|
HS Code |
688956 |
| Material | Polyimide Film |
| Grade | HN |
| Thickness | 0.025 mm |
| Color | Amber |
| Width | Standard roll widths available |
| Density | 1.42 g/cm³ |
| Tensile Strength | 231 MPa |
| Elongation At Break | 72% |
| Dielectric Strength | 200 kV/mm |
| Continuous Use Temperature | Up to 240°C |
| Thermal Conductivity | 0.12 W/m·K |
| Water Absorption 24hr | 1.8% |
| Flame Class | UL 94 V-0 |
| Surface Resistivity | 10¹⁶ Ω/sq |
| Shrinkage 150c 30min | ≤ 0.20% |
As an accredited Polyimide HN-25-S factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Polyimide HN-25-S is packaged in a sealed, moisture-resistant roll, 25 microns thick, 610 mm wide, containing 50 meters. |
| Shipping | Polyimide HN-25-S is shipped in secure, moisture-resistant packaging to maintain its integrity during transit. It is typically supplied in rolled sheets, boxed and sealed to prevent contamination or damage. Handling precautions are observed to protect against physical stress, with appropriate labeling for safe storage and transport in compliance with relevant regulations. |
| Storage | Polyimide HN-25-S should be stored in a cool, dry, and well-ventilated area, away from direct sunlight and sources of heat or ignition. Keep the material in its original packaging or a tightly sealed container to prevent contamination and moisture absorption. Avoid exposure to strong acids, bases, and solvents. Store away from incompatible materials and ensure proper labeling for safety compliance. |
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Thermal stability: Polyimide HN-25-S with high thermal stability up to 400°C is used in flexible printed circuits, where it provides excellent dimensional stability under thermal cycling. Mechanical strength: Polyimide HN-25-S with tensile strength of 230 MPa is used in aerospace insulation tapes, where it ensures consistent mechanical reinforcement under dynamic stress. Dielectric property: Polyimide HN-25-S with a dielectric constant of 3.4 is used in microelectronic substrates, where it enables reliable electrical insulation for high-frequency signal transmission. Chemical resistance: Polyimide HN-25-S with strong resistance to organic solvents is used in semiconductor processing, where it maintains integrity during chemical etching procedures. Film thickness: Polyimide HN-25-S with 25 µm film thickness is used in photovoltaic cell encapsulation, where it offers uniform coverage while preserving optical clarity. Thermal conductivity: Polyimide HN-25-S with low thermal conductivity of 0.12 W/m·K is used in battery separators, where it minimizes heat transfer and improves operational safety. Water absorption: Polyimide HN-25-S with water absorption below 0.8% is used in medical diagnostic devices, where it ensures stable performance in humid environments. UV resistance: Polyimide HN-25-S with excellent UV resistance is used in outdoor sensor protection, where it prevents material degradation over long-term exposure. Flame retardancy: Polyimide HN-25-S rated UL 94 V-0 is used in electronic coil insulation, where it provides enhanced fire safety and reliability. Flexural strength: Polyimide HN-25-S with flexural strength of 150 MPa is used in high-density interconnects, where it supports fine-pitch manufacturing without cracking. |
Competitive Polyimide HN-25-S prices that fit your budget—flexible terms and customized quotes for every order.
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Polyimide HN-25-S stands as our answer to the real-world demands we face each day from engineers, plant managers, and electronics OEMs pressured to deliver reliability in harsh conditions. Working as a chemical manufacturer, we’ve come to know polyimide from its first precursor drops all the way to finished rolls. That familiarity goes deeper than datasheets or lab results; it’s shaped by a clear look at what devices in aerospace, electrical, and electronic assembly keep running—and what fails when quality slips. We developed HN-25-S intending to solve those reliability gaps for makers who want to build products that last.
We’ve spent years engineering polyimide films, and our customers have taught us a thing or two. The biggest complaint we’ve heard comes from inconsistent mechanical strength and insulation performance at elevated temperatures. Customers often show us what happens: less robust film cracks or delaminates, adhesives peel away, or connectors short out after only a few thermal cycles. HN-25-S takes those stories seriously. Its formula and process walk a line that refuses to compromise on the balance between heat resistance, toughness, and surface smoothness. Every roll coming out of our plant bears the fingerprints of our own process controls, not a distributor’s label swap.
