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Polyimide A-PI-380

    • Product Name Polyimide A-PI-380
    • Alias PI-380
    • Einecs 500-964-1
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
    Specifications

    HS Code

    504127

    Appearance Amber transparent film
    Thickness 12.5 μm
    Tensile Strength 200 MPa
    Elongation At Break 60%
    Dielectric Strength 200 kV/mm
    Volume Resistivity 1 x 10^17 Ω·cm
    Thermal Conductivity 0.12 W/m·K
    Glass Transition Temperature Tg 380°C
    Continuous Service Temperature 260°C
    Water Absorption 0.7%
    Flame Retardancy UL94 V-0
    Density 1.43 g/cm³

    As an accredited Polyimide A-PI-380 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Polyimide A-PI-380 is packaged in a 1-kilogram, sealed, amber glass bottle with a tamper-evident screw cap.
    Shipping Polyimide A-PI-380 is shipped in sealed, moisture-proof containers to maintain product integrity. Packages are clearly labeled with appropriate hazard information and handled according to chemical safety regulations. Transit is arranged via trusted carriers, ensuring temperature and environmental controls as needed. All shipments comply with relevant international and local transportation standards.
    Storage **Polyimide A-PI-380** should be stored in a tightly sealed container, in a cool, dry, and well-ventilated area away from direct sunlight and sources of ignition. Avoid exposure to moisture and incompatible materials such as strong acids and bases. Recommended storage temperature is generally below 25°C (77°F). Ensure proper labeling and handle according to safety guidelines for polymeric chemicals.
    Application of Polyimide A-PI-380

    High Thermal Stability: Polyimide A-PI-380 with high thermal stability is used in flexible printed circuits, where it ensures consistent electrical performance under extreme temperatures.

    Purity 99.5%: Polyimide A-PI-380 with 99.5% purity is used in semiconductor fabrication, where it minimizes contamination and enhances device reliability.

    Viscosity Grade 2500 mPa·s: Polyimide A-PI-380 with viscosity grade 2500 mPa·s is used in advanced coating processes, where it promotes uniform layer formation for high-resolution insulation.

    Glass Transition Temperature 380°C: Polyimide A-PI-380 with a glass transition temperature of 380°C is used in aerospace wire insulation, where it maintains mechanical integrity at elevated service temperatures.

    Dielectric Strength 250 kV/mm: Polyimide A-PI-380 with dielectric strength of 250 kV/mm is used in microelectronic encapsulation, where it provides reliable electrical insulation for densely packed circuits.

    Molecular Weight 185,000 g/mol: Polyimide A-PI-380 with molecular weight 185,000 g/mol is used in composite laminates, where it improves tensile strength and dimensional stability.

    Low Outgassing: Polyimide A-PI-380 with low outgassing properties is used in vacuum electronic applications, where it reduces risk of contamination and maintains component integrity.

    Particle Size 1-5 μm: Polyimide A-PI-380 with particle size 1-5 μm is used in precision additive manufacturing, where it enables smooth surface finishes and fine structural detail.

    Solvent Resistance: Polyimide A-PI-380 with excellent solvent resistance is used in chemical process equipment linings, where it extends service life in harsh operational environments.

    UV Stability: Polyimide A-PI-380 with high UV stability is used in photovoltaic panel protection films, where it preserves optical clarity and material strength under prolonged sunlight exposure.

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    Competitive Polyimide A-PI-380 prices that fit your budget—flexible terms and customized quotes for every order.

    For samples, pricing, or more information, please call us at +8615371019725 or mail to admin@sinochem-nanjing.com.

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    Certification & Compliance
    More Introduction

    Polyimide A-PI-380: Raising the Bar for High-Performance Polymer Applications

    Pushing Boundaries With Polyimide A-PI-380

    From our research labs to our reactors, the road toward introducing Polyimide A-PI-380 demanded sharp focus and deep technical commitment. Synthetic chemists and processing engineers spent long hours troubleshooting subtle factors—mix ratios, temperature ramps, molecular weights—before this grade met all our expectations. Our A-PI-380 model offers something special, which doesn’t come from marketing but from years of refining real-world performance. We saw a need in applications exposed to heat, stress, and chemicals—places where most plastics gradually degrade, surfaces become brittle, and electronics lose reliability. The tireless work came down to the polymer backbone: a rigid aromatic structure delivering toughness with high elasticity, resisting distortion where many alternatives sag or decompose.

    We have run the stuff hard: cycling it up past 360°C, exposing it to aggressive solvents in our own stress chambers, pressure-molding it for connectors, bobbins, and flexible circuits. We measured mechanical retention as relentless oven aging left less advanced polymers pitted or warped. The results convinced us: A-PI-380 holds shape, keeps tensile strength, and shrugs off embrittlement even after repeated thermal cycles or direct contact with chemicals like NMP or strong acids. Its dielectric breakdown profile gave our team the confidence to recommend it for advanced electronics, from aerospace wiring to displays that pulse and flex across complex contours.

