Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing admin@sinochem-nanjing.com 3389378665@qq.com
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Arsine

    • Product Name Arsine
    • Alias arsine
    • Einecs 215-116-9
    • Mininmum Order 1 g
    • Factory Site Tengfei Creation Center,55 Jiangjun Avenue, Jiangning District,Nanjing
    • Price Inquiry admin@sinochem-nanjing.com
    • Manufacturer Sinochem Nanjing Corporation
    • CONTACT NOW
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    Specifications

    HS Code

    270005

    Chemicalname Arsine
    Chemicalformula AsH3
    Casnumber 7784-42-1
    Molarmass 77.95 g/mol
    Appearance Colorless gas
    Odor Garlic-like
    Meltingpoint -117.35 °C
    Boilingpoint -62.5 °C
    Density 3.5 g/L (at 0 °C, 1 atm)
    Solubilityinwater Moderately soluble
    Toxicity Highly toxic
    Flammability Highly flammable
    Autoignitiontemperature 38 °C
    Vaporpressure 16.2 atm (at 20 °C)
    Unnumber 2188

    As an accredited Arsine factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing A 50-liter steel gas cylinder labeled "Arsine, CAS 7784-42-1," with hazard symbols, valve cap, and secured with safety seals.
    Shipping Arsine is shipped as a compressed, liquefied gas in high-pressure steel cylinders. The cylinders must be clearly labeled, kept upright, and secured during transport. Arsine is toxic and flammable, requiring packaging and handling in accordance with international regulations, such as the UN 2188 classification, and appropriate hazard communication.
    Storage Arsine should be stored in tightly sealed, corrosion-resistant gas cylinders, away from heat, sparks, or open flames, and in a cool, well-ventilated, and secure area. Storage must be separate from oxidizers and acids. Cylinders should be upright and clearly labeled, with appropriate gas detection and leak prevention measures in place to ensure safety due to its high toxicity and flammability.
    Application of Arsine

    Applications of Arsine in Industrial Manufacturing

    As a specialized manufacturer of high-purity arsine, we supply semiconductor and advanced material industries where stringent process control and regulatory adherence are critical. Below we outline major downstream applications where arsine production, quality, and handling standards directly impact end-product performance and regulatory compliance.

    1. Compound Semiconductor Device Fabrication

    Gallium arsenide (GaAs) and indium gallium arsenide (InGaAs) manufacturers rely on arsine as a vital precursor for vapor-phase epitaxy. Its high vapor pressure and ultrahigh purity are crucial in MOCVD and MOVPE reactors, dictating the electrical and optical properties of finished semiconductors for RF, optoelectronic, and high-speed digital devices. Achieving desired doping and layer uniformity requires precise metering and real-time purity assurance.

    Industry compliance standards

    • SEMI C3.59-0402: Specification for Arsine, 99.999% Minimum Purity
    • JEITA ET-5006: Arsine Gas Quality in Compound Semiconductor Manufacturing
    • ISO 9001:2015 Quality Management Systems (applicable to high-purity gas plants)
    • IEC 61511: Functional Safety for Gas Handling in Semiconductor Plants

    Typical usage ratio

    • 0.01–0.1 sccm per 10,000 sccm carrier gas, varied by reactor size, growth rate, and target layer stoichiometry
    • Ratio adjusted based on Ga:As or Ga:In:As supply in real-time for composition control

    Downstream process integration

    • Direct source gas feed to MOCVD/MOVPE epitaxy chambers, introduced upstream with regulated mass flow controllers
    • Real-time process gas mixing systems ensure precise deposition environment during multiwafer runs

    Final product types

    • GaAs wafers for RF power amplifiers and microwave ICs
    • InGaAs photodetector chips for fiber optic communications
    • LEDs and high-efficiency photovoltaic cells

    2. Microelectronic Logic & Memory Chip Manufacturing

    Arsine enables selective doping and source/drain engineering in advanced CMOS and compound semiconductor logic lines. Semiconductor foundries adopt tight incoming gas quality controls, with monolithic integration processes relying on precisely dosed arsine to produce targeted n-type or p-type channel properties. Downstream cleanroom integration tasks include tight coupling to abatement units and redundant safety monitors due to the acute toxicity of the gas.

