Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing admin@sinochem-nanjing.com 3389378665@qq.com
Follow us:

2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane

    • Product Name 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane
    • Alias Bis-AF
    • Einecs 401-780-3
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    VTB
    Specifications

    HS Code

    104161

    Chemicalname 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane
    Casnumber 120068-76-6
    Molecularformula C27H20F6N2O2
    Molecularweight 516.45 g/mol
    Appearance White to off-white powder
    Meltingpoint 130-135°C
    Solubility Slightly soluble in common organic solvents
    Boilingpoint Decomposes before boiling
    Density 1.39 g/cm³ (approximate)
    Purity ≥ 98%
    Functionalgroups Amine, Ether, Aromatic, Trifluoromethyl
    Storagetemperature 2-8°C
    Synonyms 6F-BAPP, Bis(aminophenoxyphenyl)hexafluoropropane
    Smiles CC(C1=CC=C(OCC2=CC=C(C3=CC=C(N)C=C3)C=C2)C=C1)(F)(F)C(F)(F)F

    As an accredited 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing A 25-gram amber glass bottle with screw cap, labeled "2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane," includes safety and handling instructions.
    Shipping The chemical *2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane* is typically shipped in sealed, chemical-resistant containers, protected from moisture and light. Transport complies with local, national, and international regulations. Proper labeling, documentation, and handling precautions—including use of gloves, goggles, and ventilation—are essential to ensure safe shipment and delivery of this specialty chemical.
    Storage 2,2-Bis[4-(4-Aminophenoxy)phenyl]hexafluoropropane should be stored in a tightly sealed container, protected from light, moisture, and air. Keep it in a cool, dry, and well-ventilated area, away from incompatible substances such as strong oxidizers and acids. Label the container clearly, and follow relevant safety and regulatory guidelines for handling and storage of chemical substances.
    Application of 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane

    Applications of 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane in Industrial Manufacturing

    As an upstream producer specializing in advanced aromatic diamines, we supply 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane to address demanding performance criteria in technical polymer and electronic materials fabrication. Our material integrates into end-user processes where thermal stability, dielectric properties, and high strength remain critical.

    1. High-Performance Polyimide Film Production

    High-performance polyimide films depend on aromatic diamines with high fluorine content for targeted flexibility and thermal endurance. Producers incorporate this material as the central diamine component in polyimide resin formulations for flexible substrates, insulation layers, and thermal management films. Its unique para-aminophenoxy structure and hexafluoropropane core allow for reliable synthesis of transparent, low-dielectric, and high-temperature-resistant films essential in aerospace wiring, FPC, and microelectronics assembly.

    Industry compliance standards

    • IPC-4101/40 and IPC-4203A for flexible and rigid board dielectrics
    • UL 94 VTM-0 flame rating for thin films
    • RoHS Directive (EU) 2015/863 for electronics
    • REACH (EC) No. 1907/2006 registration for EU manufacturing

    Typical usage ratio

    • 55–60 mol% of total diamine feed in backbone engineering for thermal-imide polymerization
    • Dosed as sole diamine or in binary blends with ODA/MPD to tailor mechanical properties

    Downstream process integration

    • Dissolved with dianhydrides in aprotic solvent imidization process
    • Incorporated during solution casting or roll-to-roll coating, then thermally cured
    • Introduced prior to molecular weight control adjustments (end-capping or chain-stop reactions)

    Final product types

    • Transparent polyimide films for flexible printed circuits
    • High-frequency insulation tapes and laminates
    • Thermal control films for spacecraft and avionics
    • Flexible organic substrate sheets for display manufacture

    2. Advanced Epoxy Composite Matrices for Aerospace

    Composite part manufacturers use fluorinated diamines as curing agents and chain extenders in specialty epoxy matrix formulations, where high glass transition temperatures, moisture resistance, and superior toughness remain essential. The introduction of this raw material into formulations enhances fracture resistance and maintains dimensional integrity at elevated temperatures without sacrificing processability. These properties make it integral for structural prepregs, honeycombs, and radome components in the aerospace sector.

