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HS Code |
237100 |
| Chemical Name | Bis(2-Methylbenzoyl) Peroxide |
| Cas Number | 16311-61-8 |
| Molecular Formula | C16H14O4 |
| Molecular Weight | 270.28 g/mol |
| Appearance | White crystalline powder |
| Odor | Odorless |
| Content | ≤87% |
| Melting Point | 70-77°C |
| Solubility | Insoluble in water, soluble in organic solvents |
| Storage Conditions | Store in a cool, dry, well-ventilated area away from heat and light |
As an accredited Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 500g bottle, HDPE plastic, sealed cap, inner liner, red hazard labeling, product name, CAS number, lot number, safety instructions. |
| Shipping | Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] must be shipped as a hazardous material. It requires cool, dry, and well-ventilated conditions in tightly sealed containers. Transport must comply with relevant regulations (such as UN 3108, Class 5.2 Organic Peroxide Type D, Solid), avoiding heat, sparks, and strong acids or bases. Proper labeling and documentation are mandatory. |
| Storage | Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] should be stored in a cool, dry, and well-ventilated area, away from heat sources, open flames, and direct sunlight. Keep the container tightly closed and segregate from combustible materials, reducing agents, and acids. Protect from physical damage, moisture, and incompatible substances to prevent decomposition and maintain chemical stability. |
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Purity: Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] with controlled purity is used in UV-curable coatings, where it ensures rapid polymerization and enhanced surface hardness. Particle size: Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] with fine particle size is used in dental resin formulations, where it promotes uniform curing and improved mechanical strength. Melting point: Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] with a defined melting point is used in adhesive manufacturing, where it provides consistent thermal activation and reliable bond formation. Stability temperature: Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] with high stability temperature is used in electronic encapsulation resins, where it ensures safe processing and stable storage. Moisture content: Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] with low moisture content is used in photopolymer printing plates, where it delivers predictable imaging quality and reduced defect rates. Molecular weight: Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] with standardized molecular weight is used in specialty elastomer crosslinking, where it achieves precise network structure and optimized elasticity. Residual solvent: Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] with minimal residual solvent is used in high-purity optical materials, where it prevents optical distortion and maintains clarity. |
Competitive Bis(2-Methylbenzoyl) Peroxide [Content ≤87%] prices that fit your budget—flexible terms and customized quotes for every order.
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