    Industry compliance standards

    • SEMI S2: Environmental, Health, and Safety Guidelines for Semiconductor Manufacturing Equipment
    • SEMI F5: Purity Standards for Electronic Chemicals
    • OSHA 29 CFR 1910.119: Process Safety Management for Handling Toxic Gases
    • NFPA 55: Compressed Gases and Cryogenic Fluids Code (handing and storage)

    Typical usage ratio

    • Below 5 ppm by volume in dopant gas mixtures for ion implantation
    • 2–50 ppm in selective MOCVD epitaxy steps, adapted for device geometry and node requirements

    Downstream process integration

    • Connected to dopant gas cabinets with automated interlocks in subfab and main wafer line
    • Feedstock for dopant spray in single-wafer ion implanters and atomic-layer deposition reactors

    Final product types

    • Logic ICs at process nodes 28 nm and below
    • High-density DRAM and flash memory chips
    • Advanced CMOS image sensors

    3. Solar Cell (Photovoltaic) Wafer Production

    Photovoltaic device manufacturers pursue higher conversion efficiency using III-V semiconductors, notably multi-junction cells based on GaAs and InGaAs. These processes demand arsine for arsenide-containing layers with tight compositional control, supporting next-generation solar panels for aerospace and terrestrial use. Safety engineering for gas cylinder management and exhaust scrubbing systems are integral for compliance.

    Industry compliance standards

    • IEC 62932: Safety for PV Devices Using Toxic Gases
    • REACH Regulation EC 1907/2006: Registration and Use of Toxic Substances
    • ISO 14001: Environmental Management in Chemical Processing for Solar Manufacturing

    Typical usage ratio

    • 0.05–0.3 mol% in group III-V precursor feed, aligned to desired bandgap profile
    • Cylinder exchange frequency and dilution based on batch vs. continuous growth models

    Downstream process integration

    • Precursor injection during MOVPE ramp-up to deposit arsenide layers on Ge or InP substrates
    • Inline purity monitoring and abatement systems for process vent gases

    Final product types

    • Triple-junction solar cell wafers for satellites
    • High-efficiency GaAs-based solar panels
    • Photovoltaic assemblies for concentrated solar power installations

    4. Infrared Detector and Sensor Manufacturing

    Manufacturers of advanced photodetectors utilize arsine as a key feedstock for indium gallium arsenide and related materials, focusing on precision reactor dosing for high-performance sensor arrays. Controlled arsenic incorporation directly influences cutoff wavelength and device sensitivity, crucial for applications such as SWIR imaging and spectrometry.

    Industry compliance standards

    • RoHS Directive 2011/65/EU (with applicable exemptions for optoelectronics)
    • ISO/TS 16949: Quality standards for sensor and automotive electronics
    • SEMI C3.59-0402: Ultra-high Purity Arsine Use

    Typical usage ratio

    • 0.02–0.2 sccm of arsine feed during epitaxial growth, adjusted relative to indium and gallium precursor flow
    • Ratio fine-tuned per wafer run for precise spectral properties

    Downstream process integration

    • Automated delivery to horizontal or vertical epitaxy reactors in sensor foundries
    • Used during low-pressure or metalorganic CVD steps for passivation and interface management

    Final product types

    • SWIR photodiode arrays for imaging
    • Military and scientific infrared detectors
    • Hyperspectral sensors for industrial and remote sensing

    5. III-V Laser Diode and LED Wafer Production

    Laser and LED wafer foundries employ arsine to grow arsenide-based active layers within optoelectronic devices. Exact precursor dosing and minimization of impurity states are critical to device efficiency, wavelength stability, and longevity, with downstream makers imposing strict traceability from input gas batches to final die performance.