    Industry compliance standards

    • SAE AMS 3716 Composite Structural Adhesives
    • ASTM D3039 for composite material tensile strength
    • ISO 4588 for bonding and curing of aerospace epoxy systems
    • Boeing BMS 8-201 specification for advanced polymers

    Typical usage ratio

    • 15–35 wt% of total amine curing agent blend
    • Tuned in formulations based on target Tg (glass transition temperature) and movement toward lower dielectric requirements

    Downstream process integration

    • Reacted with diepoxy or polyepoxy resins during matrix polymerization
    • Added pre-blending prior to filament winding, resin transfer molding (RTM), or autoclave cure

    Final product types

    • Aerospace structural prepregs
    • Low-CTE (coefficient of thermal expansion) composite beams and panels
    • High-frequency radome shells and covers
    • Aircraft interior sandwich panels

    3. Specialty Poly(Amide-Imide) and Polyetherimide Resins

    Producers employ this diamine in polycondensation reactions for specialty poly(amide-imide) and polyetherimide engineering resins. Its fluorine-rich structure improves process stability, resistance to aggressive solvents, and retention of dielectric performance under demanding thermal cycles. This unlocks robust resin matrices for injection-molded electrical connectors, automotive under-hood components, and advanced device encapsulations, where continual exposure to heat and chemicals is expected.

    Industry compliance standards

    • IEC 60216 for thermal endurance of electrical insulation materials
    • UL 746C for polymeric material evaluation
    • ISO 10993-5 for cytotoxicity (medical-grade applications)
    • Automotive OEM specifications (e.g., VW TL 528 for heat-resistance)

    Typical usage ratio

    • 30–50 mol% in copolymer feed, depending on target Tg and chemical resistance
    • Blended with conventional aromatic diamines for balanced flow and mechanical profile

    Downstream process integration

    • Fed into a two-step polycondensation (prepolymerization and final imidization/extrusion)
    • Added to melt or solution so that desired molecular weight and glass transition are achieved

    Final product types

    • High-temperature wire and cable insulation coatings
    • Thermoplastic electrical connectors
    • Precision automotive sensor housings
    • Medical device encapsulation shells

    4. Low-Loss Dielectric Substrates for High-Frequency PCBs

    Electronic laminate and printed circuit board manufacturers select this material as a polyimide or thermoset monomer, leveraging its hexafluoropropane segment for exceptionally low dielectric constant and loss tangent performance. The diamine enables substrate films and prepregs capable of supporting 5G telecommunications, radar, and advanced sensor signal speeds. Quantitative gains in EMI shielding and transmission integrity are realized with appropriate formulation, directly benefiting device manufacturers pursuing 10 GHz+ frequency products.

    Industry compliance standards

    • IPC-4101/126 for low-loss laminate base materials
    • UL 796 for grade recognition and safety of PCB substrates
    • IEC 61249-2-35 for halogen-free laminate sheets
    • IEEE 802.3 (for 5G signal and Ethernet requirements)

    Typical usage ratio

    • 40–65 mol% as functional diamine in copolymer backbone for signal layer and core
    • Adjusted to balance mechanical robustness versus ultra-low Dk/Df requirements

    Downstream process integration

    • Incorporated in resin prep during prepreg impregnation
    • Mixed with other monomers prior to resin casting or lamination
    • Introduced at solution blending or direct melt compounding phase

    Final product types

    • High-frequency PCB laminate cores
    • Signal transmission layers for antennas and base stations
    • Low-loss flexible circuit substrates
    • Microwave and RF tag inlays
    Free Quote

    Competitive 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane prices that fit your budget—flexible terms and customized quotes for every order.

    For samples, pricing, or more information, please call us at +8615371019725 or mail to admin@sinochem-nanjing.com.

