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2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole

    • Product Name 2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole
    • Alias BND
    • Einecs 250-185-1
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
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    Specifications

    HS Code

    637319

    Chemical Name 2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole
    Cas Number 40817-52-1
    Molecular Formula C22H14N2O
    Molecular Weight 322.36 g/mol
    Appearance White to off-white powder
    Melting Point 242-244 °C
    Solubility Insoluble in water, soluble in organic solvents (e.g., dichloromethane, chloroform)
    Purity Typically >98%
    Boiling Point Decomposes before boiling
    Density 1.31 g/cm³ (calculated)
    Structure Aromatic oxadiazole core with two 1-naphthyl groups at 2,5-positions
    Common Uses Organic electroluminescent materials, OLEDs, fluorescence studies

    As an accredited 2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The 10-gram package features a sealed amber glass bottle labeled "2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole," with hazard symbols and batch details.
    Shipping 2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole is shipped in tightly sealed containers, protected from light and moisture. It is transported as a non-hazardous chemical under standard conditions, following relevant safety guidelines. Ensure labeling with chemical name, batch number, and handling precautions. Store in a cool, dry location during transit to maintain quality.
    Storage **2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole** should be stored in a tightly sealed container in a cool, dry, and well-ventilated area, away from direct sunlight and sources of ignition. Keep it separate from strong oxidizing agents, acids, and bases. Ensure proper labeling, and avoid exposure to moisture. Use appropriate personal protective equipment when handling to minimize risks.
    Application of 2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole

    Applications of 2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole in Industrial Manufacturing

    2,5-Bis(1-Naphthyl)-1,3,4-Oxadiazole serves as a specialized intermediate and performance material in advanced optoelectronic manufacturing sectors. As the original producer, we supply this compound for specific downstream areas where its photophysical properties and chemical stability deliver critical value for advanced product development. The following application scenarios illustrate how downstream manufacturers integrate our raw material into their processes and products.

    1. Organic Light Emitting Diodes (OLED) Emission Layer Materials

    Manufacturers of OLED panels use this molecule as an electron transport and emission host in the fabrication of high-brightness display stacks for consumer electronic screens. Its strong electron mobility and optimized energy levels support high quantum efficiency and color purity when dispersed in polymeric or small molecule hosts. Producers tune the material load depending on color emission targets and device layer architecture, integrating it during vacuum deposition or solution spin-coating operations.

    Industry compliance standards

    • IEC 62341 (OLED Display Device Performance and Safety)
    • RoHS Directive (2011/65/EU) for Restriction of Hazardous Substances
    • ISO/IEC 17025 for laboratory process control
    • UL 8750 (Safety of LED Equipment)

    Typical usage ratio

    • 5–15% by weight in the emission layer formulation. Manufacturers select the ratio based on target device efficiency and color point, with higher levels supporting improved electron transport but requiring careful optical tuning.

    Downstream process integration

    • Compound is dissolved or co-evaporated with host and guest emitters during vacuum deposition of thin film stacks onto indium tin oxide (ITO) coated glass for display or lighting devices.

    Final product types

    • Active-matrix OLED panels (smartphones, TVs, monitors)
    • OLED lighting tiles and architectural lighting modules
    • Microdisplay panels for AR/VR applications

    2. Organic Photovoltaic (OPV) Electron Transport Layers

    Producers of flexible organic solar cells adopt this oxadiazole derivative as an electron transport component in multi-layered thin-film stacks. Its high electron affinity and morphological stability improve charge separation efficiency under illumination, supporting higher energy conversion yields in polymer bulk heterojunction solar devices. Integrators manage the addition depending on the donor–acceptor system selected and adjust for process compatibility with roll-to-roll manufacturing.

    Industry compliance standards

    • IEC 61215-1:2016 (Photovoltaic Module Design Qualification)
    • EN 50530 (Solar Panel Performance Assessment)
    • REACH Regulation (EC 1907/2006) for chemical safety data
    • Environmental management under ISO 14001

    Typical usage ratio

    • 2–6% by weight in the stack’s electron transport layer or as a blend additive. The adjustment depends on device thickness and blend morphology for optimizing charge transport balance.

    Downstream process integration

    • Material is mixed into organic thin-film solutions for spin-coating, slot-die coating, or doctor blade deposition onto flexible substrates, followed by annealing and electrode lamination.

    Final product types

    • Flexible thin-film photovoltaic modules
    • Rollable or lightweight solar panels for portable electronics
    • BIPV (building integrated photovoltaic) films

    3. Electroluminescent Device Host Layers

    Producers of organic electroluminescent devices—including some specialty signage and instrumentation—incorporate this material as a host matrix in the active layer to enhance electron injection and broaden emission spectra. Its chemical compatibility with typical luminescent dopants and capacity to form stable amorphous films support reliable product life in field applications where consistent brightness and color stability are critical.

    Industry compliance standards

    • EN 50107 (Lighting—Electroluminescent Device Performance)
    • WEEE Directive (2012/19/EU) for Electrical and Electronic Equipment Waste
    • QS9000/ISO9001 for production quality management
    • IEC 60598-1 (General Lighting Luminaires—Safety)

    Typical usage ratio

    • 10–30% mass fraction in solution-processed device layers, adjusted based on required brightness and emission wavelength tuning.

    Downstream process integration

    • Dissolved in organic solvents with co-host lattices and applied using screen printing or spray coating before device assembly and electrode application.

    Final product types

    • Flat-panel electroluminescent indicator lamps
    • Specialty instrument display modules
    • Flexible signage and backlighting elements

    4. Organic Field-Effect Transistor (OFET) Active Semiconducting Components

    In organic electronics for sensors and logic circuits, device manufacturers deploy this compound as the electron-transporting semiconducting layer. Its molecular geometry and electron affinity facilitate high carrier mobility and switching speeds in thin-film transistor arrays, where consistency in film morphology and ambient stability determine circuit performance. Producers scale usage to transistor density and form factor across rigid and flexible device platforms.

    Industry compliance standards

    • JEITA EIAJ ED-4701/201B (OFET Characterization Methods)
    • ISO 14644-1 (Cleanroom Process Control)
    • IEC 60068 (Environmental Testing for Electronics)
    • RoHS & REACH compliance for electronics assembly

    Typical usage ratio

    • 5–12 mg/cm² film deposition density, set during process tuning for mobility and threshold voltage targets across OFET architectures.

    Downstream process integration

    • Deposited via vacuum thermal evaporation or inkjet printing onto patterned dielectric substrates, then encapsulated for device stability.

    Final product types

    • Flexible sensor arrays and RFID circuits
    • TFT (thin film transistor) backplanes for flexible displays
    • Organic logic ICs for IoT applications
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