Purity 98%: N-Ethylperfluorooctanesulfonamide with 98% purity is used in the synthesis of water-repellent coatings, where it delivers optimal hydrophobic surface modification.

Molecular Weight 521 g/mol: N-Ethylperfluorooctanesulfonamide with a molecular weight of 521 g/mol is used in the formulation of flame retardants, where it provides enhanced thermal stability.

Melting Point 55°C: N-Ethylperfluorooctanesulfonamide with a melting point of 55°C is used in specialty polymer processing, where it allows for uniform mixing and dispersion.

Stability Temperature 200°C: N-Ethylperfluorooctanesulfonamide with a stability temperature of 200°C is used in high-temperature lubricants, where it maintains low volatility and chemical integrity.

Particle Size <10 μm: N-Ethylperfluorooctanesulfonamide with particle size below 10 μm is used in electronic encapsulants, where it ensures smooth film formation and particle uniformity.

Viscosity Grade Low: N-Ethylperfluorooctanesulfonamide of low viscosity grade is used in surface treatment agents, where it enables efficient substrate wetting and coverage.

Acid Value <1 mg KOH/g: N-Ethylperfluorooctanesulfonamide with acid value less than 1 mg KOH/g is used in textile finishing, where it minimizes substrate degradation and enhances fabric longevity.

Hydrophobicity >110° Contact Angle: N-Ethylperfluorooctanesulfonamide achieving greater than 110° contact angle is used in protective coatings, where it imparts strong water repellency.

Chemical Stability pH 2–12: N-Ethylperfluorooctanesulfonamide stable in pH 2–12 is used in industrial cleaning agents, where it ensures reliable performance across variable acidic and basic conditions.

Thermal Decomposition >300°C: N-Ethylperfluorooctanesulfonamide with thermal decomposition above 300°C is used in photolithography resists, where it provides excellent process durability at elevated temperatures.