    Industry compliance standards

    • SEMI E49.4: Safety and Environmental Practice for Metalorganic Gases
    • IEC 60825: Laser Product Safety
    • ISO 14644-1: Cleanroom Classification and Monitoring

    Typical usage ratio

    • 0.1–0.3 sccm in alloying with indium and gallium organometallics, depending on device targeted output (650nm-1550nm)
    • Inter-batch adjustment based on emission wavelength and intended application

    Downstream process integration

    • Direct line input to MOVPE and MBE cluster tools during multiple quantum well (MQW) and barrier growth
    • Controlled shutoff and purge sequencing for safe transition between production runs

    Final product types

    • FP and DFB laser diode chips for telecom
    • VCSEL and high-power IR LED dies
    • Laser wafer substrates for medical and industrial cutting tools
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    Certification & Compliance
    More Introduction

    Understanding Arsine: Product Insights from a Chemical Manufacturer

    What Sets Arsine Apart

    In the world of specialty gases, few substances demand as much respect and technical precision as arsine. Over the years running production lines and managing strict control protocols, we've learned that arsine is not a material you take lightly. Unlike more mundane gases, arsine doesn’t forgive poor handling. What truly stands out is its unique combination of chemical properties and the vital niche it serves in high-tech industries.

    Arsine gas, chemically known as AsH3, is a colorless, highly toxic, and flammable compound. Its most notable feature is its extraordinary reactivity and ability to act as a dopant—contributing arsenic atoms in semiconductor fabrication. There are other options out there for doping, like phosphine or silane, but none of them deliver the same sharp, reliable performance for some III-V compound semiconductors seen in optoelectronics.

    Proven Quality in Every Cylinder

    As a manufacturer, we recognize how every batch must satisfy two unforgiving masters: our internal quality benchmarks and the regulations that govern hazardous material. Purity stands as the single most critical characteristic for users in compound semiconductor manufacturing and integrated circuit design. We produce arsine at specifications touching 99.999 percent purity—or higher—because even the slightest impurity can jeopardize million-dollar equipment and compromise wafer yields. Removal of oxygenated impurities, water, and hydrocarbons takes center stage in each production run.

    Trace analysis isn’t left to convenience. With modern gas chromatography and moisture measurement, our technical team confirms purity every step of the way. We designed our cylinder filling area and purification columns based on lived experience with contamination risks and bottlenecked delivery schedules. Feedback from customers led us toward designing safer, tamper-proof valve systems, and we switched to corrosion-resistant cylinder materials after early issues with valve degradation.

    Why the Semiconductor Industry Trusts Arsine

    Much of the demand for arsine comes from the semiconductor industry. Over decades, we have seen the technology shift from basic microprocessors to highly integrated photovoltaics and LEDs. Each shift raised the stakes: higher circuit densities, tinier features, more demanding purity specs. Arsine serves a vital role in metal-organic chemical vapor deposition (MOCVD) and molecular beam epitaxy processes, especially for producing gallium arsenide, indium gallium arsenide, and related alloys vital for high-speed transistors, laser diodes, and solar cells.

    We’ve watched as customers wrestle with tighter devices, and we observed firsthand how small fluctuations in gas quality triggered unexpectedly high defect rates in batches worth hundreds of thousands of dollars. Our efforts to reduce moisture and oxygen content below parts-per-billion levels come from this real-world pressure to deliver stable, flawless materials—the kind that keeps yield losses to a minimum and maintains a competitive edge. Substitutes such as trimethylgallium can shift certain aspects of the profile, but only true arsine provides atomic-level incorporation of arsenic critical to compound semiconductor performance.

    Handling and Delivery: Lessons from the Field

    We wouldn’t wish a gas leak or accidental exposure upon anyone. Arsine is notorious for its acute toxicity—trace amounts in air can create dangerous exposure situations. That knowledge marks every stage of our process design. Years back, an incident with a minor fitting leak forced us to redesign cylinder transportation protocols and venting connections, moving away from basic valve hardware to fail-safe systems that integrate double containment and real-time monitoring.

