Purity 99%: Silicon-Aluminum Powder [Uncoated] with a purity of 99% is used in metallurgical alloying processes, where it ensures consistent alloy composition and improves end-product uniformity.

Average Particle Size 10 µm: Silicon-Aluminum Powder [Uncoated] with an average particle size of 10 µm is used in powder metallurgy, where it enables excellent sinterability and enhanced mechanical properties.

Melting Point 577°C: Silicon-Aluminum Powder [Uncoated] with a melting point of 577°C is used in thermal spraying, where it achieves reliable coating adhesion and thermal stability.

Surface Area 3 m²/g: Silicon-Aluminum Powder [Uncoated] with a surface area of 3 m²/g is used in pyrotechnic formulations, where it delivers rapid ignition and uniform burn rates.

Oxidation Stability 400°C: Silicon-Aluminum Powder [Uncoated] with oxidation stability up to 400°C is used in high-temperature adhesives, where it offers prolonged resistance to degradation under thermal stress.

Loose Bulk Density 1.25 g/cm³: Silicon-Aluminum Powder [Uncoated] with a loose bulk density of 1.25 g/cm³ is used in lightweight concrete additives, where it facilitates overall weight reduction without compromising structural integrity.

Particle Size Distribution D50: 12 µm: Silicon-Aluminum Powder [Uncoated] with a D50 of 12 µm is used in 3D printing metal feedstock, where it ensures smooth powder flow and high-resolution part fabrication.

Tap Density 1.6 g/cm³: Silicon-Aluminum Powder [Uncoated] with a tap density of 1.6 g/cm³ is used in additive manufacturing, where it maximizes build density and interlayer bonding strength.

Impurity content <0.1% Fe: Silicon-Aluminum Powder [Uncoated] with impurity content less than 0.1% Fe is used in specialty electronic components, where it minimizes conductivity loss and enhances product reliability.

Moisture Content <0.05%: Silicon-Aluminum Powder [Uncoated] with moisture content less than 0.05% is used in chemical synthesis, where it prevents unwanted reactions and ensures process safety.