    We will respond to you as soon as possible.

    Tel: +8615371019725

    Email: admin@sinochem-nanjing.com

    Get Free Quote of Sinochem Nanjing Corporation

    Flexible payment, competitive price, premium service - Inquire now!

    Certification & Compliance
    More Introduction

    2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane: Expert Insights from an Experienced Chemical Producer

    Real-World Performance Begins with the Right Polymer Building Block

    Many industries look to high-performance engineering plastics to push past environmental and mechanical limits. The backbone chemistry sets the stage, and our years developing and scaling the synthesis of 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane—often referred to in the field as BisAPAF or by its CAS number 83340-13-4—repeatedly prove one thing. The right monomer not only meets the spec; it delivers value in the places polymer designers need it most, particularly in aerospace, microelectronics, and high-frequency device manufacturing.

    Our Approach to Purity, Consistency, and Process

    As a manufacturer, experience shapes every drum and batch we produce. Reliable molecular purity stands as a daily focus for our chemists and production teams. Too many years in this business have shown how trace contamination—be it water, metal ions, or residual organic byproduct—shows up on the test bench later as yellowing, reduced thermal stability, or surface defects in films and molded parts. Our control extends from precise feedstock selection through to the final handling, with regular LC-MS and NMR audits confirming that what leaves the reactor meets our internal standards, which push well beyond commodity-tier polymer precursor grades.

    Understanding 2,2-Bis[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane in the Field

    BisAPAF brings key fluorinated structure into a bifunctional aromatic diamine. Chemically, that means it holds two amine groups attached to aromatic rings, each connected by an ether linkage to a hexafluoropropane core. That core does real work: the bulky, electron-withdrawing fluorinated center maps to outstanding thermal stability, environmental resistance, and very low dielectric constant—an essential for high-speed circuitry and demanding polymer composites. No unproven monomer will match this trifecta in real-world processing or performance results.

    Real Shifts in Dielectric Properties and Thermal Resistance

    Polymers built with BisAPAF show dielectric constants dipping below 2.8 in polyimides, far lower than counterparts produced with standard aromatic diamines. Our largest users—PCB suppliers, flexible circuit producers, and wire insulation manufacturers—tell us over and over that this property, more than anything, unlocks performance advantages in 5G, auto radar, and aerospace electronics where both weight and transmission loss reduction drive rapid adoption of advanced materials.

    Thermal stability can’t be all talk in these sectors. Polyimides based on BisAPAF regularly outperform conventional films in TGA, with initial weight loss commonly moved up by over 30°C compared to classical ODA or MPD-based systems. That margin can spell fewer yellowing problems and more reliable power operation deep into the upper end of the design window. We stand behind those numbers because we produce and test these intermediates ourselves—batch after batch, year after year.

    Polymer Processing: From Batch Reactor to Scalable Manufacture

    Direct feedback from our partners shows that consistent reactivity under process conditions shapes everything from molecular weight build-up to the formation of pinhole-free films. Our BisAPAF exhibits reliable amine value and clean reaction profiles during polycondensation. Part of our added value as a producer comes from eliminating color bodies through multi-stage purification and fine temperature control at each amination and coupling stage. These steps yield an off-white to light yellow solid, ideal for transparent and low-color downstream applications.

    Standard diamines like ODA (4,4’-Oxydianiline) improve some properties, but the unique effect of the bulky hexafluoropropane bridge in BisAPAF sets it apart: improved solubility in aprotic solvents, better flow properties during processing, and a wider window for defect-free casting and film-forming. Customers tell us time and again that these nuanced differences in starting monomer purity and structure pay back when scaling up, not just on the lab bench.