    Shipping and storage get no shortcuts. We oversee the entire journey of every cylinder, from production floor to customer site. After a hard-earned lesson with temperature control, we invested in dedicated cooled storage zones and specialized insulated carriers. Each improvement owes more to hard experience than theory; the headache of a returned, compromised cylinder sticks longer than the memory of a well-executed delivery.

    Contrasts with Other Dopant Gases

    Many customers ask why arsine, with all its hazards, still dominates certain sectors. The comparison to phosphine or diborane often surfaces. Arsine deposits arsenic atoms with precision unmatched by these peers when making n-type GaAs or InGaAs. Substitute gases generally fail to deliver equivalent electrical characteristics, device performance, or defect control. Some metalorganic sources provide indirect alternatives, but their use may introduce more carbon or alter device reproducibility.

    Cost and safety concerns sometimes push research teams to experiment with alternative dopants. Our internal data and the industry’s published reports demonstrate that process integration runs most smoothly when sticking with the tried-and-tested AsH3 stream. Lateral substitutions often force requalification work, introduce new variables in wafer results, and raise more questions than they answer. Many long-timers in this business recall failed attempts to eliminate arsine, usually leading to stunted pilot runs and last-minute sourcing of high-purity gas.

    Designing Systems for Safety and Control

    We started as a small batch supplier, tinkering with manual controls and basic leak checks. Experience taught us the value of systematic gas detection and rapid emergency shutdown. Modern facilities run distributed gas sensors and interlock systems calibrated specifically for arsine. There’s no substitute for hands-on drills and well-trained staff. During quarterly safety audits, we simulate device failures and leak scenarios using real detection hardware, and our customer support teams walk through evacuation plans regularly.

    Packaging improvements also make a difference. Customers sometimes underestimated valve maintenance, which sparked us to build predictive maintenance schedules for each cylinder fleet. We monitor cycle lives and valve performance with electronic tracking, drastically reducing unexpected failure rates. Some users insisted on advanced pressure regulators and excess-flow valves, which yielded a direct drop in incident reports. Experiencing the consequences of a slow valve leak once led us to introduce color-coded, high-visibility safety shrouds as a standard feature.

    Regulatory and Environmental Responsibilities

    Working with arsine exposes everyone to intense scrutiny. Our team stays in constant dialogue with environmental and occupational health agencies. Compliance with local and regional reporting has developed from a paperwork burden into a routine expectation. Regulations changed the way we calculate release scenarios and storage limits, and those rules forced us to invent new ways of containing and scrubbing arsine by-products.

    We participate in industry coalitions to track emerging regulatory frameworks, especially where atmospheric release thresholds or carcinogenicity classifications evolve. Over the past decade, we've had to re-engineer entire venting systems and add redundancy to scrubber units. Drawing on collaborations with academic partners, we've introduced catalyst beds capable of trapping and safely converting any vented traces during cylinder changeovers. Careful, routine monitoring gives us fast data and confidence that operational releases stay beneath permitted thresholds.

    Continuous Process Optimization

    Aging infrastructure doesn’t mesh with high-purity production. Each year, we commit budget to updating purification trains, retesting valve designs, and improving analytical capabilities. Market demand never pauses, so equipment upgrades happen during tightly choreographed shutdowns. Older systems lacked the finesse required for parts-per-billion spec work. Outdated traps or valves introduced sulfur or organic contamination that cost us more in rejected batches than the upfront price of modern equipment. Lessons like these shaped our drive toward in-house R&D for updated getters and oxide scavengers, and in recent years, these investments paid dividends in more consistent output.

    Raw material sourcing requires its own vigilance. Early supply chain hiccups forced us to vet and qualify multiple arsenic sources, monitoring each batch for trace metals or residual acids. At one stage, a single shipment outside spec led to a full review of supplier selection and contractual quality penalties. We keep tight records and regularly review supplier performance based on actual delivered results. This transparency pays off, earning trust from manufacturing partners down the line who depend on reliable, unbroken deliveries for their own critical process windows.

