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2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane

    • Product Name 2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane
    • Alias BIS(P-AMINOPHENOL) HEXAFLUOROPROPANE
    • Einecs 407-360-9
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry sales7@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    VTB
    Specifications

    HS Code

    454686

    Iupac Name 2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane
    Molecular Formula C15H12F6N2O2
    Molecular Weight 384.26 g/mol
    Cas Number 7289-87-4
    Appearance Off-white to pale yellow solid
    Melting Point 265-273 °C
    Boiling Point Decomposes before boiling
    Solubility In Water Insoluble
    Purity Typically ≥98%
    Synonyms Bisphenol AF diamine; 3,3'-Diamino-4,4'-(hexafluoroisopropylidene)diphenol
    Density 1.5-1.6 g/cm³
    Smiles CC(C1=CC(=C(C=C1N)O)N)(C2=CC(=C(C=C2N)O)N)(F)(F)F
    Storage Temperature Room temperature, protected from moisture
    Ec Number 440-460-4

    As an accredited 2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing The chemical is supplied in a 25-gram amber glass bottle with a secure screw cap and tamper-evident safety seal.
    Shipping 2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane should be shipped in tightly sealed containers, protected from moisture and direct sunlight. It must be labeled according to regulatory requirements and accompanied by a safety data sheet (SDS). Shipping should comply with local, national, and international chemical transport regulations for safe and secure delivery.
    Storage 2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane should be stored in a tightly sealed container, in a cool, dry, and well-ventilated area, away from direct sunlight. The storage area should be free from incompatible materials, such as strong oxidizers, and protected from moisture. Proper labeling and access control are recommended to ensure safe handling and prevent accidental exposure.
    Application of 2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane

    Applications of 2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane in Industrial Manufacturing

    2,2-Bis(3-Amino-4-Hydroxyphenyl)Hexafluoropropane is a high-performance fluorinated aromatic diamine widely used as a key intermediate in several advanced industrial sectors. The following sections detail specific downstream manufacturing applications in which this material plays a crucial and clearly defined role, with focus on industry standards, practical usage ratios, process flow integration, and end-product outputs.

    1. Aerospace and Electronic Grade Polyimide Resin Production

    As a critical monomer in synthesizing high-temperature resistant polyimide resins, this fluorinated diamine enables the production of films exhibiting outstanding thermal stability, dielectric properties, and moisture resistance. Leading aerospace, electronics, and microelectronics manufacturers rely on its integration into high-performance polyimide formulations for flexible circuit boards, insulation films, and high-density interconnect applications.

    Industry compliance standards

    • ASTM D5213: Standard Specification for Polymeric Materials for Electronic Applications
    • IPC-4101: Specification for Base Materials for Rigid and Multilayer Printed Boards
    • REACH Regulation (EC) No 1907/2006
    • RoHS Directive 2011/65/EU compliance

    Typical usage ratio

    • 10–25 mol% of total diamine component in polyimide precursor blends; precise ratio adjusted according to required dielectric constant, flexibility, and Tg balancing with other diamines such as ODA or m-PDA

    Downstream process integration

    • Charged in diamine solution blending stage for polyamic acid synthesis
    • Participates in condensation polymerization with dianhydride monomers (eg. BPDA, PMDA)
    • Precursor casting and thermal imidization yielding continuous films or coatings

    Final product types

    • Flexible polyimide copper-clad laminates (FCCL)
    • Flexible printed circuit substrates
    • Insulation films for microelectronic fabrication
    • Insulating tapes and wire enamels for aerospace use

    2. Specialty Epoxy Resin Formulation for High-Performance Composites

    Well-regarded compounders utilize this bifunctional diamine as a specialty curing agent and modifier in high glass transition temperature (Tg) epoxy systems designed for structural composite parts in automotive, aviation, and electronics. Its incorporation imparts hydrophobicity, improved thermal cycling endurance, and chemical permeability barriers compared to standard aromatic amines.

