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HS Code |
101866 |
| Product Name | Fluorinated Ethylene Propylene Copolymer 1181P |
| Chemical Formula | (C2F4)x(C3F6)y |
| Density | 2.15 g/cm³ |
| Melting Point | 260°C |
| Thermal Conductivity | 0.25 W/m·K |
| Tensile Strength | 20 MPa |
| Elongation At Break | 300% |
| Dielectric Strength | 60 kV/mm |
| Water Absorption | <0.01% |
| Maximum Service Temperature | 200°C |
| Flammability | Non-flammable |
| Color | Translucent |
| Uv Resistance | Excellent |
As an accredited Fluorinated Ethylene Propylene Copolymer 1181P factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Fluorinated Ethylene Propylene Copolymer 1181P is packaged in 25 kg polyethylene-lined paper bags, labeled with product and batch details. |
| Shipping | Fluorinated Ethylene Propylene Copolymer 1181P is shipped in sealed, moisture-resistant packaging, typically as pellets or powder in drums or bags. Proper labeling ensures compliance with safety regulations. Store and transport in cool, dry conditions, away from direct sunlight and incompatible substances. Handle with appropriate PPE to prevent exposure. |
| Storage | **Fluorinated Ethylene Propylene Copolymer 1181P** should be stored in a cool, dry, and well-ventilated area, protected from direct sunlight and sources of heat. Keep containers tightly closed and away from incompatible materials such as strong acids or bases. Avoid exposure to moisture and ensure that storage areas are clean and free from potential contamination. Follow all relevant safety guidelines. |
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High Purity: Fluorinated Ethylene Propylene Copolymer 1181P with high purity is used in semiconductor wafer processing coatings, where it ensures minimal contamination and optimal device yield. Melt Flow Index: Fluorinated Ethylene Propylene Copolymer 1181P with a controlled melt flow index is used in wire insulation extrusion, where it delivers consistent processing speed and uniform insulation thickness. Thermal Stability: Fluorinated Ethylene Propylene Copolymer 1181P exhibiting thermal stability up to 260°C is used in high-temperature cable jacketing, where it maintains mechanical integrity and dielectric strength under prolonged heat exposure. Low Dielectric Constant: Fluorinated Ethylene Propylene Copolymer 1181P with a low dielectric constant is used in RF coaxial cables, where it minimizes signal loss and enhances transmission clarity. Particle Size: Fluorinated Ethylene Propylene Copolymer 1181P with fine particle size is used in powder coatings for chemical process equipment, where it delivers smooth, defect-free coatings and excellent chemical resistance. High Molecular Weight: Fluorinated Ethylene Propylene Copolymer 1181P of high molecular weight is used in film applications for photovoltaic backsheet layers, where it provides superior mechanical strength and weatherability. UV Resistance: Fluorinated Ethylene Propylene Copolymer 1181P with enhanced UV resistance is used in outdoor electrical connector housings, where it protects against degradation and color change over extended exposure. Low Permeability: Fluorinated Ethylene Propylene Copolymer 1181P featuring low gas permeability is used in chemical containment liners, where it prevents permeation and ensures containment efficiency. Surface Smoothness: Fluorinated Ethylene Propylene Copolymer 1181P with high surface smoothness is used in medical device tubing, where it reduces friction and facilitates easy fluid flow. Stability Temperature: Fluorinated Ethylene Propylene Copolymer 1181P stable up to 200°C is used in heat exchanger gaskets, where it maintains sealing performance and dimensional accuracy under thermal cycling. |
Competitive Fluorinated Ethylene Propylene Copolymer 1181P prices that fit your budget—flexible terms and customized quotes for every order.
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Tel: +8615371019725
Email: admin@sinochem-nanjing.com
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