    The Value of Vertical Integration

    It’s well known among producers: control over upstream fluorochemical supply, careful amination steps, and in-house analytical capabilities guarantee a secure, repeatable supply of BisAPAF for our clients. Too often, inconsistent supply or reliance on intermediaries breeds anxiety around international shipments, documentation, and shelf life of sensitive raw materials. By managing the whole process—from monomer synthesis through to packaging in moisture-controlled containers—our team removes those variables. Customers stay focused on product innovation, not anxieties over building block quality or traceability.

    Where the Differences Really Show: Downstream Applications

    The increasingly demanding world of flexible electronics, interlayer dielectrics, and aerospace adhesives doesn’t leave room for error in monomer quality. Suppliers and OEMs describe how even slight rises in water uptake or trace particulate contamination can cause blisters in films, unpredictable polymer chain build, and irregular mechanical properties. Our direct work with fabricators tells us how consistently pure BisAPAF means fewer failures in pilot-line production—and more confidence in year-long qualification tests.

    Take, for example, the polyimides used as flexible circuit substrates. These substrates require film uniformity, low dielectric loss, and stable color retention under laser or hot bar soldering. Films derived from BisAPAF routinely hold up in precise reliability screening: low yellowness index, high breakdown voltage, and minimal dimensional change after repeated thermal cycling. Compared with films made from cheaper or recycled diamines, these advantages don’t just appear in datasheets. They show up as reduced customer complaints, lower field failure rates, and improved device lifetime.

    Comparing BisAPAF With Other Diamines

    The difference between commodity diamines and high-purity BisAPAF grows obvious at scale. Polymers built with classic ODA, PDA (p-Phenylenediamine), or MPD (m-Phenylenediamine) allow decent basic performance in simple environments. As soon as heat, moisture, or electrical stress rise, drawbacks multiply. Yellowing, micro-cracking, and volatility in dielectric breakdown measurements hit production yields and end-use reliability. With BisAPAF, the combination of fluorinated core and controlled synthesis eliminates most of these issues out of the gate.

    Some alternatives—like 2,2-Bis(4-aminophenyl)hexafluoropropane, which omits the ether linkage—fall short on solubility and mechanical flexibility. The introduction of ether bonds in BisAPAF directly enhances both melt processability and ductility in finished films. That difference, while subtle on paper, means much smoother scale-up to multi-kg and ton-scale processes. In practice, our production engineers notice easier handling, more consistent dispersion in casting solvents, and fewer agglomeration problems during resin preparation.

    Serving the Evolution of High-Frequency and Aerospace Manufacturing

    Each year, our R&D and production teams engage directly with both labs and plant engineers who struggle to balance dielectric performance, thermal stability, and lifetime under harsh environments. As communication devices, satellites, and automotive radar systems demand both lighter weight and higher speed, conventional monomers fall out of their comfort zone. Only BisAPAF’s fluorinated core delivers the electrical insulation and chemical inertia that keep next-generation devices running safely at high temperature, under high frequency, or in chemically active conditions.

    Industry specifications keep moving. Standards for polyimides and related polymers in advanced technologies require lower and lower dielectric loss, improved high-temperature survival, and ever-tighter impurity controls. Meeting these demands year after year means constant investment in process optimization, not just a rubber stamp on a COA. We monitor each batch from raw material to finished lot, feeding back data into our process models. That loop keeps our BisAPAF exceeding the changing specs for transmission loss, moisture absorption, and outgassing, especially in mission-critical aerospace and defense applications.

    Supporting Innovation Through Collaborative Development

    Our greatest technical advances often emerge from open conversations with end users. Whether adapting the molecular weight distribution, reducing trace particulate, or supporting polymerization scale-up trials, our technical team stands ready with real-world experience. Not every request fits a spreadsheet. For instance, customers experimenting with hybrid resin blends or new imidization techniques sometimes require subtly adjusted amino-amine ratios or stricter control on end-group distribution. Our vertically integrated production model and nimble lab team have the flexibility to support such development, backed by decades of hands-on process engineering.