    Key Differences Setting Polyimide A-PI-380 Apart

    Competitors often echo similar claims—high-performance, robust insulation, heat resistance—but fine details decide which polymer families really deliver on the factory floor. Here, the first difference we see comes down to purity. We keep our synthesis lines dedicated, minimizing cross-contamination and keeping impurity levels down to under 50 ppm. Osmium was a troublemaker for some resins; our engineering staff found a reliable way to filter those trace metals. The result is a material with stable electrical properties across thousands of cycles, essential for long-life components in satellites or 5G infrastructure where consistency cannot take a back seat.

    Molecular structure also tells the story. Our A-PI-380 model incorporates a specific ratio of aromatic diamines and dianhydrides, built around a patented coupling sequence that allows for a tighter, more linear polymer chain. We’ve tracked batch-to-batch differences for years by analyzing glass transition and decomposition temperatures, both trending higher than many alternatives. Technicians who regularly injection-mold components describe fewer issues with warping, fewer stuck parts, and shorter cooling times because the flow behavior stays consistent throughout long production runs. If you’ve had headaches over unexpected yellowing, excessive offgassing, or random shrinkage in functional parts, these differences are more than specs—they are the elimination of rework, scrap, and costly downtime.

    Real Applications and Usage Scenarios

    End-use engineers want polymers that perform, not just on Monday morning but after years in punishing conditions. We see Polyimide A-PI-380 most frequently specified for flexible printed circuits, insulation films, kapton tape, and coil bobbins in motors that handle heavy loads or extended temperature cycling. We talk to partners in aerospace, automotive powertrains, and precision electronics assembly. Their demands never stay static.

    Our own experience scaling up production for electronic interconnects required robust polymer films able to withstand high-frequency oscillations without microcracking. A-PI-380 showed minimal dielectric loss and stable capacitance, letting sensitive signal lines operate without crosstalk or leakage, even after fifty thousand flex cycles in environmental testing. This polymer has also proved dependable for chip packaging, thermal isolation layers, and oilfield sensor housings, where repeated temperature swings and chemical exposure reveal the difference between failure and years of reliable performance.

    Specifications Forged by Field Testing

    Specifications and numbers have little meaning if they don’t match how the material behaves under real work conditions. Polyimide A-PI-380 comes with a continuous-use temperature limit above 350°C, more than enough margin for most industrial circuits, jet engines, and heat-generating electronics. Our tensile strength numbers, verified through repeated batch testing, regularly exceed 180 MPa, and tear resistance matches or outperforms conventional fluoropolymers under both static and impact loads.

    Solvent resistance became a source of pride—and stress—during qualification runs for a major semiconductor customer. Acid etching and solvent washes often destroy standard engineering plastics, but A-PI-380 kept integrity and dimensional tolerance even after repeated cleaning cycles. Our team documented the difference when testing other so-called high-performance films, many of which absorbed solvents, warped, or lost dielectric performance. The dimensional stability we achieve results from balanced chain orientation through precise extrusion and annealing control; this kept the customer’s multilayer flex circuits aligned and met their tightest impedance targets.

    Thermosetting behavior and controlled curing bring benefits for composite applications, too. Resin flow remains predictable, avoiding unpredictable hotspots and air pockets during prepreg manufacturing. The final cured polymer gives both high glass transition and minimal creep—critical for satellite structures, high-speed rail cable insulation, and motor slot liners. By adjusting the curing cycle, fabricators report minimal shrinkage and stress cracks compared to commodity polyimide blends. Production teams see less waste and avoid failures during quality checks.

    Resilience Built Into the Molecular Structure

    Resilience means more than passing a single test—it requires holding up over years, under strain, without losing key performance traits. Since our operations cover the entire process from monomer selection to drying, we verify every step. Teams monitor the viscosity window closely, keeping it tight batch after batch, which delivers dependable film thickness and even curing through complex mold geometries.

    Feedback from the field drives continual improvement. Once an aerospace client reported gold-plated traces degrading after satellite launch. Laboratory work showed that traces of halogens in bulk resin caused small corrosion hotspots. We responded by changing our purification steps, cutting halide levels down by another order of magnitude—something that rarely shows up on standard datasheets but means a real reduction in unplanned downtime and mission failures.

    Extreme environments stress polymers in unpredictable ways: ionizing radiation, outgassing, and micro-vibration all challenge the chain structure. We ran extensive gamma and electron beam irradiation cycles on A-PI-380, tracked breakdown voltage shifts, and measured tensile retention. Results convinced engineers to specify our material for high-orbit satellites and deep drilling logging tools—a badge of trust earned through sweat, not just words.

    Why Industry Insiders Choose Polyimide A-PI-380

    Experience in polymer manufacturing doesn't just shape the product—it teaches where shortcuts in processing cost more down the line. We designed A-PI-380 not only to pass the initial quality inspections but to resist slow embrittlement, craze formation, and loss of voltage endurance after seasons of service. Whether it’s an MRI coil or a battery separator in a hybrid vehicle, these applications test the material well past the shelf-life assumptions, exposing the weaknesses of less disciplined resins.

