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Polyimide HI-S-02

    • Product Name Polyimide HI-S-02
    • Alias PI-HI-S-02
    • Einecs Polyimide HI-S-02 does not have an assigned EINECS number.
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    Specifications

    HS Code

    392085

    Product Name Polyimide HI-S-02
    Appearance Amber film
    Thickness 12.5-125 microns
    Tensile Strength 160 MPa
    Elongation At Break 45%
    Dielectric Constant 3.4 (at 1 kHz)
    Volume Resistivity 1 x 10^17 ohm·cm
    Thermal Conductivity 0.12 W/m·K
    Glass Transition Temperature 360°C
    Continuous Use Temperature Up to 260°C
    Water Absorption 0.9%
    Flammability UL94 V-0

    As an accredited Polyimide HI-S-02 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Polyimide HI-S-02 is packaged in a 1 kg sealed aluminum bag, inside a sturdy cardboard box, ensuring moisture protection.
    Shipping Polyimide HI-S-02 is shipped in sealed, chemical-resistant containers to ensure product integrity and prevent moisture exposure. Packages are clearly labeled with hazard information, handled according to applicable safety regulations, and often shipped via ground or air freight depending on destination requirements. Temperature and handling guidelines are strictly followed during transit.
    Storage Polyimide HI-S-02 should be stored in a cool, dry, and well-ventilated area away from direct sunlight and sources of ignition. Containers must be tightly sealed to prevent moisture absorption and contamination. Storage temperatures should typically be maintained between 5°C and 25°C. Avoid contact with incompatible materials such as strong acids and bases. Follow all relevant safety and handling guidelines.
    Application of Polyimide HI-S-02

    High thermal stability: Polyimide HI-S-02 with high thermal stability is used in flexible printed circuits, where it enables sustained performance at temperatures exceeding 300°C.

    Low dielectric constant: Polyimide HI-S-02 with a low dielectric constant is used in high-frequency electronic substrates, where it reduces signal loss and enhances circuit efficiency.

    Film thickness uniformity: Polyimide HI-S-02 with controlled film thickness uniformity is used in semiconductor wafer passivation, where it ensures even layer coverage and minimizes defect rates.

    High purity 99.9%: Polyimide HI-S-02 with a high purity of 99.9% is used in microelectronic device fabrication, where it prevents contamination and increases overall device yield.

    Solvent resistance: Polyimide HI-S-02 exhibiting strong solvent resistance is used in OLED panel encapsulation, where it maintains structural integrity during chemical processing.

    High molecular weight: Polyimide HI-S-02 with high molecular weight is used in aerospace insulation tapes, where it enhances mechanical strength and elongation properties.

    Low outgassing: Polyimide HI-S-02 with low outgassing characteristics is used in satellite component shielding, where it minimizes volatile emission and maintains vacuum integrity.

    Glass transition temperature 370°C: Polyimide HI-S-02 with a glass transition temperature of 370°C is used in automotive sensor assemblies, where it prolongs material performance under cyclic thermal loads.

    Controlled viscosity grade: Polyimide HI-S-02 with a controlled viscosity grade is used in advanced coating applications for electronics, where it ensures precise application and uniformity.

    Particle size ≤ 5 µm: Polyimide HI-S-02 with particle size ≤ 5 µm is used in additive manufacturing processes, where it provides superior dispersion and smooth surface finish.

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    Competitive Polyimide HI-S-02 prices that fit your budget—flexible terms and customized quotes for every order.

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    Certification & Compliance
    More Introduction

    Polyimide HI-S-02: Reliable Performance for Demanding Applications

    A Closer Look at Polyimide HI-S-02

    Polyimide HI-S-02 stands out from the crowd of specialty polymers. Our team developed it in response to the needs we saw in advanced manufacturing. The market kept asking for stability, clean performance, and a way to push the temperature envelope without letting the rest of the system down. As long-time producers of high-performance polymers, we learned that just offering a polyimide isn’t enough—the details of chemistry and layout of the chain structure make all the difference in practice.