    One customer, working on next-generation flexible OLED substrates, reported batch rejection from trace ionic residue left by third-party-sourced diamines. We responded by adapting our washing and recrystallization routes, delivering ultra-low ion content BisAPAF that allowed reliable scale-up of their new process. Such experiences reinforce the direct link between close supplier collaboration and accelerated innovation cycles.

    Packaging, Handling, and Shelf Life

    Even the best chemistry falls short if packaging and delivery ignore the realities of a production environment. BisAPAF tends to absorb water and degrade color upon prolonged air exposure. As producers with decades moving sensitive aromatic diamines, we select moisture-barrier containers and include clear guidance for pre-use drying and handling. Our logistics team ensures each shipment reaches the user with preserved purity and minimal transit exposure. The difference here may be measured in years of shelf life, fewer failed feedstocks, and less downtime due to last-minute raw material issues.

    We routinely run stability tests out past 24 months at controlled room temperature. For high-frequency and optical grade applications, we recommend short-term exposure control once opened, and prompt resealing after each withdrawal to avoid color drift or excess water. Direct experience shows these simple habits eliminate polymerization inconsistencies at scale.

    Environmental and Regulatory Considerations

    Global movement of fluorinated intermediates draws increasing regulatory oversight. We track evolving packaging, traceability, and transport restrictions across regions. Every drum of BisAPAF ships with the right documentation, from batch analytical reports to safety instructions in line with the newest international conventions. As producers, we anticipate customer needs for full traceability and rapid response to regulatory changes—never an afterthought or a paperwork footnote. Our supply chain and compliance teams maintain active membership in industry associations, ensuring a constant line of sight on new requirements that could affect customer supply or application approvals.

    Responsible Waste Management and Sustainability

    True chemical manufacturing does not end at product delivery. Our own facilities include closed-cycle solvent recovery and careful management of spent reagents and byproducts from the BisAPAF synthesis train. We continuously review and improve processes for waste minimization and safe disposal, working toward lower emissions and more sustainable production. These operational investments mean our customers can be confident that their supply does not come at undue environmental cost. When end-users inquire about environmental footprints or polymer disposal characteristics, our technical staff delivers clear, fact-based replies drawn from real plant data—not marketing generalities.

    Future Opportunities and Continuous Improvement

    The demands on polyimides and related aromatic polymers show no sign of slowing. The next wave of communication technology, electric vehicles, and aerospace platforms will challenge suppliers to deliver even lower dielectric losses, higher operational temperatures, and greater outgassing resistance. We direct significant resources into ongoing R&D: examining new process routes to further reduce color, tailoring molecular design for even lower moisture uptake, and strengthening collaboration with end-user development teams. Our teams know that small tweaks in monomer quality pay off through a ripple effect across thousands of devices and millions of hours of product lifetime in the field.

    We never settle for current standards. Our on-site pilot plants offer real-world testing environments to simulate large-scale mixing, continuous polymerization, and tough downstream fabrication steps. By benchmarking against both our own and external materials, we track genuine competitive advantages—not just datasheet specs. Customers come to us for both reliability and a partner invested in their evolving requirements.

    Closing Perspective from Practice, not Theory

    Many suppliers can talk about technology and possibility, but as an established chemical manufacturer, daily work means making reliable BisAPAF a reality—batch after batch, shipment after shipment. Occupational pride emerges not from the marketing but from customers reporting that their most demanding circuits, substrates, and composites pass the toughest real-world tests because the chemistry we deliver performs exactly as promised. We know the critical points where monomer purity and structural nuance count, and we back our products with the accumulated knowledge of veteran technicians, chemists, and engineers who work at every step of the value chain.

    With more than a decade spent refining, optimizing, and delivering BisAPAF to advanced manufacturers worldwide, we remain focused on the facts: structure and purity shape real downstream performance; close partnership beats theoretical specs; and future progress depends on producers who invest deeply in both technical excellence and responsible operation. We look forward to advancing innovation in polymers for years to come—one drum, one batch, one partnership at a time.