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HS Code |
192870 |
| Product Name | Polyketone Resin HBX-3137 |
| Appearance | Pale yellow granular solid |
| Softening Point | 95-105°C |
| Acid Value | <1 mg KOH/g |
| Density | 1.10 g/cm³ |
| Molecular Weight | 500-800 g/mol |
| Solubility | Soluble in aromatic hydrocarbons and esters |
| Glass Transition Temperature | 56°C |
| Viscosity | 350-450 cps at 120°C |
| Compatibility | Compatible with EVA, acrylics, and other resins |
| Applications | Hot melt adhesives, coatings, inks |
| Odor | Faint characteristic odor |
As an accredited Polyketone Resin HBX-3137 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Polyketone Resin HBX-3137 is packaged in 25 kg woven bags, labeled with product name, batch number, and handling instructions. |
| Shipping | Polyketone Resin HBX-3137 is shipped in sealed, high-density polyethylene bags or drums to prevent moisture and contamination. Each package is clearly labeled with safety and handling instructions. The product should be stored in a cool, dry place and transported according to standard chemical shipping regulations to ensure product quality and safety. |
| Storage | Polyketone Resin HBX-3137 should be stored in a cool, dry, and well-ventilated area, away from direct sunlight, heat sources, and moisture. Keep the packaging tightly sealed when not in use to prevent contamination and absorption of moisture. Avoid exposure to strong acids, bases, and oxidizing agents. Store away from combustible materials and ensure proper labeling for safety compliance. |
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Purity 99%: Polyketone Resin HBX-3137 with 99% purity is used in automotive coatings, where it ensures high gloss and superior weather resistance. Melting Point 220°C: Polyketone Resin HBX-3137 with a melting point of 220°C is used in powder coating applications, where it provides enhanced thermal stability and excellent adhesion. Viscosity Grade 120 cps: Polyketone Resin HBX-3137 at 120 cps viscosity grade is used in printing inks, where it allows for smooth flow and uniform pigment dispersion. Molecular Weight 25,000 g/mol: Polyketone Resin HBX-3137 with a molecular weight of 25,000 g/mol is utilized in adhesives for electronics, where it delivers optimal flexibility and strong bonding performance. Particle Size D50 10 μm: Polyketone Resin HBX-3137 with D50 particle size of 10 μm is applied in high-performance paints, where it enhances surface finish and abrasion resistance. Stability Temperature 180°C: Polyketone Resin HBX-3137 with stability up to 180°C is used in wire and cable insulation, where it maintains dielectric strength and material integrity under heat. Softening Point 160°C: Polyketone Resin HBX-3137 with a softening point of 160°C is used in hot-melt adhesive formulations, where it enables rapid setting and strong tack. Acid Value Less Than 1 mg KOH/g: Polyketone Resin HBX-3137 with acid value below 1 mg KOH/g is employed in electronics encapsulation, where it minimizes corrosion risks and electronic component degradation. |
Competitive Polyketone Resin HBX-3137 prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please call us at +8615371019725 or mail to admin@sinochem-nanjing.com.
We will respond to you as soon as possible.
Tel: +8615371019725
Email: admin@sinochem-nanjing.com
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