High molecular weight: Polyoxymethylene GH-25 with high molecular weight is used in automotive gears, where enhanced mechanical strength and wear resistance are achieved.

Melting point 175°C: Polyoxymethylene GH-25 with a melting point of 175°C is used in electrical connectors, where thermal stability during soldering processes is ensured.

Purity 99.5%: Polyoxymethylene GH-25 with 99.5% purity is used in medical device housings, where biocompatibility and low extractables are required.

Low viscosity: Polyoxymethylene GH-25 with low viscosity is used in precision injection molding of consumer electronics, where high flowability ensures dimensional accuracy.

Particle size ≤50 µm: Polyoxymethylene GH-25 with particle size ≤50 µm is used in powder-based coating applications, where uniform surface finish and adhesion are provided.

Stability temperature 120°C: Polyoxymethylene GH-25 with a stability temperature of 120°C is used in food processing equipment, where long-term operational reliability under heat is needed.

Crystallinity 75%: Polyoxymethylene GH-25 with 75% crystallinity is used in industrial valve components, where improved chemical resistance and rigidity are maintained.

Low moisture absorption: Polyoxymethylene GH-25 with low moisture absorption is used in pump housings, where dimensional stability in humid environments is preserved.

MFI 18 g/10min: Polyoxymethylene GH-25 with a melt flow index of 18 g/10min is used in thin-walled packaging components, where rapid processing and consistent wall thickness are achieved.

Tensile strength 65 MPa: Polyoxymethylene GH-25 with tensile strength of 65 MPa is used in appliance handles, where increased load-bearing capacity and operational safety result.