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HS Code |
436833 |
| Product Name | Fluorinated Ethylene Propylene Copolymer DS605 |
| Chemical Formula | (C2F4)n(C3F6)m |
| Appearance | Translucent pellets |
| Melting Point | 260°C |
| Density | 2.14 g/cm³ |
| Melt Flow Index | 10-16 g/10min (372°C, 5kg) |
| Tensile Strength | 20-32 MPa |
| Elongation At Break | 300-500% |
| Dielectric Constant | 2.1 (1 kHz) |
| Volume Resistivity | ≥10^18 Ω·cm |
| Maximum Service Temperature | 200°C |
| Water Absorption | <0.01% |
| Flammability | UL94 V-0 |
As an accredited Fluorinated Ethylene Propylene Copolymer DS605 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | The Fluorinated Ethylene Propylene Copolymer DS605 is packaged in 25 kg sealed, moisture-resistant, white polyethylene bags with clear labeling. |
| Shipping | Fluorinated Ethylene Propylene Copolymer DS605 is shipped in sealed, moisture-resistant containers to prevent contamination and degradation. Standard packaging includes double-lined polyethylene bags within fiber drums or cartons. Store and transport in a cool, dry place, avoiding direct sunlight and extreme temperatures. Comply with all relevant hazardous materials shipping regulations. |
| Storage | Fluorinated Ethylene Propylene Copolymer DS605 should be stored in a cool, dry, and well-ventilated area, away from direct sunlight, open flames, and sources of heat. Keep the material in tightly sealed original containers to prevent contamination. Avoid contact with strong acids, bases, and oxidizing agents. Ensure proper labeling and follow all manufacturer guidelines for safe handling and storage. |
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High purity: Fluorinated Ethylene Propylene Copolymer DS605 with high purity is used in semiconductor wafer processing, where it ensures minimized contamination for critical device fabrication. Thermal stability: Fluorinated Ethylene Propylene Copolymer DS605 with excellent thermal stability is used in wire insulation for aerospace applications, where it maintains electrical integrity at elevated temperatures. Low melting point: Fluorinated Ethylene Propylene Copolymer DS605 featuring a low melting point is used in heat shrink tubing, where it enables easy processing and uniform shrinkage. Fine particle size: Fluorinated Ethylene Propylene Copolymer DS605 with fine particle size is used in additive manufacturing powders, where it ensures smooth layer deposition and consistent print resolution. High molecular weight: Fluorinated Ethylene Propylene Copolymer DS605 with high molecular weight is used in chemical-resistant linings for reactors, where it provides enhanced mechanical strength and long-term durability. Superior chemical resistance: Fluorinated Ethylene Propylene Copolymer DS605 exhibiting superior chemical resistance is used in fluid handling systems, where it prevents degradation from aggressive solvents. Excellent dielectric properties: Fluorinated Ethylene Propylene Copolymer DS605 with excellent dielectric properties is used in high-frequency cable insulation, where it reduces signal loss and improves transmission efficiency. Consistent viscosity: Fluorinated Ethylene Propylene Copolymer DS605 with consistent viscosity is used in extrusion of thin films, where it ensures uniform thickness and surface quality. Low permeability: Fluorinated Ethylene Propylene Copolymer DS605 with low gas permeability is used in pharmaceutical packaging, where it prevents moisture and oxygen ingress to protect sensitive drugs. High surface smoothness: Fluorinated Ethylene Propylene Copolymer DS605 with high surface smoothness is used in non-stick cookware coatings, where it delivers excellent release performance and easy cleaning. |
Competitive Fluorinated Ethylene Propylene Copolymer DS605 prices that fit your budget—flexible terms and customized quotes for every order.
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Tel: +8615371019725
Email: admin@sinochem-nanjing.com
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