Polyimide films trace their roots to the same building blocks, but not every product answers the same need. Some prioritize flexibility, others call for extreme dielectric strength, or thin gauge. We designed HN-25-S for a different set of priorities. Our process temperature controls stay tight to lock in a strong, consistent molecular orientation. Users get a film that withstands continuous exposure to 240°C, maintaining tensile strength and insulation properties in environments that would deform cheaper options. We’ve seen competing films sold at premium prices fail during thermal shock tests or shrink enough to ruin board layout tolerances. HN-25-S keeps its dimensions, even after repeated cycling, which saves customers from waste and rework.
In our hands-on trials, customers pushing for thinner packaging gauge or lower weight often choose lighter polyimides. Those films do perform in less critical roles, but they show weak resistance to tear and abrasion. HN-25-S offers a 25-micrometer thickness, striking a middle ground: thin enough for flexible circuitry or precision slot liners, thick enough that you’re not watching installation teams handle every sheet with kid gloves. We measure peel adhesion, elongation at break, and surface energy before each shipment, building consistency that machine operators and assembly line engineers value. We don’t just sell rolls—we stand behind their use cases, tracing every production lot back to its solvent, resin batch, and stretch ratio.
We see a clear trend as high-voltage insulation and microelectronics converge: products move smaller, and thermal loads run hotter. Traditional polyester and laminated products don’t thrive where higher temperatures and voltage spikes stand to degrade insulation. Our HN-25-S offers insulation breakdown strength consistently holding above 150 kV/mm. It doesn’t crack, curl, or lose flexibility after baking in reflow ovens or long-term load at high temperatures. As a result, customers in electric vehicle battery packs, aerospace power modules, 5G infrastructure, and high-speed digital devices use it for slot insulation, flexible printed circuits, and heat shields—even capacitors operating near their design limits.
We avoid shortcuts that might save energy or cut a few seconds per roll, because our customers feel those losses years down the line. Changing a process to run faster or swap suppliers on resin components always shows up in the quality of the film. Over time, we’ve found tight control over solution viscosity, casting speed, and the curing profile gives HN-25-S a performance envelope broader than typical “commodity” films. It doesn’t warp along critical edges after laser cutting, and printed circuitry adheres cleanly to its surface—all results of fine-tuned surface chemistry we’ve baked into the process. Electrical labs and reliability engineers have sent us feedback after drop tests, microtome slicing, or SEM imaging that point to uniform structure down to the molecular level.
Talk to tape-technicians in motor windings, and stories roll in about insulation failure causing unexpected downtime and warranty headaches. We developed HN-25-S to help address those problems. Rotor-insulation specialists highlight the importance of film resilience during thermal cycling and exposure to chemical vapors. HN-25-S simply outlasts traditional Kapton-grade and polyester materials. It resists attack from oils, flux residues, and cleaning solvents. Printed circuit board assemblers speak to its excellent bondability—critical for roll-to-roll manufacturing and multi-layer assembly standards. We hear from field engineers measuring performance in harsh zones and see consistently good reviews after months of trialing HN-25-S as an interlayer dielectric or for stiffer flex circuits.
Some of our customers produce flexible heaters, and they’ve found HN-25-S lets them deposit very fine traces for uniform thermal distribution. That kind of film surface and imide backbone—developed through resin chemistry choices and extrusion knowhow—give a stable environment for conductive ink or foil application. We see similar feedback from high-reliability aerospace sensor teams, where complex folding and wrapping require tight thickness control and freedom from pinholes or inclusions that might let in moisture or debris.
Electronics assembly lines improve yield by avoiding static charge build-up and minimizing particulate contamination. HN-25-S collects no excess static, and tightly managed clean-room conditions during production mean ultrasonic cleaning rarely picks up debris down the line. As a result, laser plotting and die cutting tools produce finer edge finishes, helping scale up device production without costly defects.
Over the years, we’ve learned that small differences in input resin or process temperature can swing a product from reliable to questionable. We audit and certify our incoming dianhydride and diamine lots down to the impurities and moisture trace, because ‘close enough’ always comes back to haunt field performance. Our reaction, imidization, and casting lines run with live feedback: we monitor film haze, thickness, and tensile strength; we test small samples every few hours to catch drifts in mechanical performance. That’s not just lab routine—every process improvement comes from hard experience with real-world applications. Each roll meets the same high expectation, not because we’re aiming at a spec, but because our customers stake their brands on that confidence. HN-25-S holds up, batch to batch.