    HI-S-02 holds up its reputation through each batch that comes off our line. Its structure offers excellent thermal stability, with continuous service temperature pushing past 260°C in real-world conditions. Unlike some other polyimides, HI-S-02 resists creeping and deformation, even under mechanical load and heat. Many users have told us their old materials would lose shape, but HI-S-02 panels, films, or shapes keep their dimensions through repeated cycling. This quality proved invaluable in our customers’ aerospace assemblies and high-power electrics.

    Built-In Chemical Resistance

    Working in chemical manufacturing, we cannot ignore how aggressive process fluids and solvents break lesser materials down. HI-S-02 won’t dissolve or break up when exposed to common acids, bases, or organic solvents. It’s true that no plastic lasts forever when faced with the nastiest mixtures, but in comparative testing—running films and rods of HI-S-02 through multi-week soak tests—we see less weight loss and fewer surface cracks. Plant users notice this when lining pumps, as well as chipmakers seeking process stability in clean rooms.

    We’ve put HI-S-02 into both thin, flexible films and rigid precision-molded parts. In both cases, the material profile stays consistent. That gives manufacturing engineers confidence during design selection and lets us guarantee lot-to-lot consistency, since we control each step from monomer synthesis to the polymerization reaction. Any way you slice it, HI-S-02 stays reliable from the lab to volume production.

    Electrical Stability Under Demanding Loads

    Our experience with power electronics shows that insulation performance matters as the voltages rise and frequencies climb. HI-S-02 delivers dielectric strength above 250 kV/mm in tested films. Customers wiring up inverters, motor windings, and flexible printed circuits need that kind of reliability. HI-S-02 reduces the need for oversized insulation layers, so users can manage heat dissipation and pack components close while sleeping easy over the long term. The stable molecular backbone means insulation won’t degrade quickly under voltage stress.

    We developed HI-S-02 in our facility with control over all feedstocks. Many so-called polyimide producers are just compounding premade powders from overseas. Instead, we handle the full synthesis, which gives us finer control of impurities—a big deal for users who demand materials certified for low ionic contamination. Semiconductor fabs and aerospace system integrators comment positively on materials science details most resellers can’t explain. High purity also helps reduce nuisance outgassing, a factor in both vacuum and optical-grade applications.

    Patterned Processing and Custom Machining

    Unlike traditional commodity plastics, HI-S-02 tolerates a demanding post-processing regimen. In our plant, we’ve watched machinists shape HI-S-02 parts for aerospace gauges, high-precision aerospace gears, and sliding bearings. Edges stay crisp, and there’s little tendency to chip or crack even with high-speed tooling. This machinability saves time—our customers avoid sending out parts for extra finishing work.

    Pattern-etching is another request we field from advanced electronics design teams. HI-S-02 sports a tightly cross-linked structure, which means patterns etched with reactive ion or plasma methods don’t bleed or bridge easily. When making flex circuits and substrates for microwave or radar assemblies, this detail keeps transmission losses to a minimum—a fact that comes up in user meetings more than we would have guessed years ago. We also get fewer returns of delaminated sheets compared to polyimides that contain cheap fillers.

    Excellent Mechanical Durability

    Through years of lab testing and user feedback, we find that HI-S-02 absorbs mechanical abuse better than other high-performance plastics. Its tensile modulus fits squarely in the targets for both robust mounting and controlled flexibility. Load-bearing parts in vacuum systems or aircraft interiors, where small deformations lead to big trouble, benefit from HI-S-02’s retention of original shape. Field engineers often bring us failed components made from lower-grade polymers and ask for upgrades—replacing them with HI-S-02 extends service intervals and reduces downtime.

    We took added care to ensure HI-S-02 resists micro-cracking, both during installation and in operation. Some users doubted the difference, but after seeing five-year-old spacers and seal rings in high-cycling test beds, skepticism turns into repeat orders. From shock absorbers in mining equipment to thermal washers in satellites, HI-S-02 handles stress without flaking, swelling, or shedding particles. That’s become a talking point in meetings with QA teams who need to approve materials for new critical systems.

