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HS Code |
848803 |
| Product Name | Polyketone Resin HBX-3800 |
| Appearance | White to light yellow granules |
| Cas Number | 25054-06-2 |
| Molecular Weight | 800-2000 g/mol |
| Softening Point | 80-100°C |
| Acid Value | <1 mg KOH/g |
| Density | 1.13 g/cm³ (at 25°C) |
| Solubility | Soluble in aromatic hydrocarbons and esters |
| Glass Transition Temperature | 37°C |
| Viscosity | 1200-2000 mPa·s (at 125°C) |
| Odor | Slight |
| Color Gardner | <3 |
| Moisture Content | <0.2% |
| Recommended Storage | Cool, dry place |
As an accredited Polyketone Resin HBX-3800 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Polyketone Resin HBX-3800 is packaged in 25 kg net weight multi-layer kraft paper bags with inner PE lining for safety. |
| Shipping | Polyketone Resin HBX-3800 is shipped in tightly sealed, industrial-grade bags or drums, typically weighing 25 kg each. Packaging ensures protection from moisture and contamination. The product should be stored and transported in cool, dry conditions, away from direct sunlight and strong oxidizing agents, with all relevant chemical shipping regulations strictly observed. |
| Storage | Polyketone Resin HBX-3800 should be stored in a cool, dry, and well-ventilated area, away from direct sunlight and sources of heat or ignition. Keep the containers tightly sealed to prevent contamination and moisture uptake. Avoid exposure to strong acids, bases, or oxidizing agents. Recommended storage temperature is below 40°C. Ensure proper labeling and follow all applicable safety guidelines. |
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High purity: Polyketone Resin HBX-3800 with high purity is used in electronic components manufacturing, where it ensures minimal contamination and superior dielectric performance. Low viscosity grade: Polyketone Resin HBX-3800 with low viscosity grade is used in composite resin casting, where it enables excellent flow characteristics and uniform dispersion of fillers. Medium molecular weight: Polyketone Resin HBX-3800 with medium molecular weight is used in adhesives production, where it provides optimal balance of tack and cohesive strength. Melting point 220°C: Polyketone Resin HBX-3800 with melting point 220°C is used in high-temperature moldings, where it delivers shape retention and dimensional stability under thermal stress. Particle size <50 µm: Polyketone Resin HBX-3800 with particle size below 50 microns is used in coatings and films, where it achieves smooth surfaces and enhanced barrier properties. High stability temperature: Polyketone Resin HBX-3800 with high stability temperature is used in automotive under-the-hood applications, where it maintains mechanical properties during prolonged heat exposure. |
Competitive Polyketone Resin HBX-3800 prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please call us at +8615371019725 or mail to admin@sinochem-nanjing.com.
We will respond to you as soon as possible.
Tel: +8615371019725
Email: admin@sinochem-nanjing.com
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