    Our collaboration with industrial partners doesn't stop at shipment. Technical managers tell us about their equipment quirks, from the nozzle temperatures that can trigger outgassing to the tiny misalignments causing wrinkles in tape or film. We roll those insights back into our process, tweaking drying times and reworking the monomer feed sequence. For every new challenge, from higher-frequency signals in advanced radar arrays to stricter emissions requirements for transportation, this iterative feedback loop sharpens A-PI-380.

    Addressing Challenges and Pushing Limits

    Demand for better, lighter, and safer materials isn’t slowing down. As products shrink and complexity grows, reliability weak points get exposed fast. Some of our early production challenges stemmed from controlling micron-level contaminants—particles invisible to the naked eye but enough to seed insulation failures in thin-film printed circuits. Once we bolstered air filtration and automated key stages in our film casting lines, defect counts fell and confidence grew among integrators.

    For customers who transition from legacy insulation materials, change compounds risk. We have hosted operators in our pilot plants, letting them process early production runs side by side with legacy materials. This approach showed, for example, that A-PI-380 offered cleaner punch-outs in die-cutting, less static buildup during winding, and a smoother release from backing films—small differences that impact overall cost and workflow speed in scaled factories.

    Energy storage designers have shown increasing interest in A-PI-380, thanks to its ability to act as a thin dielectric barrier. In such applications, our improved purity and low particulate levels mean fewer short circuits—translating into higher reliability for consumer and industrial battery packs. We don’t claim these advantages lightly; every marketing point follows after head-to-head testing, root cause analysis, and months of field trials.

    How Experience Informs the Product Journey

    Our history in making, troubleshooting, and improving high-performance polymers directly colors each upgrade. Some improvements come only after problems show up on the customer’s side: a thin spot in a roll, a brittle edge after thermal lamination, a yellowing problem in displays. Each time, our chemists, line operators, and QC technicians tear apart the process to understand and resolve the root cause, which raises the standard for all future batches.

    Internal collaboration plays a big role—no handoff between marketing and production, but ongoing communication from floor to lab. Many solutions grew from informal stories: a line operator noticing a weird sound during winding, a QC technician picking up a faint, off-smell, or a process engineer flagging a slight trend in tension across a week's production logs. No software detects every issue, so human experience and close attention drive genuine results.

    What Sets Our Polyimide on a Different Level

    Buyers and engineers who have tried more than a few high-grade polyimides know that real differences emerge in high-heat cycling, after months of continuous power cycling on a test bench or following exposure to cleaning agents and outgassing in vacuum chambers. That’s where A-PI-380 shows its true colors—minimal dimensional shift, steady insulation performance, and resistance to pinholes or voids even under harsh flexing or pulsed loads.

    Part of the difference lies in never rushing a batch to market. Each run faces stringent mass loss, ash content, and dielectric withstand tests before getting released. If a shipment doesn't meet spec, we scrap it—full stop. Over years, this discipline creates a track record of reliability that our most demanding customers in defense, aviation, and automotive electronics care about.

    Technicians working daily with A-PI-380 often point out the feel—the toughness during slitting, the crisp edges on die-cut pieces, the consistent lay-flat during lamination of multilayer flexible circuits. These are tactile benchmarks that seldom make it into marketing but matter for downstream assembly, where every snag or curl translates into costly rework or assembly line holdups.

    Solutions to Old Problems, Designed by Experience

    With legacy polyimides, thermal stability above 330°C frequently came with trade-offs in brittleness and process complexity. Our team tuned the monomer blend and molecular weight to boost toughness without softening, so A-PI-380 defies the wear-and-tear usually accepted as inevitable at high temperatures.

    Yellowing under UV exposure came up during one customer audit; we found and tackled a culprit in a side reaction during imidization, adjusting reactant purity and curing conditions. Customers in display manufacturing reported better color retention over longer production cycles. Mechanical engineers facing failures after oil exposure also reported back—extended soaking tests proved out that chemical inertness went up and cleanup became easier with fewer defects.

    Every solution emerged from real use, hands-on investigation, and dialogue with those who rely on every roll and molded piece. We view each challenge as a shared problem; our processes evolve, and our knowledge deepens.

    A Product Born From Real-World Demands

    Manufacturing polyimides isn’t about ticking checkboxes on a datasheet; it grows from fifty years of learning the pain points that keep factories, labs, and field crews running. Polyimide A-PI-380 stands on this foundation—not just a set of impressive numbers, but a collection of hard-earned refinements that shave hours off production downtime, save batches during unexpected upsets, and deliver end products that outlast the competition.

    We keep eyes open and ears tuned for the next set of demands, knowing every new application—whether a thinner battery separator, a more ruggedized circuit, or a faster signal line—raises the challenge once more. Our promise isn’t perfection, but the absolute commitment to improve, adapt, and solve together with those building the future using our polymers.