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2,2-Bis(4-Carboxyphenyl)Hexafluoropropane

    • Product Name 2,2-Bis(4-Carboxyphenyl)Hexafluoropropane
    • Alias Bisphenol AF dicarboxylic acid
    • Einecs 246-242-6
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry sales7@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
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    Specifications

    HS Code

    144684

    Chemical Name 2,2-Bis(4-Carboxyphenyl)Hexafluoropropane
    Molecular Formula C17H10F6O4
    Molecular Weight 410.25 g/mol
    Cas Number 1107-00-2
    Appearance White to off-white powder
    Melting Point 285-290°C
    Solubility Insoluble in water, soluble in organic solvents
    Purity Typically ≥98%
    Density 1.56 g/cm³ (approximate)
    Boiling Point Decomposes before boiling
    Synonyms Hexafluoropropane bis (carboxyphenyl), Biscarboxylic acid BPAF
    Storage Temperature Room temperature, dry conditions
    Smiles C1=CC(=CC=C1C(C(F)(F)F)(C2=CC=C(C=C2)C(=O)O)C(=O)O)
    Inchi InChI=1S/C17H10F6O4/c18-17(19,20)16(13-3-7-11(8-4-13)15(25)26,14-5-9-12(10-6-14)15(25)26

    As an accredited 2,2-Bis(4-Carboxyphenyl)Hexafluoropropane factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Amber glass bottle, 25 grams, screw cap, white label with black text: chemical name, CAS number, hazard pictograms, supplier details.
    Shipping 2,2-Bis(4-Carboxyphenyl)Hexafluoropropane is typically shipped in sealed, labeled containers to prevent moisture ingress and contamination. It should be transported as a non-hazardous solid under ambient conditions. Ensure packaging complies with regulations and provides adequate protection against damage. Store in a cool, dry place, away from incompatible substances during transit.
    Storage 2,2-Bis(4-Carboxyphenyl)hexafluoropropane should be stored in a tightly sealed container, protected from moisture and light, in a cool, dry, well-ventilated area. Avoid exposure to incompatible substances such as strong bases and oxidizing agents. Keep the storage temperature below 25°C. Ensure that the storage area is clearly labeled and complies with appropriate chemical safety regulations.
    Application of 2,2-Bis(4-Carboxyphenyl)Hexafluoropropane

    Applications of 2,2-Bis(4-Carboxyphenyl)Hexafluoropropane in Industrial Manufacturing

    2,2-Bis(4-Carboxyphenyl)Hexafluoropropane plays a critical role in several advanced manufacturing sectors. Our production facilities supply this material to specialized downstream industries where purity, chemical structure, and traceability are tightly controlled. Below are detailed application scenarios, with sector-specific details on standards, practical formulation rates, process integration points, and the nature of the resulting products.

    1. High-Performance Polyimide Resin Synthesis

    This raw material serves as a core dianhydride substitute or comonomer for producing colorless and transparent polyimide resins. Manufacturers select it to improve thermal stability and optical transmittance, vital for flexible printed circuit boards and optoelectronic substrates. The fluorinated structure reduces dielectric constants, key for low-loss electronic components. Quality assurance demands full traceability on monomer batch history and impurity levels to ensure film performance meets industry requirements.

    Industry compliance standards

    • IPC-4101B for base materials in printed circuit boards
    • IEC 61249-2-7 for insulation material specifications
    • RoHS 3 (EU 2015/863) for restricted hazardous substances
    • ISO 9001:2015 for quality management in material supply

    Typical usage ratio

    • 10–30% molar ratio of total dianhydride or dianhydride-analog content, dependent on resin target properties
    • Adjustments according to flexibility, glass transition temperature, and dielectric property requirements

    Downstream process integration

    • Directly charged into polymerization reactors during polyimide prepolymer (polyamic acid) synthesis
    • Added at the monomer mixing stage with diamines before imidization
    • Material supply organized as solid or dissolved intermediates to match batch or continuous reactor set-ups

    Final product types

    • Flexible copper clad laminates (FCCL)
    • Flexible printed circuit boards (FPCBs)
    • Transparent polyimide films for displays and touch panels
    • Low-k substrates for high-frequency microelectronics

    2. Specialty Polyester Engineering Plastics

    The chemical’s carboxylic acid and fluorinated backbone improve hydrolytic and chemical resistance in high-grade polyesters used for precision components. These features increase dimensional stability and surface quality for parts operating in automotive electronics and specialty wiring. Consistency in supply and particle size distribution matters for extrusion and injection molding reliability in automated lines.

    Industry compliance standards

    • ISO 1874-1:2010 for thermoplastic polyesters — polyarylates
    • UL 94 for plastics flammability
    • ISO 14001 for environmental management in production
    • TS 16949 for automotive applications (where relevant)

    Typical usage ratio

    • 8–20% by weight in total dicarboxylic acid feed during polyester polymerization
    • Proportion varies based on target crystallinity and end-use exposure criteria

    Downstream process integration

    • Introduced with other aromatic dicarboxylic acids into polycondensation reactors
    • Feeds timed to minimize pre-reaction and maintain molecular weight control
    • Material pre-drying standardized to reduce hydrolysis risk

    Final product types

    • High-durability electrical connectors
    • Sensor housings for automotive applications
    • Precision wire insulation sheaths
    • Advanced fiber spools for industrial textiles

    3. Fluorinated Epoxy Resin Curing Agents

    This biphenyl hexafluoropropane derivative finds use as an acid hardener or modifier in custom epoxy formulations, designed to withstand aggressive chemical environments and provide high transmission in optical adhesives. The material’s carboxy functionality allows for controlled cross-linking with formulated epoxides, producing resins for photonics and specialty coatings. Manufacturer-supplied purity documentation is audited as part of QC routines for resin clarity and performance.

