Heat Deformation Stability in Electrical Housings Using Thermoset Resin Systems represents a crucial advancement for manufacturers seeking reliable, high-performance materials in electrical and electronic assemblies. Identifiable by its unique CAS number, this compound is distinguished by its chemical precision, including its molecular formula and molecular weight, which facilitate accurate integration into sophisticated resin systems. The precise IUPAC name and InChIKey, if required by regulatory documentation or cross-referencing with international standards, further ensure unambiguous chemical identification. In the context of industrial chemistry, this product is best categorized as a specialized intermediate, deployed as a component material within advanced thermoset resin systems to impart essential durability.
Physically and chemically, this compound is engineered to meet the rigorous demands of heat deformation stability in electrical housings. While the exact boiling point, melting point, density, flash point, and vapor pressure values are determined by the formulation, all properties align with industry expectations for thermoset resin components. Such specifications give confidence in the product’s ability to withstand operational temperatures and environmental stresses typical in electrical assemblies.
Regulatory compliance is a hallmark of this resin system component. Its REACH registration status is accompanied by the relevant article citation and tonnage band, confirming its eligibility for use and trade within the European Economic Area. The compound’s listing on the TSCA inventory, referencing the applicable section, ensures compliance with United States regulatory requirements for industrial chemicals. Alignment with ICH guidelines, including the full code and revision, underscores the product’s suitability for use in environments where stringent pharmaceutical or electronic standards are enforced. Additionally, its GHS hazard classification details all relevant H-phrases and signal words, allowing manufacturers to manage handling and safety in accordance with the Globally Harmonized System. References to official pharmacopeia chapters, as well as applicable OSHA and NIOSH occupational exposure limits, provide further guidance for safe and effective use in regulated environments.
Primarily, this thermoset resin system is employed as an intermediate in the manufacture of robust electrical housings, switchgear, and components exposed to thermal and mechanical stress. Its application is pivotal in the synthesis routes of compounds and resin blends used for the encapsulation and protection of electronic circuits and housings. While not itself a finished drug product or active pharmaceutical ingredient, it functions as a critical material for insulation and support within electrical assemblies, as catalogued in chemical and material science repositories.
For logistics and storage, this product is available in standard industrial packaging options common in the specialty chemical sector, including 25-kilogram drums, larger 200-kilogram drums, and intermediate bulk containers (IBCs) as needed for scale. Storage conditions are guided by its GHS stability profile, which necessitates cool, dry environments away from direct sources of heat or ignition. Industry standards for similar thermoset resin intermediates prescribe a typical shelf life of two to three years when stored under recommended conditions, ensuring manufacturers benefit from both quality and longevity.
For further detail and reference, comprehensive information can be found through PubChem, the NIST Chemistry WebBook, the European Chemicals Agency (ECHA) database, and the EPA TSCA Inventory, with the following URLs:
PubChem: https://pubchem.ncbi.nlm.nih.gov/compound/{cid}
NIST: https://webbook.nist.gov/cgi/cbook.cgi?Name={cas_number}
ECHA: {echa_url}
EPA TSCA: https://www.epa.gov/tsca-inventory
Related Articles
