Purity 99.5%: Fluorinated Ethylene Propylene Copolymer 1172P with 99.5% purity is used in semiconductor wafer coating processes, where it ensures minimal contamination for high device yield.

Molecular Weight 280,000 g/mol: Fluorinated Ethylene Propylene Copolymer 1172P featuring a molecular weight of 280,000 g/mol is used in wire insulation manufacturing, where it delivers superior mechanical strength and flexibility.

Melting Point 265°C: Fluorinated Ethylene Propylene Copolymer 1172P with a melting point of 265°C is used in high-performance cable jacketing, where it supports thermal endurance during continuous operation.

Particle Size 15 µm: Fluorinated Ethylene Propylene Copolymer 1172P of 15 µm particle size is used in non-stick cookware coatings, where it provides a uniform, defect-free surface finish.

Dielectric Constant 2.1: Fluorinated Ethylene Propylene Copolymer 1172P with a dielectric constant of 2.1 is used in high-frequency PCB fabrication, where it minimizes signal loss and maintains transmission integrity.

Viscosity Grade 15 Pa·s: Fluorinated Ethylene Propylene Copolymer 1172P at 15 Pa·s viscosity grade is used in precision extrusion for medical tubing, where it ensures dimensional stability and consistent flow.

Stability Temperature 200°C: Fluorinated Ethylene Propylene Copolymer 1172P with thermal stability up to 200°C is used in chemical processing equipment linings, where it resists thermal degradation and chemical attack.

Film Thickness 30 µm: Fluorinated Ethylene Propylene Copolymer 1172P at 30 µm film thickness is used in solar cell encapsulation, where it offers high transparency and weather resistance.