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HS Code |
557812 |
| Product Name | Fluorinated Ethylene Propylene Copolymer 1126P |
| Chemical Family | Fluoropolymer |
| Appearance | Translucent pellet |
| Density | 2.15 g/cm³ |
| Melt Flow Index | 15 g/10 min (372°C, 5 kg) |
| Melting Point | 260°C |
| Thermal Conductivity | 0.25 W/m·K |
| Dielectric Constant | 2.1 (at 1 MHz) |
| Elongation At Break | 300% |
| Tensile Strength | 28 MPa |
| Service Temperature Max | 200°C |
| Water Absorption | <0.01% |
| Flammability | UL94 V-0 |
| Chemical Resistance | Excellent |
| Weatherability | Excellent |
As an accredited Fluorinated Ethylene Propylene Copolymer 1126P factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | The Fluorinated Ethylene Propylene Copolymer 1126P is packaged in 25 kg double-layered polyethylene bags, sealed for moisture protection. |
| Shipping | Fluorinated Ethylene Propylene Copolymer 1126P is shipped in secure, sealed containers—typically plastic drums or bags—to protect against moisture and contamination. It should be transported in compliance with local regulations, stored in a cool, dry environment, and kept away from direct sunlight and incompatible substances to maintain its quality and safety. |
| Storage | Fluorinated Ethylene Propylene Copolymer 1126P should be stored in a cool, dry, well-ventilated area away from direct sunlight and sources of heat. Keep containers tightly closed to prevent contamination. Avoid exposure to strong acids, bases, and oxidizing agents. Store separately from incompatible materials. Ensure storage areas are equipped with appropriate fire suppression systems, as FEP is chemically stable but combustible at high temperatures. |
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High Purity: Fluorinated Ethylene Propylene Copolymer 1126P with high purity is used in semiconductor wafer manufacturing, where it ensures minimal ionic contamination. Molecular Weight: Fluorinated Ethylene Propylene Copolymer 1126P with controlled molecular weight is used in electrical cable insulation, where it provides uniform dielectric strength. Melting Point: Fluorinated Ethylene Propylene Copolymer 1126P with a melting point of 260°C is used in heat exchanger linings, where it ensures sustained thermal resistance. Particle Size: Fluorinated Ethylene Propylene Copolymer 1126P with fine particle size is used in powder coating applications, where it achieves smooth and defect-free surfaces. Stability Temperature: Fluorinated Ethylene Propylene Copolymer 1126P with stability temperature up to 200°C is used in high-temperature gasket fabrication, where it maintains sealing performance. Viscosity Grade: Fluorinated Ethylene Propylene Copolymer 1126P with low viscosity grade is used in injection molding of medical devices, where it supports precise component shaping. Chemical Inertness: Fluorinated Ethylene Propylene Copolymer 1126P with proven chemical inertness is used in chemical processing tubing, where it resists aggressive solvents and acids. Surface Smoothness: Fluorinated Ethylene Propylene Copolymer 1126P with enhanced surface smoothness is used in food processing equipment linings, where it minimizes product adhesion. Electrical Insulation: Fluorinated Ethylene Propylene Copolymer 1126P with superior electrical insulation property is used in microelectronic assemblies, where it prevents electrical leakage. UV Stability: Fluorinated Ethylene Propylene Copolymer 1126P with high UV stability is used in outdoor fiber optic cable sheathing, where it prevents material degradation. |
Competitive Fluorinated Ethylene Propylene Copolymer 1126P prices that fit your budget—flexible terms and customized quotes for every order.
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