    Comparing HI-S-02 to Other Polyimides on the Market

    Few polyimides have as clean a profile as HI-S-02. Many suppliers create theirs using rapid polymerization, which can generate low-molecular-weight byproducts. These tend to reemit under heat and stress, sometimes causing odor or system fouling. Our process prioritizes high conversion efficiency. That brings residual monomer and low-mass oligomer levels well below industry averages. This has a direct impact: HI-S-02 parts placed inside sensitive optical, electronic, or ultrahigh-vacuum environments emit far less volatile residue.

    Competitor grades sometimes boost claimed physical performance using glass or mineral fillers. While that can stiffen a material, it brings two problems: increases the dielectric constant (troublesome for high-frequency systems) and raises particle contamination risk in clean environments. Since HI-S-02 achieves its mechanical strength by chain design rather than fillers, it stays stable at frequency, shows less debris during installation, and behaves predictably in precision machining. Someone once brought us a gear made from a filled polyimide; the debris clogged their lubrication passages, leading to premature bearing failure. In our experience, clean chemistry beats cheap fillers every time.

    Some polyimides on the market stay sold only as granular feedstock or powder for pressing. This limits part design and introduces process risks during consolidation. With HI-S-02, we deliver film, sheet, rod, or machined part—no need for compromise engineering or glue-laminating multiple materials together. This brings design flexibility and lets us collaborate with users to create new geometries for next-generation assemblies. We’ve followed our HI-S-02 grades into everything from lab-scale medical implant prototypes to large-scale printed board production.

    Thermal Shock and Long-Term Aging

    Engineers often ask about resistance to thermal shock. HI-S-02 performs well where rapid changes in temperature tend to crack cheaper plastics. Our high-altitude drone customers, for example, demand that insulators and brackets keep their shape through cycles of cold and radiant heat. In internal oven tests—cycling from -196°C up to 350°C—HI-S-02 samples don't show signs of crazing or embrittlement. We’ve visited tech centers still running our first generation films nearly a decade after installation, proof enough for us that design robustness beats spec-sheet promises.

    Our in-house aging studies speak for themselves. We run material under tension, heat, and reactive atmospheres for extended periods. HI-S-02 resists oxidation and UV yellowing longer than several competing grades. This pays off in outdoor telecommunications, photovoltaic mounting, and aerospace exterior panels. Customers in satellite system integration highlight how maintaining pigment and gloss helps avoid “solar-baked” failures in orbit. Our data beats most industry entries, and it's no surprise that original prototypes using HI-S-02 keep working far beyond their design lives.

    Meeting Application Challenges in Critical Fields

    We’ve seen HI-S-02 take on roles both obvious and unexpected. Its roots lie in electronics and aerospace, but new applications keep finding their way to our plant. Medical devices have begun adopting HI-S-02 for key components, especially where sterilization cycles would break other thermoplastics. We ship batches to device manufacturers who run them through steam autoclaves and ethylene oxide exposures—HI-S-02 holds dimensional stability and mechanical properties after repeated cycles.

    In the growing world of advanced battery assembly, HI-S-02 is finding a place as both separator and insulation barrier. Fatigue under high temperatures and constant cycling breaks most conventional separators, while HI-S-02 keeps cell-to-cell resistance up and stays chemically inert in the face of evolving battery chemistries. Materials engineers at several battery startups have pointed out that reliability here means safety and marketability for their end products, making HI-S-02 a material of choice.

    Manufacturing Experience and Material Quality Matter

    All these claims stand on our thirty years in polymer chemistry. We serve as more than custom compounding vendors. Our staff spends time on production lines and in customer factories, troubleshooting real-world failures and learning what a difficult process means for daily operations. Rather than chasing one-off sales, we rely on deep feedback—a turbine or satellite builder tells us precisely how long a component lasted, why it failed, or when it worked better than expected. We take that information back to process engineering and tweak the next HI-S-02 production run for even tighter tolerances. As a result, our process repeats batch-to-batch, year-to-year: no surprises for returning customers.

    Our in-house analytics team uses state-of-the-art FTIR, NMR, and TGA equipment to scrutinize each lot. That helps us spot contamination before any shipment leaves our facility. Most competing products are sourced from overseas blends or rely on toll operators for final compounding—making real traceability a guess at best. Here, even a mold finisher can tell you the lot number and process step for every HI-S-02 unit, and users recognize this reliability in their field results.