    Worker Safety and Ongoing Training

    Our most valuable equipment doesn’t sit out back in steel vessels—it’s the human expertise honed by years in the plant. Recruiting experienced gas handlers isn’t easy, and retaining them means investing in continuous training. We host annual refresher courses with external hazard experts and require new technicians to shadow seasoned operators. Two generations of know-how mean that best practices aren’t just written into SOPs—they’re lived out every day. Everyone on our team carries immediate-access detection badges, and we encourage a culture where near-misses get reported and addressed, not brushed under the rug.

    A couple of close calls sharpened our approach to personal protective equipment and incident response. Building a safety culture took time. We provide regular hands-on practice with real-life leak simulations, cylinder changes, and emergency shutoffs. This approach built confidence and minimized hesitation during real incidents. Employees know the risks and the reasons for each protocol—and they trust the process because they helped shape it.

    Keeping Up with Technology and Market Change

    Semiconductor fabrication looks nothing like it did twenty years ago. We adapt to shifting requirements by collaborating with tool makers and chip designers. Stakeholders in optoelectronics and high-frequency fields reach out for insights, asking for tweaks to delivery specs and help with precise flow control. In our experience, working hand-in-hand with end users revealed practical improvements in manifold integrity and gas blending approaches. We take pride in being upstream of innovation: contributing gas knowledge to early-stage wafer design, supporting R&D teams testing new process windows, and troubleshooting flow anomalies before they create scrap wafers.

    Customers sometimes aim to scale pilot lines to high-volume production, and we guide them as they scale storage volume, upgrade sensor arrays, and shift to automated delivery systems. Demand spikes from emerging photonics or new wireless chipsets drive us to rethink capacity limits and distribution routes. Every change brings a challenge, but building adaptability into our planning and production routines keeps us competitive.

    Listening to the End User

    Feedback isn’t a one-way street. Over the years, we’ve adjusted purification methods because of regular conversations with process engineers who knew exactly how a syringe of suspect material could knock an entire run offline. Once, an alert engineer at a partner fab flagged an off-smell during carrier gas blending—a heads-up that forced us to identify invisible hydrocarbon carryover. Since then, we emphasized real-world user feedback in our root-cause analysis and implemented redundant analytical checks.

    We don’t market solutions we don’t believe in. Customers return if they see us listen and act on their real concerns, not just sell them the same cylinder year after year. This kind of relationship works both ways; we learn new applications and processing trends, and customers get safer, more reliable products that fit their sharply defined needs.

    Addressing Tomorrow’s Challenges

    The world asks for cleaner energy, faster computers, and ever-smaller optics. Each new device generation raises the stakes and brings regulatory, technical, and supply chain hurdles. We see a need for higher-volume, fully automated gas systems and smarter track-and-trace integration. Modern facilities request real-time remote telemetry and predictive maintenance, pressing us to retool and upgrade our embedded sensors and cylinder tagging. Avoiding downtime and trace contamination keeps us focused on new hardware, while advances in analytical instrumentation refine our ability to guarantee every shipment meets tighter and tighter specs.

    Pressure from environmental regulations won’t ease up, so we invest in low-impact scrubbing and recovery systems. Building an internal culture of innovation—teaming up with universities, collaborating with engineering partners, and encouraging field-level problem-solving—helps us keep up with changing requirements and balance best-in-class purity with process and environmental safety.

    Arsine’s Place in a High-Tech Future

    After decades in this field, we see arsine as an essential workhorse for the production of advanced semiconductors and specialized electronics. Few alternatives measure up to its performance in depositing arsenic for high-mobility, high-frequency, and optoelectronic devices. Handling and supplying arsine demands more investment in safety, oversight, and technical collaboration than many specialty gases, but the payoff appears at each node of the innovation chain.

    We believe that the trust built with end users, the relentless focus on process improvement, and the knowledge we gain from handling risks head-on make arsine more than just a chemical—these efforts ensure that developing tomorrow’s technologies won’t get held back by unreliable supply or unforeseen hazards. Our team stands committed to pushing forward, adapting to new demands, and sharing the lessons only a manufacturer can know.