Competing films manufactured outside our vertical process often show micro-crystallinity or resin blend inconsistency at random intervals. We cut those risks by running solvent exchange and baking optimized for our own feedstocks, and we’ve tuned extrusion speed, evaporation rates, and film stretching after seeing how small shifts ruined tape adhesion or promoted tear propagation in finished use. By bringing everything from solvent mixing to final slitting under one roof, we control the product from raw chemical to packaged roll. We see returns, not in how many dozens of films we offer, but in making the right one for the job.
Customers call with specific technical concerns: glass transition temperature, dielectric loss, breakdown behavior under high-frequency loads, or mechanical failure triggers. Our labs do not guess. We run differential scanning calorimetry, thermal gravimetric analysis, and high-voltage breakdown testing on every lot. If a roll shows deviance from our defined performance band, we scrap it before it ever leaves the facility. Some manufacturers cut corners by mixing in off-grade resin batches or thinning with less expensive blends to hit price points or extend yield. HN-25-S earns its place on critical assemblies by showing a tight property profile over years, not just in certification snapshots. We put our own name and process references on every shipment because the reputation of our line rides on field success.
Heat aging trials show that HN-25-S maintains dielectric performance and tensile retention even after thousands of hours at full rating. Customers have sent back aged samples that still meet assembly and end-use standards, which confirms what our own labs report. Our film doesn’t warp or chalk under UV or ionizing radiation exposure; these facts matter for satellite and defense projects, as well as ground-based computational equipment running in high-radiation environments. Each improvement feeds back into the next batch, closing the loop between our QC, process design, and market requirements.
We watch innovation up close. Technology companies trend toward lighter, smarter, and smaller systems. Polyimide films like HN-25-S become the silent backbone to much of that progress. The more that circuits flex, bend, and run in tight or stacked assemblies, the more material performance matters. Sub-standard films slow plant output and force expensive rework. Over time, we have come to recognize that our role grows beyond delivery of commodity films. We answer technical calls, guide engineers through compatibility testing, and follow troubleshooting directly with line managers and QC leaders at customer sites. That real interaction steers changes not just in product mix but also in how we guide user training.
Researchers and product developers tell us they value transparency in film sourcing and traceability because the time and money they commit to product launches demand more than marketing claims. Our HN-25-S comes with full batch documentation—purity records, trace metals, mechanical, and dielectric history—because the long-term relationship with the buyer depends on trust built from the operator’s side of the table, not just the seller’s.
It’s one thing to make films that pass inspection at shipping, and another to make products that deliver year after year inside devices that can’t afford downtime. We manufacture HN-25-S for these high-stakes applications. Our experience points to many subtle drivers of long-term reliability—film purity, tension control, moisture control at storage, and even how the film releases from the casting belt. These influence not just first-use quality, but how film behaves after months or years of field use in climates from Arctic to desert. Every customer story of failure fueled incremental improvements; QC checks or preventive maintenance logs keep hidden flaws out of product lines.
We link everything back to a deep understanding of the polyimide backbone chemistry, not as abstract knowledge but dialed in through years of direct process feedback. Our formulation doesn’t come off a licensing agreement—it’s the result of direct investment in R&D, chemist training, and weeks of pilot line improvement. We know exactly which step kills bubbles or fixes streaks, and which surface pre-treatments make sure HN-25-S bonds precisely in high-value assemblies.
As market challenges shift, and as assembly tolerances keep shrinking, we believe HN-25-S earns its keep. It’s built through hands-on control and responsibility for every detail—from resin synthesis through the last slit at packing. Our facility staff, from process chemists to QC techs, treat each roll as a direct contribution to our customer’s finished device. By focusing on it as a solution, not just a SKU, we help shift industry expectations for what a polyimide film can deliver.
Feedback keeps our process sharp. We listen for reported problems after installation, use them as opportunities to push process improvements, and take every step possible to ensure that HN-25-S works not just by the book, but in the unpredictable reality of factory floors. Our long track record of close customer partnership and strong material has led engineers, designers, and manufacturers to count on our film for critical insulation, protection, and assembly performance.
Polyimide HN-25-S doesn’t try to be everything for everyone. It stands strong as a solution for teams with no patience for production setbacks or unplanned downtime. Our manufacturing experience shaped the film for everyday use in the world’s most demanding electrical and electronic challenges—and proven consistency batch to batch backs it up. In every case where temperature, mechanical stress, insulation, and end‐of‐line appearance count, HN-25-S delivers what years of manufacturing experience have taught us to value: honest, durable, and performance-focused polyimide built for tough jobs.