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2-Hydroxy-3-Methoxybenzyl Alcohol

    • Product Name 2-Hydroxy-3-Methoxybenzyl Alcohol
    • Alias o-Vanillyl alcohol
    • Einecs 224-508-6
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    VTB
    Specifications

    HS Code

    180590

    Chemical Name 2-Hydroxy-3-Methoxybenzyl Alcohol
    Cas Number 932-28-9
    Molecular Formula C8H10O3
    Molecular Weight 154.17 g/mol
    Appearance White to off-white solid
    Boiling Point 334.5 °C at 760 mmHg
    Melting Point 71-73 °C
    Density 1.202 g/cm3
    Solubility In Water Slightly soluble
    Smiles COC1=CC=CC(=C1O)CO
    Inchi InChI=1S/C8H10O3/c1-11-8-3-2-6(5-9)4-7(8)10/h2-4,9-10H,5H2,1H3
    Pubchem Cid 146797

    As an accredited 2-Hydroxy-3-Methoxybenzyl Alcohol factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing 250g of 2-Hydroxy-3-Methoxybenzyl Alcohol supplied in a sealed amber glass bottle with a tamper-evident cap and clear labeling.
    Shipping **Shipping description for 2-Hydroxy-3-Methoxybenzyl Alcohol:** Ship in tightly sealed containers, protected from light and moisture. Maintain at ambient temperature, ensuring proper labeling as a laboratory chemical. Follow all applicable regulations, including appropriate documentation and hazard communication. Avoid excessive heat and incompatible substances during transit to ensure product integrity and safety.
    Storage 2-Hydroxy-3-methoxybenzyl alcohol should be stored in a tightly closed container, in a cool, dry, and well-ventilated area away from sources of ignition and incompatible substances such as strong oxidizing agents. Protect from moisture and direct sunlight. Use appropriate chemical-resistant containers and ensure good labeling. Follow all relevant safety guidelines and local regulations for chemical storage.
    Application of 2-Hydroxy-3-Methoxybenzyl Alcohol

    Applications of 2-Hydroxy-3-Methoxybenzyl Alcohol in Industrial Manufacturing

    2-Hydroxy-3-Methoxybenzyl Alcohol serves as a key intermediate in several high-value industrial sectors. Its unique molecular structure and functional groups support diverse synthesis pathways and performance requirements across multiple downstream applications. The following sections outline real-world scenarios, processing expectations, compliance benchmarks, and finished goods derived from this material.

    1. Pharmaceutical Intermediates in Active Pharmaceutical Ingredient (API) Synthesis

    API manufacturers use this phenolic alcohol as a building block in the preparation of selective central nervous system (CNS) drugs, anti-inflammatory agents, and cardiovascular medications due to its reactivity in etherification and esterification reactions. Its hydroxyl and methoxy moieties enable fine control of intermediate purity and chirality. Integration within synthesis routes targets stepwise modifications under stringent GMP guidelines to ensure bioactive compound quality.

    Industry compliance standards

    • ICH Q7 Good Manufacturing Practice for Active Pharmaceutical Ingredients
    • European Pharmacopoeia Monograph References
    • United States Pharmacopeia (USP) General Notices & Requirements
    • Health Canada Guidance Document: Non-Sterile Pharmaceuticals

    Typical usage ratio

    • Generally used at 5-20% molar basis relative to the core pharmaceutical scaffold, adjusted according to target compound structure and reaction pathway optimization

    Downstream process integration

    • Introduced during the initial or mid-stage of multi-step chemical synthesis; integrated via alkylation, reduction or oxidation reactions depending on the final API route

    Final product types

    • Neuroprotective agents
    • Anti-hypertensive drugs
    • Non-steroidal anti-inflammatory drugs (NSAIDs)
    • Pharmaceutical intermediates for contract manufacturing organizations (CMOs)

    2. Fine Fragrance and Aroma Chemical Manufacturing

    Fragrance houses and aroma chemical producers value this compound as a fragrance modifier and starting molecule for synthesizing vanillic and guaiacol derivatives. Its structural similarity to natural phenols enables formulation flexibility for nuanced odor notes, particularly in luxury perfumes and flavorings. Controlled reactivity helps meet allergen declaration and purity limits under the latest IFRA guidelines.

    Industry compliance standards

    • IFRA (International Fragrance Association) Standards and Amendments
    • EU Cosmetics Regulation (EC) No. 1223/2009 on ingredient usage
    • ISO 9235:2013 Aromatic Natural Raw Materials
    • Food Chemicals Codex (FCC) for flavor use

    Typical usage ratio

    • Fragrance component concentrations usually range from 0.05% to 1.2% in finished essence blends; exact ratio determined by desired olfactive profile and regulatory thresholds.

    Downstream process integration

    • Directly blended into reaction mixtures during the aroma synthesis stage or post-processed into aldehyde and ester derivatives prior to final compounding

    Final product types

    • Fine perfumes
    • Luxury fragrances for personal care applications
    • Food-grade flavoring ingredients
    • Specialty aroma chemicals for household products

    3. UV-Absorber Production for Polymer Stabilization

    Producers of light-stabilizing additives employ this benzyl alcohol as a precursor for synthesizing advanced UV-absorbers and light stabilizers incorporated in engineering plastics. Its aromatic core and phenolic structure improve polymer durability against photodegradation, extending the service life of automotive components, construction materials, and packaging films. The material must comply with polymer additive-specific purity and migration criteria.

    Industry compliance standards

    • REACH Regulation (EC) No. 1907/2006 on chemicals and their safe use
    • EU Regulation (EU) No. 10/2011 on plastic materials and articles intended to come into contact with food
    • ASTM D5208 for evaluating UV stability of polymers
    • GMP for manufacture of food contact materials (EU 2023/2006)

    Typical usage ratio

    • Feeds into additive syntheses at 0.2–8% by weight depending on the performance targets of the intended stabilizer and final plastic application

    Downstream process integration

    • Used as a functional intermediate in the condensation or esterification phase before final compounding into polymer masterbatches or additive concentrates

    Final product types

    • UV-absorber additives
    • Hindered amine light stabilizers (HALS)
    • Masterbatch compounds for PP, PE, PET, ABS
    • Light-resistant automotive trim and outdoor furniture components

    4. Phenolic Resin Modification in Electronics Encapsulation

    Manufacturers in the electronics sector utilize this material to modify phenolic resins used for encapsulating semiconductor devices, capacitors, and printed circuit boards (PCBs). Its incorporation optimizes cross-link density, flow, and thermal stability, which are essential for high-reliability electronic packages. Usage requires strict tracking of extractables, ionic contamination, and dielectric performance as defined by electronics QC protocols.

    Industry compliance standards

    • IEC 61249-2-7 for base materials for printed boards
    • IPC-4101C Specification for Base Materials for Rigid and Multilayer Printed Boards
    • RoHS Directive 2011/65/EU (Restriction of Hazardous Substances)
    • JIS C5016 for encapsulation materials

    Typical usage ratio

    • Introduced at 0.5–6 phr (parts per hundred resin) into the resin mixture depending on mechanical and dielectric property requirements

    Downstream process integration

    • Added during the resin prepolymerization or compounding phase to adjust cross-linking activity ahead of curing, improving final encapsulant properties

    Final product types

    • Electronic encapsulants for semiconductors
    • Phenolic-molded chip carriers
    • Resin-coated PCB substrates
    • Electronics-grade adhesive formulations
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