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HS Code |
967070 |
| Chemical Name | Hexyltrichlorosilane |
| Cas Number | 14216-07-6 |
| Molecular Formula | C6H15Cl3Si |
| Molar Mass | 221.63 g/mol |
| Appearance | Colorless to pale yellow liquid |
| Boiling Point | 191 °C |
| Density | 1.077 g/mL at 25°C |
| Refractive Index | 1.425 at 20°C |
| Flash Point | 77 °C |
| Solubility | Reacts with water |
| Smiles | CCCCCC[Si](Cl)(Cl)Cl |
| Storage Conditions | Store in a cool, dry, well-ventilated place under inert atmosphere |
As an accredited Hexyltrichlorosilane factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Hexyltrichlorosilane is packaged in a 100 mL amber glass bottle with a secure screw cap, labeled with hazard warnings. |
| Shipping | Hexyltrichlorosilane should be shipped in tightly sealed containers under inert gas, away from moisture and incompatible materials. It is classified as a hazardous material (UN 2987) and requires proper labeling and packaging according to international transport regulations, including DOT and IATA. Use appropriate protective measures to prevent leaks and exposure. |
| Storage | Hexyltrichlorosilane should be stored in a tightly closed container, in a cool, dry, and well-ventilated area away from moisture and incompatible substances such as strong oxidizers and water. Keep it away from sources of ignition and protect from physical damage. Use under a fume hood and store in a corrosive-resistant area, as it reacts with moisture to release corrosive and toxic gases. |
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Purity 98%: Hexyltrichlorosilane purity 98% is used in microelectronic surface modification, where it enhances hydrophobicity and dielectric properties. Molecular weight 219.57 g/mol: Hexyltrichlorosilane molecular weight 219.57 g/mol is used in silicon wafer functionalization, where it ensures uniform monolayer deposition and robust adherence. Boiling point 186°C: Hexyltrichlorosilane boiling point 186°C is used in vapor phase silanization processes, where it promotes efficient surface grafting and minimal degradation. Viscosity 2.1 mPa·s: Hexyltrichlorosilane viscosity 2.1 mPa·s is used in thin film coatings for electronics, where it achieves precise thickness control and smooth film formation. Stability temperature 120°C: Hexyltrichlorosilane stability temperature 120°C is used in industrial polymer synthesis, where it maintains reactivity without premature hydrolysis. Particle size < 0.5 µm: Hexyltrichlorosilane particle size < 0.5 µm is used in nanoparticle surface modification, where it provides uniform silane coverage and improved dispersion. Refractive index 1.425: Hexyltrichlorosilane refractive index 1.425 is used in optical device fabrication, where it delivers tailored light transmission and minimal scattering. Moisture content < 0.5%: Hexyltrichlorosilane moisture content < 0.5% is used in high-performance adhesive formulations, where it increases bond strength and durability. Density 1.05 g/cm³: Hexyltrichlorosilane density 1.05 g/cm³ is used in advanced coating formulations, where it contributes to consistent layer thickness and material compatibility. Flash point 67°C: Hexyltrichlorosilane flash point 67°C is used in safe handling protocols for chemical manufacturing, where it reduces fire risk and supports regulated storage conditions. |
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