Authorization and Restriction of Chemicals)

    Typical usage ratio

    • Commonly 0.1–0.4 wt% relative to total resin mass; tuning depends on resin molecular weight, prepolymer selection, and target curing speed at operation temperature

    Downstream process integration

    • Blended directly into the epoxy binder during premix, prior to hardener or catalyst addition; disperses at 40–60°C for uniform distribution; batch compounded by vacuum degassing to limit entrained gases

    Final product types

    • Encapsulants for printed circuit board (PCB) modules
    • High-voltage transformer castings
    • Electronic relay sealing resins
    • Insulating potting gels for power device modules

    2. Corrosion Inhibitor Additive for Waterborne Metalworking Fluids

    Formulators in the metalworking fluid sector utilize 2-Propylimidazole as a multi-metal corrosion inhibitor in synthetic and semi-synthetic aqueous concentrates. The compound enhances ferrous and non-ferrous protection during high-speed machining, rolling, or cutting, extending sump life and tool durability. Dosage must balance inhibitory strength with top-up interval planning and biocidal stability in continuous operation facilities.

    Industry compliance standards

    • ASTM D4627 (Iron Chip Corrosion Test for Water-based Fluids)
    • ISO 6743-7 (International Classification of Lubricants for Metalworking)
    • OSHA 29 CFR 1910.1200 (Hazard Communication Standard)
    • VOC Compliance under EU Directive 2010/75/EU

    Typical usage ratio

    • 0.2–0.7 wt% of finished concentrate, variable by water hardness, pH stability, and metal type processed; adjusted after field corrosion testing

    Downstream process integration

    • Incorporated post-neutralization in final blending stage, after emulsifiers are added; mixing at ambient or mildly elevated temperature under agitation to ensure solubilization without stratification

    Final product types

    • Water-dilutable cutting fluids for multi-metal operations
    • Chemical milling solutions for stainless and aluminum alloys
    • Synthetic coolant concentrates for automated metalforming systems
    • Anti-corrosion tank maintenance additives

    3. Catalytic Intermediate in Pharmaceutical API Synthesis

    Chemical synthesis departments employ 2-Propylimidazole as an organocatalyst or ligand precursor in validated multi-step API manufacturing lines, notably in azole-based antifungal or anti-inflammatory agent pathways. The material enhances reaction specificity during intermediate coupling or cyclization, supporting batch-to-batch reproducibility under GMP oversight.

    Industry compliance standards

    • ICH Q7 (Good Manufacturing Practice Guide for APIs)
    • USP–NF (United States Pharmacopeia—National Formulary)
    • European Pharmacopoeia (Ph. Eur.) Guidelines for Intermediates
    • 21 CFR Part 211 (Current Good Manufacturing Practice for Finished Pharmaceuticals)

    Typical usage ratio

    • 0.05–0.2 molar equivalents relative to substrate concentration in catalytic or ligand roles; level determined by target reaction yield, time, and absence of catalyst carry-over

    Downstream process integration

    • Charged as an in situ reagent in closed-loop reactor trains following substrate dissolution and solvent charge; depleted and/or removed during aqueous workup before downstream purification/filtration

    Final product types

    • Pharmaceutical azole derivatives (active pharmaceutical ingredients)
    • Intermediates for veterinary antimicrobials
    • Key intermediates in anti-inflammatory drug synthesis

    4. Curing Agent Modifier in Polyurethane Adhesives for Electronics Assembly

    Manufacturers of single- and two-part polyurethane adhesives introduce measured quantities of 2-Propylimidazole to achieve targeted cure profiles, peel strength, and chemical resistance in high-reliability electronics and micro-assembly adhesives. Integration supports the formation of consistent bondlines and reduces surface tack under accelerated assembly schedules without promoting yellowing during long-term aging.

    Industry compliance standards

    • IPC-A-610 (Acceptability of Electronic Assemblies)
    • IEC 61249-2-21 (Materials for Printed Boards and Other Interconnecting Structures)
    • ISO 10993 (Biological Assessment for Medical Device Adhesives, when relevant)
    • GHS (Globally Harmonized System for Labelling and Safety)

    Typical usage ratio

    • 0.03–0.12 wt% relative to total binder, modulated in response to isocyanate grade, adhesive pot life, and working time requirements

    Downstream process integration

    • Added during polyol blend-up or final mixing before isocyanate addition; shear-mixed to homogeneity under controlled exotherm conditions to avoid localized overcuring

    Final product types

    • Microelectronic chip attachment adhesives
    • Surface mount device (SMD) bonding pastes
    • Flexible printed circuit glues
    • Sensor encapsulation adhesives
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