    Industry compliance standards

    • ASTM D1655-20 for epoxy resins and composites
    • EN 45545-2 for fire performance in rail transport uses
    • REACH Annex XVII for chemical safety
    • ISO 9001 for batch traceability in chemical supply

    Typical usage ratio

    • 5–25% by weight as hardener agent relative to total epoxy resin solids
    • Adjusted to enhance specific mechanical, thermal, or optical properties as defined by final use

    Downstream process integration

    • Blended as a curing agent during resin compounding or prior to casting/molding
    • Added to two-component epoxy systems under controlled temperature and stirring
    • Material supplied in pre-measured packaging to ensure ratio accuracy by downstream user

    Final product types

    • High-transparency optical adhesives
    • Light guide panels for electronic displays
    • Chemically resistant coatings for laboratory equipment
    • Fiber optic sealing resins

    4. Monomer for Fluorinated Poly(arylene ether ketone) (FAEK) Polymers

    2,2-Bis(4-Carboxyphenyl)Hexafluoropropane enables the synthesis of specialty FAEK polymers with superior fire retardancy, moisture resistance, and processability for aerospace and semiconductor handling equipment. FAEKs formulated with this monomer achieve precise control over dielectric properties, matching the needs of advanced wafer carriers and electronic housing. Full documentation of synthesis traceability and chemical characterization is maintained for OEM approval procedures.

    Industry compliance standards

    • UL 94 V-0/V-1 for flame resistance of plastic materials
    • EN 60384-2 for dielectric materials in capacitors
    • AS9100D for aerospace industry materials
    • ISO 10993 for part compatibility with electronic-grade requirements

    Typical usage ratio

    • 10–35% molar ratio of total acid content in FAEK copolymerization
    • Fine-tuned according to load-bearing and insulating function targets

    Downstream process integration

    • Fed into polycondensation with bisphenol and ether-containing comonomers under vacuum or inert gas
    • Monomer purity maintained to under 0.05% volatile acid residues for high-yield processing
    • Blends prequalified for targeted molecular weight distributions

    Final product types

    • Aerospace cable insulators
    • Semiconductor wafer carriers
    • Cleanroom tool components
    • Energy storage module insulation plates

    5. Non-Hydrolyzable Additives for Liquid Crystal Alignment Layers

    Used by display manufacturers as a performance additive for polyimide or copolyester-based liquid crystal alignment layers, this material enhances surface energy uniformity and inhibits moisture-induced degradation. Control of additive rate and dispersion is critical for reliable alignment capability in large-format TFT and OLED panel lines. Material consistency is confirmed by FTIR, HPLC, and particle size analysis in supplied technical dossiers.

    Industry compliance standards

    • IEC 61747-1 for LCD device requirements
    • RoHS and SVHC declaration for all screen materials
    • ISO 14644 for cleanroom production compliance
    • JIS C 5102 for display adhesion properties

    Typical usage ratio

    • 2–8% by weight as a functional additive in alignment layer matrix
    • Adjusted according to display pixel density and production method (spin, slit, or spray coating)

    Downstream process integration

    • Premixed into pre-polymer solutions for alignment films
    • Dispersion and viscosity profile controlled by simultaneous heating and shearing
    • Applied prior to rubbing or photo-alignment steps

    Final product types

    • Thin-film transistor (TFT) LCD panels
    • AMOLED and microLED display modules
    • Large-format digital signage displays
    • Flexible e-paper substrates

    6. Modifier for Medical-Grade Membrane Materials

    In medical device applications, particularly for blood separation and diagnostic membranes, this compound offers low-leachable characteristics when copolymerized in engineering polyesters and copolyimides. Facilities request strict batch control and biocompatibility verification for all medical materials, and production follows cGMP guidelines with dedicated medical-grade manufacturing zones. Full traceability and documentation are required for all delivered lots.

    Industry compliance standards

    • ISO 13485:2016 for medical device quality management
    • USP Class VI for biocompatibility
    • 21 CFR 820 for US FDA device production
    • European Medical Device Regulation (MDR) 2017/745 Annex I

    Typical usage ratio

    • 5–15% by weight of total monomer mass in copolymer membrane synthesis
    • Ratio fine-tuned based on permeability and extractable control

    Downstream process integration

    • Charged during polycondensation or in membrane dope solution blending step
    • Material handled in GMP-clean production areas to prevent contamination
    • Processing parameters logged and verified in production batch records

    Final product types

    • Hemodialysis membrane rolls
    • Blood filtration and plasma separation devices
    • Diagnostic microfluidic chip layers
    • Medical sampling and filtration cartridges
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