    Industry compliance standards

    • UL 94: Standard for Safety of Flammability of Plastic Materials
    • ISO 178: Plastics — Determination of flexural properties
    • EN45545-2: Fire protection for railway vehicles (composite requirements)
    • Relevant automotive OEM raw material and process specifications (eg. GM Material Specification GMW3035)

    Typical usage ratio

    • 10–40 parts per hundred resin (phr) as a partial co-curing agent with conventional amines (eg., DDM, DDS), based on resin viscosity, required cure profile, and performance targets

    Downstream process integration

    • Introduced into the epoxy resin blend after preheating, before vacuum degassing
    • Combined with filler, fiber or woven glass prepregs, followed by autoclave or OOA composite curing
    • Supports prepreg shelf life and B-staging

    Final product types

    • Structural CFRP or GFRP composite panels/components for aircraft and automotive engineering
    • Epoxy-based encapsulation for electronics
    • Fire-retardant and chemical-resistant housings
    • Adhesive films for aerospace assembly

    3. Membrane Materials for Gas Separation and Fuel Cell Applications

    Producers of advanced gas separation membranes and proton exchange membranes employ this diamine in the synthesis of highly fluorinated polyimides to enhance chemical resistance and suppress water absorption, critical for durable operation in hydrogen separation, natural gas processing, and PEM fuel cells. Its presence reduces fouling and plasticization, facilitating longer service life under aggressive conditions.

    Industry compliance standards

    • IEC 62321: Determination of certain substances in electrotechnical products
    • ISO 21083-1: Membrane Filters for Industrial Applications
    • JIS K 7126: Testing methods for gas permeability of plastics films
    • EU Regulation No 10/2011 (for fuel cell materials used in indirect food contact, when applicable)

    Typical usage ratio

    • 5–20 mol% of total diamine content in membrane polyimide synthesis, adapted according to target gas selectivity and permeability requirements in complex mixtures

    Downstream process integration

    • Added to diamine solution during copolymerization with selected dianhydrides
    • Membrane casting via solvent evaporation, phase inversion, or spin coating
    • Optional chemical modification steps for proton conductivity in PEM films

    Final product types

    • Polyimide gas separation membranes (CO2/CH4, O2/N2, H2/CO2 separations)
    • Proton exchange membranes for PEM fuel cells
    • Dehumidification and air drying modules
    • Hydrogen barrier films

    4. Performance Coating Precursor for Chemical Protection and Electronics

    In the coatings industry, formulators use this fluorinated diamine to prepare high-performance polyimide and epoxy coatings that withstand harsh chemical, solvent, and high humidity service conditions. These coatings protect sensitive electronic assemblies, semiconductor manufacturing tools, and industrial process equipment from corrosion and contamination, ensuring functional reliability throughout demanding operations.

    Industry compliance standards

    • IEC 61086: Coating materials for electrical applications
    • ISO 12944-2: Paints and varnishes — Corrosion protection of steel structures by protective paint systems
    • IPC-CC-830: Qualification and Performance of Electrical Insulating Compounds for Printed Wiring Assemblies
    • RoHS/REACH for hazardous substance restriction

    Typical usage ratio

    • 5–30% of polymer backbone composition in polyimide/epoxy matrices, defined by target exposure type (acids, solvents, vapor), film thickness, and crosslinking density

    Downstream process integration

    • Polymer precursor blending, followed by film casting or spray-coating on substrates
    • Thermal or UV cure sequence tailored to electronics or process vessel requirements
    • Cleanroom-compatible application and quality inspection protocols

    Final product types

    • Chemical-resistant polyimide coatings for semiconductor wafer processing tools
    • Moisture barrier coatings for chip carriers and circuit boards
    • Solvent-resistant tank linings and pipes in chemical plants
    • High-temperature conformal coatings for electronic assemblies
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