    Doing More Than Polyimide: Thinking About the Total Application

    Chemical manufacturing means keeping a close eye on downstream effects. Performance in isolation means little if it brings trouble in a real system. HI-S-02’s low moisture uptake stands out in environments where condensation or vapor pressure events bring standard polymers to their knees. Oil and gas engineers, working on subsea connectors and seals, trust HI-S-02 for long-term resistance to swelling and degradation, reporting fewer leaks and lower maintenance needs since switching materials. When we first offered HI-S-02, some customers worried its higher up-front cost would hurt their margin—but long-term records show sharp reductions in field service calls and part replacements.

    Ease of integration matters. HI-S-02 welds clean to compatible resins and bonds to engineered metals with commonly available adhesives. Our machine shop partners rarely need exotic tools or customized fixturing. Yield rates stay high, and assemblies pass rigid QA checks, something processors appreciate as cost pressure keeps rising across all industries. Talking to assembly line engineers gives us design feedback we use to fit HI-S-02 into both new builds and retrofit projects, keeping downtime and rework to a minimum.

    Environmental Responsibility and Regulatory Compliance

    HI-S-02 meets growing demands for environmental stewardship. Our operation uses closed-loop chemical recovery and keeps VOC emissions below industrial benchmarks. More users are requesting traceability certificates, RoHS compliance data, and environmental exposure histories per shipment. We supply those as standard. A few years ago, this level of transparency was rare—you had to ask and hope someone still had the paperwork. Now, regulatory teams find those answers ready. For major OEMs in automotive, electronics, or medical, these facts mean the difference between compliance approval and project delay.

    We also see a shift toward lifecycle accountability. HI-S-02 resists degradation, holding up for years rather than months. This helps teams address questions about waste, replacement intervals, and total material costs over time. We’re not blind to the challenges ahead—designers ask about recyclability and chemical end-of-life. While polyimides aren’t as easy to recycle as commodity plastics, our research staff now investigates chemical recycling and new end-user paths to reduce overall scrap. Open conversations with both customers and environmental agencies drive this exploration, and every year we edge closer to a closed-loop solution that doesn’t undermine material performance.

    Looking Ahead: Anticipating Industry Demands

    Our team keeps a close eye on trends in semiconductor processing, electric vehicles, and next-generation energy. Material demands shift fast, and a lagging product can spell disaster for manufacturers. HI-S-02 is one of those rare polymers with versatility—we’ve seen it perform not just in established applications but in emerging technologies. As thin-film transistors grow ever smaller, for instance, clean interface layers with precise thickness control matter more than ever. HI-S-02 rolls out of our factory in ultra-thin sheets without losing any of its mechanical or chemical characteristics.

    We continue working with R&D teams beyond our own four walls. Development doesn’t happen in isolation—real progress comes when engineers use new material grades in actual systems and feed experience back to us. One of the best ways we improve HI-S-02 is by running user trials alongside their stress testing benches. This hands-on partnership pushes real innovation: tighter purity, better thermal cycling, easier patterning, or new application methods. The feedback loop helps us cut through marketing claims and get to what truly matters in performance.

    Challenges, Solutions, and the Road Forward

    Every specialty polymer faces challenges—demand for even greater clean-room compatibility, tighter purity, and lower cost always looms. We listen to design engineers and operators who use HI-S-02 under the toughest conditions and look for ways to push material limits further. Whether that means post-treatment to further drive down residuals, new forming techniques for micro-scale parts, or supply chain innovations to keep lead times short, our door stays open to collaboration and feedback. No polymer grade ever stands still for long, but HI-S-02 holds its place as a trusted answer to tough material problems.

    HI-S-02 earns return business from companies running high-value, high-stakes processes. Our record of direct technical support, reliable sourcing, and transparency has set us apart. As demands rise for smarter, more durable materials, HI-S-02 remains a reliable choice for teams designing for the future. Each day working with this polyimide reinforces one truth: no shortcut or workaround ever matches the results of deep, consistent chemistry and a lasting partnership between producer and end-user.