© 2026 Sinochem Nanjing Corporation,
All Right Reserved
|
HS Code |
508980 |
| Product Name | Polyketone Resin HBX-80F |
| Appearance | Light yellow granular solid |
| Chemical Family | Polyketone |
| Softening Point | 78-82°C |
| Acid Value | < 1 mg KOH/g |
| Density | 1.10-1.20 g/cm³ |
| Molecular Weight | Approx. 700-1000 g/mol |
| Solubility | Soluble in aromatic and chlorinated hydrocarbons |
| Glass Transition Temperature | Approximately 50°C |
| Ash Content | < 0.1% |
| Recommended Application | Ink, coating, adhesive |
As an accredited Polyketone Resin HBX-80F factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Polyketone Resin HBX-80F is packaged in 25 kg net weight multi-layered paper bags, sealed for moisture protection. |
| Shipping | Polyketone Resin HBX-80F is shipped in sealed, moisture-proof bags or drums, typically 25 kg per bag. Packages are securely palletized for stability during transport. The resin should be stored and transported in cool, dry conditions, away from direct sunlight and incompatible substances, ensuring safe handling in compliance with chemical shipping regulations. |
| Storage | Polyketone Resin HBX-80F should be stored in a cool, dry, and well-ventilated area, away from direct sunlight, heat sources, and moisture. Keep containers tightly closed to prevent contamination. Avoid exposure to strong acids, bases, and oxidizing agents. Store it in original, labeled packaging, and ensure compliance with all relevant regulations and safety guidelines to maintain product quality and safety. |
|
Purity 99.5%: Polyketone Resin HBX-80F with a purity of 99.5% is used in automotive interior adhesives, where it ensures excellent bonding strength and low impurity interference. Melting Point 220°C: Polyketone Resin HBX-80F with a melting point of 220°C is used in high-temperature resistant coatings, where it provides superior thermal stability and durability. Average Molecular Weight 45,000 g/mol: Polyketone Resin HBX-80F with an average molecular weight of 45,000 g/mol is used in engineered thermoplastic compounds, where it contributes to enhanced mechanical properties and impact resistance. Viscosity Grade 120 cps: Polyketone Resin HBX-80F with a viscosity grade of 120 cps is used in specialty ink formulations, where it improves flow characteristics and print resolution. Particle Size 35 microns: Polyketone Resin HBX-80F with a particle size of 35 microns is used in powder coating applications, where it ensures uniform film formation and smooth surface finish. Stability Temperature 200°C: Polyketone Resin HBX-80F with a stability temperature of 200°C is used in electronic encapsulation materials, where it delivers reliable insulation and long-term performance under thermal stress. Glass Transition Temperature -3°C: Polyketone Resin HBX-80F with a glass transition temperature of -3°C is used in flexible sealants, where it maintains elasticity and low-temperature flexibility. |
Competitive Polyketone Resin HBX-80F prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please call us at +8615371019725 or mail to admin@sinochem-nanjing.com.
We will respond to you as soon as possible.
Tel: +8615371019725
Email: admin@sinochem-nanjing.com
Flexible payment, competitive price, premium service - Inquire now!
